• Journal of Aerospace System Engineering
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• v.10 no.2
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• pp.1-6
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• 2016

The thermal analysis of electronic equipment is required to predict the reliability of electronic equipment being loaded on a satellite. The transient heat transfer of electronic equipment that was developed recently has been generated using a large-scale integration circuit. If there is a transient heat transfer between EEE(Electric, Electronic and Electro mechanical) parts, it may lead to failure the satellite mission. In this study, we performed the thermal design and analysis for reliability of APD(Antenna Pointing Driver) electronics for activation of a spaceborne X-band 2-axis antenna. The EEE parts were designed using a thermal mathematical model without the thermal mitigation element. In addition, thermal analysis was performed based on the worst case for verifying the reliability of EEE parts. For the thermal analysis results, the thermal stability of electronic equipment has been demonstrated by satisfying the de-rating junction temperature.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.32 no.9
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• pp.114-121
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• 2004

Thermal design changes and analysis on the engineering model of Command Telemetry Unit(CTU) for a geostationary communications satellite arc performed for the purpose of developing an engineering qualification model. A thermal model is developed by using power consumption measurement values of each functional board and thermal cycling test results. In modeling heat dissipated EEE parts, heat dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board. All the EEE parts of CTU meet the requirement of their allowable temperature range when placed on the engineering qualification level of thermal vacuum environments in accordance with the proposed thermal design changes.

• Clean Technology
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• v.14 no.4
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• pp.232-241
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• 2008

European directive DIRECTIVE 2002/96/EC requires minimum recycling & recovery rates on waste electrical and electronic equipment (WEEE). We tried to make references for recycling and recovery rates of parts and materials used in electrical and electronic equipment (EEE), which could be used to calculate recyclability and recoverability rates of a product in the development phase. First, we investigated recycling processes of WEEE and recycling and recovery characteristics of parts and materials. Based on the investigation results and the european recycling data, we made a data base of parts and materials for calculation of recycling and recovery rates of EEE. The developed DB was improved by reflecting advices of european experts.

• Journal of computational fluids engineering
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• v.11 no.2 s.33
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• pp.32-39
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• 2006

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is considered instead of conventional lumped capacity nodes. These modeling methods are applied to the thermal design and analysis of CTU EM and EQM and verified by thermal cycling and vacuum tests.

• 한국전산유체공학회:학술대회논문집
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• 2005.04a
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• pp.91-95
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• 2005

A heat dissipation modeling method of EEE parts is developed for thermal design and analysis of an satellite electronic equipment. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU and verified by thermal cycling and vacuum tests.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.4 s.235
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• pp.526-536
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• 2005

A heat dissipation modeling method of EEE parts, or semi-empirical heat dissipation method, is developed for thermal design and analysis an electronic equipment of geostationary satellite. The power consumption measurement value of each functional breadboard is used for the heat dissipation modeling method. For the purpose of conduction heat transfer modeling of EEE parts, surface heat model using very thin ignorable thermal plates is developed instead of conventional lumped capacity nodes. The thermal plates are projected to the printed circuit board and can be modeled and modified easily by numerically preprocessing programs according to design changes. These modeling methods are applied to the thermal design and analysis of CTU (Command and Telemetry Unit) and verified by thermal cycling and vacuum tests.

• Journal of Aerospace System Engineering
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• v.12 no.1
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• pp.57-67
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• 2018

The APD (Antenna Pointing Driver) is an electronic equipment tool that is used to drive the two-axis gimbal-type antenna for the image data transmission of CAS (Compact Advanced Satellite). In this study, a heat dissipation of EEE (Electrical, Electronic and Electromechanical) is reviewed, to identify the parts that directly affected its efficiency, lifetime as well as the reliability of the structure. This event eventually incurs a failure of the EEE part itself, or even the entire satellite system as noted in experiments in this case. To guarantee reliability of electronic equipment during the mission, the junction temperature of EEE parts is considered a significant and important design factor, and subsequently must be secured within the allowable range. Therefore, the notation of the thermal analysis considering the derating is indispensable, and a proper thermal mathematical model should be constructed for this case. In this study, the thermal design and thermal analysis are performed to confirm the temperature requirement of the APD. In addition, we noted that the validity of the thermal model, according to each of the identified modeling methods, was therefore compared through the thermal analysis utilized in this case.

• Bulletin of the Korean Space Science Society
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• 2006.10a
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• pp.144-144
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• 2006

• Bulletin of the Korean Space Science Society
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• 2004.10b
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• pp.270-273
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• 2004

The initial thermal analysis needs to be fast and efficient to reduce the feedback time for the optimal electronic equipment designing. In this study, a thermal model is developed by using power consumption measurement values of each functional breadboard, that is, semi-empirical power dissipation method. In modeling heat dissipated EEE parts, power dissipation is imposed evenly on the EEE part footprint area which is projected to the printed circuit board, and is called surface heat model. The application of these methods is performed in the development of a command and telemetry unit (CTU) for a geostationary satellite. Finally, the thermal cycling test is performed to verify the applied thermal analysis methods.

• Current Industrial and Technological Trends in Aerospace
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• v.6 no.1
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• pp.65-73
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• 2008

As the system requirements of performance, weight, cost are increasing, the needs of electronic parts which have high performance and efficiency are growing. To satisfy such requirements, demand of high performance and rapid upgraded commercial parts is also increasing compared to NASA or ESA standard parts. Especially, commercial PEM(Plastic Encapsulated Microcircuit) parts are applied in many space programs and research is continuing to broaden its application area. In this paper, concerns and verification trends of commercial PEM parts in space applications are introduced.