• Composites Research
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• v.34 no.1
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• pp.47-50
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• 2021

In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Journal of the Semiconductor & Display Technology
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• v.20 no.4
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• pp.62-67
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• 2021

In this study, we have successfully developed an unique NVIS Green A compatible LED by combining two technologies. One is white LED made with a black EMC (epoxy molding compound) lead frame. The other is NVIS Green A filter that shields the near infrared region made in the film method. The form factor of the developed NVIS Green A compatible LED was 2.0 × 2.0 × 0.95 mm. And it is possible to satisfy NVIS radiance and color limit specified in MIL-STD-3009 by controlling the concentration of Green A dye and the thickness of the NVIS filter as well as adjusting of color temperature of the white LED. From these results, we are expected that the developed NVIS Green A suitable LED is a promising solution for the weight reduction and the cost reduction of avionic applications.

• Proceedings of the Korea Inteligent Information System Society Conference
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• 2001.01a
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• pp.224-229
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• 2001

When a semiconductor package is assembled, various materials such as die attach adhesive, lead frame, EMC (Epoxy Molding Compound), and gold wire are used. For better preconditioning performance, the combination between the packaging materials by studying the compatibility of their properties as well as superior packaging material selection is important. But it is not an easy task to find proper packaging material sets, since a variety of factors like package design, substrate design, substrate size, substrate treatment, die size, die thickness, die passivation, and customer requirements should be considered. This research applies case-based reasoning(CBR) technique to solve this problem, utilizing prior cases that have been experienced. Our particular interests lie in building decision support model to aid the selection of proper die attach adhesive. The preliminary results show that this approach is promising.

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.72-72
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• 2003

전기 및 전자산업의 발달과 더불어 규석 관련 제품에 대하여 고기능성 초미립 분말이 요구되고 있으며, 한편으로는 취급과 활용성이 우수한 형상인 구형 분말을 요구하고 있다. 본 연구에서는 평균 입도 1.0$\mu\textrm{m}$이하의 규석 초미립 분말 제조기술 개발과 유기용매 및 계면활성제 등을 첨가하여 형상이 구형인 기능성 분말과 항균, 항곰팡이 효과가 우수한 교질 상태의 실리카를 제조하여 기능성 재료 및 코팅용 실란 등에 활용이 가능하도록 물리적 단순공정을 통하여 평균 입도 1.0$\mu\textrm{m}$이하의 초미립 규석분말을 제조함으로써 고무, 타이어, 토너, 도료, EMC(epoxy molding compound) 등의 충전제, 이형제, 연마재 등으로 활용이 가능하게 하였으며 제조된 규석 초미립 분말은 분산성이 양호하도록 spray dryer 방법으로 건조하여 각 제품에 알맞은 적용이 용이하도록 하였다.

• Nuclear Engineering and Technology
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• v.38 no.5
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• pp.423-426
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• 2006

A developed neutron activation analysis(NAA) and gamma-spectrometry were applied to improve the analytical sensitivity and precision of impurities in electronic-circuit raw materials. It is well known that soft errors in high precision electronic circuits can be induced by alpha particles emitted from naturally occurring radioactive impurities such as U and Th. As electronic circuits have recently become smaller in dimension and higher in density, these alpha-particle emitting radioactive impurities must be strictly controlled. Therefore, new NAA methods have been established using a HTS(Hydraulic Transfer System) irradiation facility and a background reduction method. For eliminating or stabilizing fluctuated background caused by Rn-222 and its progeny nuclides in air, a nitrogen purging system is used. Using the developed NAA and gamma-spectrometry, ultra trace amounts of U(0.1ng/g) and Th(0.01ng/g) in an alumina ball and high purity silica used for an epoxy molding compound (EMC) could be determined.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.315-324
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• 2001

