• 제목/요약/키워드: ELID grinding

검색결과 61건 처리시간 0.026초

MLCC 적층용 진공척의 자기연마와 ELID연삭을 이용한 미세버 제거 기술 (Deburring Technology of Vacuum Plate for MLCC Lamination Using Magnetic Abrasive Polishing and ELID Process)

  • 이용철;신건휘;곽태수
    • 한국기계가공학회지
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    • 제14권3호
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    • pp.149-154
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    • 2015
  • This study has focused on the deburring technology of a vacuum plate for MLCC lamination using electrolytic in-process dressing (ELID) grinding, and the magnetic-assisted polishing (MAP) process. The surface of the vacuum plate has many micro-holes for vacuum suction. They are easily blocked by the burrs created in the surface-flattening process, such as the conventional grinding process. In this study, the MAP process, the ELID grinding process, and an ultrasonic vibration table are examined to remove the micro-burrs that lead to the blockage of the holes. In the results of the experiments, the MAP process and ELID grinding technology showed significant improvements of surface roughness and deburring performance.

로타리 연삭에 의한 대직경 Si-wafer의 ELID 경면 연삭특성 (Characteristic of Mirror Surface ELID Grinding of Large Scale Diametrical Silicon Wafer with Rotary Type Grinding Machine)

  • 박창수;김원일;이윤경;왕덕현;김경년
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 춘계학술대회 논문집
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    • pp.660-665
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    • 2002
  • Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of grinding wheel in the in-feed machining method. In this study, grinding experiments by the rotary surface grinding machine with straight type wheels ware conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding n/c equipment with an ELID wit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2 - 6 nm in Ra.

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ELID 경면 연삭 가공된 티타늄 표면의 세포 활성도 (Cell Activity of ELID-Machined Titanium Surface)

  • 강종호;이명현;서원선;이석원;곽태수;최헌진
    • 한국기계가공학회지
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    • 제11권3호
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    • pp.13-18
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    • 2012
  • We investigated the cell activity of controlled titanium surface using various grinding methods including ELID (Electrolytic In-Process Dressing) grinding method. The influence of titanium surface condition by each grinding process on the cell activity was evaluated by ALP activity of MSC(Mesenchymal Stem Cells). The ALP activity of controlled surface by ELID grinding process using # 2000 wheel was higher than that of other titanium surface. The morphological, chemical properties of machined surface by grinding method was observed using various analytical method.

평면연삭반에서 난삭재의 ELID연삭 (ELID Grinding of Hard-To-Machine Materials on Surface Grinder)

  • 김경년
    • 한국정밀공학회지
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    • 제18권5호
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    • pp.157-164
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    • 2001
  • The grinding for hard-to-machine materials, such as ceramics, super alloys etc., has proven to be a very difficult and consuming process utilizing ordinary methods. In order to conduct high efficiency machining of such materials, grinding processes using metallic bond diamond wheels and applying electrolytic in-process dressing(ELID) have been attempted on a surface grinding machine. In this study, the effects of grinding parameters, and grit sizes have been evaluated in view of surface roughness, grinding force as well as step difference in simultaneous grinding of different materials. The study and experimental results are presented in this paper.

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In-process Truing of Metal-bonded Diamond Wheels for Electrolytic In-process Dressing (ELID) Grinding

  • Saleh, Tanveer;Biswas, Indraneel;Lim, Han-Seok;Rahman, Mustafizur
    • International Journal of Precision Engineering and Manufacturing
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    • 제9권3호
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    • pp.3-6
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    • 2008
  • Electrolytic in-process dressing (ELID) grinding is a new technique for achieving a nanoscale surface finish on hard and brittle materials such as optical glass and ceramics. This process applies an electrochemical dressing on the metal-bonded diamond wheels to ensure constant protrusion of sharp cutting grits throughout the grinding cycle. In conventional ELID grinding, a constant source of pulsed DC power is supplied to the ELID cell, but a feedback mechanism is necessary to control the dressing power and obtain better performance. In this study, we propose a new closed-loop wheel dressing technique for grinding wheel truing that addresses the efficient correction of eccentric wheel rotation and the nonuniformity in the grinding wheel profile. The technique relies on an iterative control algorithm for the ELID power supply. An inductive sensor is used to measure the wheel profile based on the gap between the sensor head and wheel edge, and this is used as the feedback signal to control the pulse width of the power supply. We discuss the detailed mathematical design of the control algorithm and provide simulation results that were confirmed experimentally.

