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A Study on the Semi-conductor Package Process Epoxy Moulding Compound Gun  

Cho, Myung-Hyun (Seoil College Dept. Electrical Engineering)
Kim, Gyu-Sung (Seoil College Dept. Automobile Engineering)
Publication Information
전자공학회논문지 IE / v.43, no.4, 2006 , pp. 83-92 More about this Journal
Abstract
EMC(epoxy moulding compound) when operate with residual quantity processing after fixed quantity moulding inverse close way of designing by mechanical action inhalation so that may occur, solved of needle tip residual quantity and cause of thread extend phenomenon. In this paper, design to connect directly gun, washer tank and measuring beforehand amount that washing is easy and want minuteness fixed quantity that essential equipment in semi-conductor packaging process because develop EMC so that can molding with high speed consider.
Keywords
EMC(epoxy moulding compound); thread extend phenomenon; needle tip; gun; packaging;
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