Mechanochemical effects that occurred in the fine grinding process of quartz particles using planetary ball mill was investigated. Quartz particles have been frequently utilized for optical materials, semiconductor molding materials. We determined that grinding for a long time can be create amorphous structures from the crystalline quartz by Mechanochemical effects. But, to be produced nano-composite particles that the critical grinding time reached for composite materials in a short time. Henceforth, a qualitative estimation must be conducted on the filler for EMC(Epoxy molding compound) materials. It can be produced mechanochemically treated composite materials and also an integrated grinding efficiency considering of the nano-composite amorphous structured particles. The mechanochemical characteristics were evaluated based on particle morphology, size distribution, specific surface area, density and the amount of amorphous phase materials into the particle surface. The grinding operation in the planetary ball mill can be classified into three stages. During the first stage, initial particle size was reduced for the increase of specific surface area. In the second stage, the specific surface areas increased in spite of the increase in particle size. The final stage as a critical grinding stage, the ground quartz was considered mechanochemically treated particles as a nano- composite amorphous structured particles. The development of amorphous phase on the particle surface was evaluated by X-ray diffractometry, thermal gravity analysis and IR spectrometer. The amount of amorphous phase of particles ground for 2048 minutes was 85.3% and 88.2% by X-ray analysis and thermal gravity analysis, respectively.

• Journal of Adhesion and Interface
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• v.14 no.3
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• pp.135-145
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• 2013

Epoxy resin compositions were studied on the view of self-extinguishing properties without retardant additives and suitability as materials of eco-friendly EMC (Epoxy molding compound). Cured epoxy and phenolic resin composition having conjugated double bond of aromatic structure exhibited self-extinguishing properties and low heat release capacity. In this study, the structure of long conjugated double bond of hetero-atom type azomethyne group between conjugated double bonds of aromatic structure showed lower heat release capacity. Low heat release capacity seemed to be related with high reaction enthalpy, $T_g$ and reactivity affected by hetero-atom structure in azomethyne group.

• Proceedings of the IEEK Conference
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• 2001.10a
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• pp.705-710
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• 2001

So for the quartz-glassy crucible wastes which was used for pulling up silicon-single-crystal ingot have simply reused for refractory raw-materials, or exhausted. This study is concerned on the advanced recycling-technology that is obtained by the proper micro-particle preparation process in order to fabricate fine amorphous silica filler for EMC (Epoxy Molding Compound). Therefore, this paper will deal with the physical, chemical and thermal pre-treatment process for efficient impurity removal and with the proper micro-particle process for producing the amorphous silicafiller. In view of the results, if the chemical, physical and thermal pre-treatment process for efficient elimination of impurity was passed, the purity of wasted fused glassy crucible is almost equal to the its of first anhydrous quartz glass. Thus, it was understood that this wasted fused glassy crucible was sufficient value of recycling, though it was damaged. When the ingot was fabricated, Phase transformation of crystallization by heat treatment (heat hysteresis phenomenon) was not changed. So, it was understood that as fused silica in the amorphous state, as It is, recycling possibility was very high

• Journal of Power Electronics
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• v.13 no.6
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• pp.1080-1089
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• 2013

In this paper, the superposition principle of a heat sink temperature rise is verified based on the mathematical model of a plate-fin heat sink with two mounted heat sources. According to this, the distributed coupling thermal impedance matrix for a heat sink with multiple devices is present, and the equations for calculating the device transient junction temperatures are given. Then methods to extract the heat sink thermal impedance matrix and to measure the Epoxy Molding Compound (EMC) surface temperature of the power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) instead of the junction temperature or device case temperature are proposed. The new thermal impedance model for the power converters in Switched Reluctance Motor (SRM) drivers is implemented in MATLAB/Simulink. The obtained simulation results are validated with experimental results. Compared with the Finite Element Method (FEM) thermal model and the traditional thermal impedance model, the proposed thermal model can provide a high simulation speed with a high accuracy. Finally, the temperature rise distributions of a power converter with two control strategies, the maximum junction temperature rise, the transient temperature rise characteristics, and the thermal coupling effect are discussed.