초음파 테이블을 이용한 단결정 사파이어 웨이퍼의 ELID 연삭가공 특성 연구 (A Study on the ELID Grinding Properties of Single Crystal Sapphire Wafer using Ultrasonic Table)

  • 황진하;곽태수;이득우;정명원;이상민
    • 한국기계가공학회지
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    • 제12권4호
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    • pp.75-80
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    • 2013
  • Single crystal sapphire being used in high technology industry is a brittle material with a high hardness and excellent physical properties. ELID(Electrolytic In-Process Dressing) grinding technology was applied to material removal machining process of single crystal sapphire wafer. Ultrasonic vibration which added to material using ultrasonic table was adopted to efficient ELID grinding of sapphire materials. The evaluation of the ground surface of single crystal sapphire wafer was carried out by means of surface measuring by using AFM(Atomic Force Microscope), surface roughness tester and optical microscope device. As the results of experiment, it was shown that more efficient grinding was conducted when using ultrasonic table. In case of using #170 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was superior to ELID ground specimen without ultrasonic table. However, In case of using #2000 grinding wheel, surface roughness of ELID ground specimen in using ultrasonic table was inferior to ELID ground specimen without ultrasonic table.

Grinding Characteristic of Hard Disk Glass by Glass by ELLD Grinding

  • Kim, Gyung-Nyun;Hitoshi Ohmori
    • International Journal of Precision Engineering and Manufacturing
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    • 제1권2호
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    • pp.61-66
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    • 2000
  • In this paper, we discuss the machining characteristics of HDD glass. Glass is now being used globally as a data storage device, Such glasses are usually machined by lapping by this technique requires a long machining time, resulting in low productivity, For this reason, we examine the possibility of EILD grinding in HDD glass workpieces, A move to ELID grinding may result in substantial cost reduction. Our purpose is to investigate the grinding characteristics of HDD glass in ELID grinding. The bonding materials for fixing the abrasives of cast iron, cobalt and bronze are applied, and grinding conditions such as rotation speed and feeding are varied. Results show that with the use of ELID, mirror surfaces can be achieved with high efficiency.

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사파이어 웨이퍼의 ELID 랩핑 가공 특성에 관한 연구 (A Study on Characteristics of ELID Lapping for Sapphire Wafer Material)

  • 곽태수;한태성;정명원;김윤지;우에하라 요시히로;오오모리 히토시
    • 한국정밀공학회지
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    • 제29권12호
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    • pp.1285-1289
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    • 2012
  • This study has been focused on application of ELID lapping process for mirror-surface machining of sapphire wafer. Sapphire wafer is a superior material with optic properties of high performance as light transmission, thermal conductivity, hardness and so on. High effective surface machining technology is necessary to use sapphire as various usages. The interval ELID lapping process has been set up for lapping of the sapphire material. According to the ELID lapping experimental results, it shows that 12.5 kg of load for lapping is most pertinent to ELID lapping. the surface of sapphire can be eliminated by metal bonded wheel with micron abrasives and the surface roughness of 60 nmRa can be gotten using grinding wheel of 2,000 mesh in 4.5 um, depth of cut. In this study, the chemical experiments after ELID grinding also has been conducted to check chemical reaction between workpiece and grinding wheel on ELID grinding process. It shows that the chemical reaction has not happened as the results of the chemical experiments.

전해드레싱연삭에서 숫돌주속과 표면거칠기의 관계 (Relationships between Wheel Velocity and Surface Roughness in the Electrolytic In-Process Dressing(ELID) Grinding)

  • 차명섭
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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    • pp.459-464
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    • 2000
  • In this paper, it verifies the relationships between wheel velocity and surface roughness with the mirror surface grinding using electrolytic in-process dressing (ELID). In the general, as wheel velocity is high, surface roughness is better on the base of grinding theory. However, the relationships between wheel velocity and surface roughness is undefined due to the effect of electro-chemical dressing and the characteristics of materials. According to above relationships, ELID grinding experiment is carried out by following the change of wheel velocity. As the result of this study, it is found that surface roughness is not better as linearly as the increase of wheel velocity, but the limit of wheel velocity exists according to the characteristics of materials. Also, in contradiction to the present trend of high wheel velocity of manufacturing system for high surface integrity, it is able to expected to the base on the development of new ultra precision grinding method with the practicality of mirror surface grinding using ELID grinding method.

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