• Journal of Korean Society for Atmospheric Environment
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• v.13 no.3
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• pp.193-205
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• 1997

Experiments on granular filtration of polydispersed aerosols were conducted to determine the changes in pressure drop necessary to maintain a given gas flow rate as filter becomes clogged with deposited particles. Among the various variables which affect the increase in the pressure drop during the filtration, the most important one was found to be the size of the deposited aerosol particles. It was shown that for a given extent of the total deposition, the extent of increase in pressure drop increases with the decrease of the deposited aerosol size. For the general case where the deposited particles have different sizes, a procedure was proposed for correlating and predicting experimental results on pressure drop. This procedure was found applicable to bidispersed aerosols and polydispersed aerosols.

• Transactions of the Korean Society of Automotive Engineers
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• v.17 no.4
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• pp.126-132
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• 2009

Automotive heat exchangers use louver fins for their high efficiency. However, the efficiency can significantly drop for constructional vehicles or heavy equipments due to dust deposited on the louver fins with narrow slits. Thus it is necessary to develop new fins that lead to less fouling, so that a better performance can be achieved after exposure to a dusty environment over long period of time. New wavy fins were considered in the study and numerically analysed to compare with louver fins in the areas of air-side pressure drop, heat release rate, and particulate deposition. In addition, an experiment was done on the pressure drop and the particulate deposition. The results showed that the wavy fins would be a better choice for long-term use due to the excellent dust-proof performance in comparison to louver fins, in spite of the initial inferior performance of heat release.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1660-1665
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• 2006

Drop placement accuracy and precision are the critical performance values of industrial ink jet deposition systems. Imperfect components and environments have severe impacts on drop placement. Litrex has identified over 120 error sources and developed engineering solutions to address the errors. In this paper, improved results using thermal compensation and stage mapping techniques are demonstrated. A recent progress in inkjet fabrication of multi-color electrophoretic display on flexible substrate with large distortion is also demonstrated.

• Journal of computational fluids engineering
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• v.21 no.4
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• pp.90-95
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• 2016

Leidenfrost drops with ellipsoidal shaping can control the bouncing height by adjusting the aspect ratio(AR) of the shape at the moment of impact. In this work, we focus on the effect of the AR and the impact Weber number(We) on the non-axisymmetrical spreading dynamics of the drop, which plays an important role in the control of bouncing. To understand the impact dynamics, the numerical simulation is conducted for the ellipsoidal drop impact upon the perfect non-wetting solid surface by using volume of fluid method, which shows the characteristics of the spreading behavior in each principal axis. As the AR increases, the drop has a high degree of the alignment into one principal axis, which leads to the consequent suppression of bouncing height with shape oscillation. As the We increases, the maximum spreading diameters in the principal axes both increase whereas the contact time on the solid surface rarely depends on the impact velocity at the same AR. The comprehensive understanding of the ellipsoidal drop impact upon non-wetting surface will provide the way to control of drop deposition in applications, such as surface cleaning and spray cooling.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.12
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• pp.573-578
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• 2003

In this study, new type of induction charging system for electrostatic spraying was manufactured and proposed to improve the electrical safety and charging efficiency. And parameters of proposed system to generate the maximum deposition current with electrical safety were selected and investigated. The selected parameters were frequency of square pulse and thickness of insulation material, outer diameter of device and thickness and positions of electrode. Charging quantity of water drop was measured by deposition current detected from sensing plate indirectly. The maximum deposition current for each parameter were 3.5[uA] at the frequency of 15[kHz] and thickness of 0.25[mm] insulating layer. And maximum deposition currents were 2.8[uA] and 3.0[uA] at 25[mm] outer diameter of charging device and 0.25[mm] thickness of electrode each. Effects of electrode position from spraying nozzle on deposition current was a little.

• Proceedings of the Korea Society for Energy Engineering kosee Conference
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• 2001.11a
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• pp.25-32
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• 2001

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.481-484
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• 2008

In order to reduce IR drop through common electrode in AMOLED, we propose a novel method to form electrical contact between highly-conductive bus lines and common electrode by using a plasma-assisted patterning of OLED layers and double deposition of the common electrode. Plasma-assisted patterning effects on OLED performance and degradation have been investigated. This patterning method caused turn-on voltage decrease, current flow increase at the same applied OLED voltages, quantum efficiency decrease, and rapid degradation at early stage during the lifetime test. However, comparable 70% luminance lifetime were obtained for both patterned and non-patterned OLEDs.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.11
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• pp.3021-3031
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• 1994

Experiments have been performed to find out the effect of the mixing port length of Y-jet atomizers on the spray performance, using air and water as the test fluids. Water and air flow rates and drop sizes were measured at each injection pressure condition for different mixing port length. The air flow rate was almost unaffected by the change of the mixing port length. However, the water flow rate was relatively susceptible to the change of the mixing port length. The mixing point pressure was very much influenced by the mixing port length. Variations of spatial distribution of Sauter Mean Diameter (SMD, $D_{32}$) and the cross-section-averaged SMD ($D_{32,m}$) with different mixing port length and air/water mass flow rate ratio were examined. Generally, when the mixing port length was reduced, the mean drop size decreased and became spatially even.

• Journal of the Korean Society for Precision Engineering
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• v.22 no.3 s.168
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• pp.187-193
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• 2005

The temperature distribution of the deposited droplet was predicted by using the finite element analysis and it was assumed that the droplet was axisymmetrical model. The analysis of residual stress was performed with the temperature data, which is obtained from the result. Axisymmetric droplet is deposited three times to consider the actual phenomenon of droplet deposition. The analysis of the temperature distribution is respectively performed whenever the axisymmetric droplet is laminated and the residual stresses of the laminated axisymmetric droplet are calculated with the value of the temperature distribution.

• Journal of Mechanical Science and Technology
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• v.19 no.6
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• pp.1338-1346
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• 2005

Effects of thermal contact resistance between heater and susceptor, susceptor and graphite board in a MOCVD reactor on temperature distribution and film growth rate were analyzed. One-dimensional thermal resistance model considering thermal contact resistance and heat transfer area was made up at first to find the temperature drop at the surface of graphite board. This one-dimensional model predicted the temperature drop of 18K at the board surface. Temperature distribution of a reactor wall from the three-dimensional computational fluid dynamics analysis including the gap at the wafer position showed the temperature drop of 20K. Film growth rates of InP and GaAs were predicted using computational fluid dynamics technique with chemical reaction model. Temperature distribution from the three-dimensional heat transfer calculation was used as a thermal boundary condition to the film growth rate simulations. Temperature drop due to the thermal contact resistance affected to the GaAs film growth a little but not to the InP film growth.