• Macromolecular Research
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• v.12 no.1
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• pp.78-84
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• 2004

Advanced epoxy molding compounds (EMCs) should be considered to alleviate the thermal stress problems caused by low thermal conductivity and high elastic modulus of an EMC and by the mismatch of the coefficient of thermal expansion (CTE) between an EMC and the Si-wafer. Though A1N has some advantages, such as high thermal conductivity and mechanical strength, an A1N-filled EMC could not be applied to commercial products because of its low fluidity and high modules. To solve this problem, we used 2-$\mu\textrm{m}$ fused silica, which has low porosity and spherical shape, as a small size filler in the binary mixture of fillers. When the composition of the silica in the binary filler system reached 0.3, the fluidity of EMC was improved more than twofold and the mechanical strength was improved 1.5 times, relative to the 23-$\mu\textrm{m}$ A1N-filled EMC. In addition, the values of the elastic modules and the dielectric constant were reduced to 90％, although the thermal conductivity of EMC was reduced from 4.3 to 2.5 W/m-K, when compared with the 23-$\mu\textrm{m}$ A1N-filled EMC. Thus, the A1N/silica (7/3)-filled EMC effectively meets the requirements of an advanced electronic packaging material for commercial products, such as high thermal conductivity (more than 2 W/m-K), high fluidity, low elastic modules, low dielectric constant, and low CTE.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.25 no.10
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• pp.966-982
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• 2014

This paper presents recent trends in system-level EMC investigation and countermeasure technology for radio frequency interference (RFI) influenced by noise generated in high-speed digital system. Recently, as the only digital device can perform various roles, there are a variety of EMI/EMC problems between systems. Especially, RFI is now recognized as a major problem, which occurs by EMI caused by the digital system. Therefore, in this paper, recent trends of RFI investigation from component-level to system-level are introduced and analyzed. Furthermore, in order to solve the RFI problem, recent researches are presented and investigated for the occurrences and suppression methods of common-mode noise which is one of the major noise sources in high-speed digital system. Lastly, this paper suggested future research of system-level EMC analysis and countermeasure technology for RFI problems.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.41-48
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• 1999

Silica is the most popular materials as a filler of EMC for microelectronic packaging. However, because of its low thermal conductivity, the use of silica is restricted to parts requiring high thermal dissipation. The superior fluidity of EMC can be achieved with a combination of filler size distribution. In this study, physical properties of EMC filled with the crystalline silica(13$\mu\textrm{m}$) which have high fluidity and low cost and the AlN(2 $\mu\textrm{m}$) which have high thermal conductivity and low coefficient of thermal expansion were evaluated by changing the AlN/silica ratios. As a result of the evaluation of physical properties of EMC, the optimum mixing ratio of AlN/crystalline silica was 0.3/0.7. In this condition, binary mixture(AlN/crystalline silica) filled EMC showed superior properties, i.e., in the thermal conductivity, CTE, dielectric constant, flexural strength, and thermal shock resistance without reduction of fluidity.

• Composites Research
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• v.34 no.1
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• pp.47-50
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• 2021

In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

• Journal of IKEEE
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• v.25 no.4
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• pp.591-597
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• 2021

This paper proposes an EMC-aware PCB design method to reduce electromagnetic emission, where trace length and teturn path of critical signal are shortened by changing chip location and trace layout on the PCB, while additional filters or decoupling capacitors are not required. In the proposed method, signal velocity is calculated for various signals on the PCB. Critical signal with the fastest signal velocity is determined and its return path is shortened as much as possible by placing chip location and trace routing first. Return path of critical signal should be carefully designed not to have discontinuity. Power plane and ground plane should be carefully designed not to be divided, since these planes are the reference of return path. The proposed method was applied to automotive directional Bluetooth speaker which failed to pass CISPR 32 and CISPR 25 EMC tests. Its PCB was redesigned based on the proposed method and it easily passed the EMC tests. The proposed method is useful to EMC-sensitive electronic equipments.

