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http://dx.doi.org/10.7779/JKSNT.2017.37.2.106

Active Infrared Thermography for Visualizing Subsurface Micro Voids in an Epoxy Molding Compound  

Yang, Jinyeol (Test and Package Center, Samsung Electronics)
Hwang, Soonkyu (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology)
Choi, Jaemook (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology)
Sohn, Hoon (Department of Civil and Environmental Engineering, Korea Advanced Institute of Science and Technology)
Publication Information
Journal of the Korean Society for Nondestructive Testing / v.37, no.2, 2017 , pp. 106-114 More about this Journal
Abstract
This paper presents an automated subsurface micro void detection technique based on pulsed infrared thermography for inspecting epoxy molding compounds (EMC) used in electronic device packaging. Subsurface micro voids are first detected and visualized by extracting a lock-in amplitude image from raw thermal images. Binary imaging follows to achieve better visualization of subsurface micro voids. A median filter is then applied for removing sparse noise components. The performance of the proposed technique is tested using 36 EMC samples, which have subsurface (below $150{\mu}m{\sim}300{\mu}m$ from the inspection surface) micro voids ($150{\mu}m{\sim}300{\mu}m$ in diameter). The experimental results show that the subsurface micro voids can be successfully detected without causing any damage to the EMC samples, making it suitable for automated online inspection.
Keywords
Active Infrared Thermography; Subsurface Micro Void Detection; Baseline-Free Void Visualization; Epoxy Molding Compound; Extreme Value Statistics; Binary Imaging; Online Inspection;
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