• 전자공학회논문지 IE
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• v.43 no.4
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• pp.83-92
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• 2006

EMC(epoxy moulding compound) when operate with residual quantity processing after fixed quantity moulding inverse close way of designing by mechanical action inhalation so that may occur, solved of needle tip residual quantity and cause of thread extend phenomenon. In this paper, design to connect directly gun, washer tank and measuring beforehand amount that washing is easy and want minuteness fixed quantity that essential equipment in semi-conductor packaging process because develop EMC so that can molding with high speed consider.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2003.11a
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• pp.319-323
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• 2003

본 논문은 누전차단기의 충격파 부동작 특성과 전자기적합성(EMC) 특성비교에 관한 것이다 국내 규격에서는 충격파 부동작 성능만 확인하지만 국제규격에서는 많은 EMC 항목이 있다. 누전차단기 17종에 대하여 EMC 4항목을 실시한 결과, IEC 61000-4-5에 따른 조합서지 내성에서 9종이 불량이었다. 다른 항목에서는 불량이 발생하지 않았다. 오동작만 발생한 시료 2종에 대하여 충격파 부동작 성능을 평가한 결과 오동작이 발생하지 않았다. 이것으로 보아 EMC와 충격파 부동작 시험은 상관관계가 적으며 보완이 필요함을 알 수 있다.

• Environmental Engineering Research
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• v.13 no.4
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• pp.184-191
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• 2008

Long term monitoring was conducted to investigate a surface runoff of pollution from urban highway. The monitoring data was collected for 18 rainfall events and was used to correlate pollution load to various parameters, such as rainfall intensity, antecedent dry days and total discharge flow. Runoff coefficient and seasonal variation were also evaluated. The mean runoff coefficient of the highway was 0.823(range; $0.4687{\sim}0.9884$), and wash-off ratio for $COD_{Mn}$ and SS loads was 72.6% and 64.3%, respectively. For the initial rainfall event, the runoff EMC of $COD_{Mn}$ was high in summer and the EMC of SS was high in autumn season. However the seasonal variation of T-N and T-P was not significant. The discharged $COD_{Mn}$-EMC was $147.6\;mg/L{\sim}9.0\;mg/L$ on the generated $COD_{Mn}$-EMC of $98.8\;mg/L{\sim}8.9\;mg/L$. While the generated EMC of SS was in $285.7\;mg/L{\sim}20.0\;mg/L$ and its discharged EMC was in $190.4\;mg/L{\sim}8.0\;mg/L$. EMC of pollutants was not directly related to the first flush rainfall intensity and the antecedent dry days. But the correlation was relatively high between EMC and cumulative runoff flow volume. The trend of EMC was reduced with the cumulative runoff flow volume.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• v.29 no.1
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• pp.141-146
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• 2005

Recently, the accidents on the sea have arisen due to the increase of the nautical traffic and the digitization of equipments for marine. Therefore, IMO(International Maritime Organization) have provided the recommendation of EMI and EMS for radio communication and equipments of marine from SOLAS cobvention at July 1st 2002. In this paper, we measured EMC environment on the HANBADA, which is Korea Maritime University training ship, for basic EMC environment of a ship. The measuring point was Bridge and Engine Control Room of the ship, we measured the test point that was set at random. Measured Band is from 30 MHz to 2 GHz, polarization measurement is processed both vertical and horizontal polarizaion. We analysed the results in consideration of permissible criteria.

• Journal of the Korean Wood Science and Technology
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• v.42 no.6
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• pp.653-658
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• 2014

This research was carried out to investigate equilibrium moisture content (EMC) of wood in outdoor locations in Korea. EMC was calculated using Hailwood-Horrobin equation for 73 different locations in Korea using the 1981 to 2010 climate normal data obtained from the Korea Meteorological Admnistration (KMA). Daegu showed the lowest values of EMC (11.5), and the highest EMC values (15.8) was found in Heuksando. Considering the season effect, summer (June, July, August) showed the highest values 15.3, followed by autumn (September, October, November) 13.7, winter (December, January, February) 12.2, and spring (February, March, April) 12.0. Monthly EMC showed the lowest values 11.6 in April and July showed the highest EMC values 16.1. The smallest changes in monthly EMC were found in Jeju island and Heuksando showed the largest values 8.7. A proper wood drying based on average EMC is more required in the regions with larger variation in EMC.