• Journal of electromagnetic engineering and science
• /
• 제9권2호
• /
• pp.78-84
• /
• 2009

This paper represents the effects of drain bias on the linearity and efficiency of an analog pre-distortion power amplifier(PA) for wideband code division multiple access(WCDMA) repeater applications. For verification, an analog predistorter(APD) with three-branch nonlinear paths for memory-effect compensation is implemented and a class-AB PA is fabricated using a 30-W Si LOMaS. From the measured results, at an average output power of 33 dBm(lO-dB back-off power), the PA with APD shows the adjacent channel leakage ratio(ACLR, ${\pm}$5 MHz offset) of below -45.1 dBc, with a drain efficiency of 24 % at the drain bias voltage($V_{DD}$) of 18 V. This compared an ACLR of -36.7 dEc and drain efficiency of 14.1 % at the $V_{DD}$ of 28 V for a PA without APD.

• 대한전자공학회논문지TC
• /
• 제43권5호
• /
• pp.128-136
• /
• 2006

본 논문에서는 3GPP 중계기 및 기지국용 50W급 Doherty 전력증폭기를 설계 및 제작하였다. 이상적인 Doherty 전력증폭기는 효율개선과 고출력 특성이 뛰어나지만 이를 구현하기 위해서는 바이어스 조절이 어렵다. 이를 해결하고자 기존의 Gate 바이어스 조절회로를 가진 Doherty(GDCHD) 전력증폭기에 Drain 바이어스 조절회로를 첨가한 GDCHD(Gate and Drain Control Hybrid Doherty) 전력증폭기를 구현하였다. 실험결과 3GPP 동작주파수 대역인 $2.11{\sim}2.17\;GHz$에서 이득이 57.03 dB이고, PEP 출력이 50.30 dBm, W-CDMA 평균전력 47.01 dBm, 5MHz offset 주파수대역에서 -40.45 dBc의 ACLR 특성을 가졌으며, 각각의 파라미터는 설계하고자 하는 증폭기의 사양을 만족하였다. 특히 GDCHD 전력증폭기는 일반적인 Doherty 전력증폭기에 비해 ACLR에 따른 효율 개선성능이 우수하였다.

• E2M - 전기 전자와 첨단 소재
• /
• 제8권5호
• /
• pp.626-632
• /
• 1995

In this paper, The effect of the impedances in SNOSFET's memory devices has been developed. The effect of source and drain impedances measured by means of two bias resistances - field effect bias resistance by inner region, external bias resistance. The effect of the impedances by source and drain resistance shows the dependence of the function of voltages applied to the gate. It shows the differences of change in source drain voltage by means of low conductance state and high conductance state. It shows the delay of threshold voltages. The delay time of low conductance state and high conductance state by the impedances effect shows 3[.mu.sec] and 1[.mu.sec] respectively.

• 한국산학기술학회논문지
• /
• 제11권5호
• /
• pp.1592-1596
• /
• 2010

IGZO (indium gallium zinc oxide) 박막트랜지스터는, 활성층 채널의 폭과 길이의 비가 고정된 경우에도, 채널 길이가 길어지면 게이트전압에 대한 드레인 전류의 특성곡선이 양의 전압 방향으로 이동하고 전계효과이동도는 낮아졌다. 채널의 길이와 폭이 고정된 상태에서는, 드레인이 전압 높은 경우에 전계효과이동도가 낮고 문턱아래 기울기가 큰 특성을 보였다. 이러한 현상은 IGZO 채널층의 일함수가 커서 소스/드레인 전극과 채널층의 접합부 띠굽음이 규소반도체의 경우와 반대방향으로 나타나는 것에 기인하는 것으로 해석된다.

• 대한기계학회논문집B
• /
• 제27권7호
• /
• pp.829-836
• /
• 2003

Understanding of heat generation in semiconductor devices is important in the thermal management of integrated circuits and in the analysis of the device physics. Scanning thermal microscope was used to measure the temperature and the electric potential distribution on the cross-section of an operating metal-oxide-semiconductor field-effect transistor (MOSFET). The temperature distributions were measured both in DC and AC modes in order to take account of the leakage current. The measurement results showed that as the drain bias was increased the hot spot moved to the drain. The density of the iso-potential lines near the drain increased with the increase in the drain bias.

• 대한전기학회논문지
• /
• 제38권6호
• /
• pp.401-415
• /
• 1989

A simple but accurate analytical model for the lateral channel electric field in gate-offset structured Lightly Doped Drain MOSFET has been developed. Our model assumes Gaussian doping profile, rather than simple uniform doping, for the lightly doped region and our model can be applied to LDD structures where the junction depth of LDD is not identical to the heavily doped drain. The validity of our model has been proved by comparing our analytical results with two dimensional device simulations. Due to its simplicity, our model gives a better understanding of the mechanisms involved in reducing the electric field in the LDD MOSFET. The model shows clearly the dependencies of the lateral channel electric field on the drain and gate bias conditions and process, design parameters. Advantages of our analytical model over costly 2-D device simulations is to identify the effects of various parameters, such as oxide thickness, junction depth, gate/drain bias, the length and doping concentration of the lightly doped region, on the peak electric field that causes hot-electron pohenomena, individually. Our model can also find the optimum doping concentration of LDD which minimizes the peak electric field and hot-electron effects.

• Advances in nano research
• /
• 제15권3호
• /
• pp.263-275
• /
• 2023

The electron transport properties of Y-type zigzag branched carbon nanotubes (CNTs) are of great significance for micro and nano carbon-based electronic devices and their interconnection. Based on the semi-empirical method combining tight-binding density functional theory and non-equilibrium Green's function, the electron transport properties between the branches of Y-type zigzag branched CNT are studied. The results show that the drain-source current of semiconducting Y-type zigzag branched CNT (8, 0)-(4, 0)-(4, 0) is cut-off and not affected by the gate voltage in a bias voltage range [-0.5 V, 0.5 V]. The current presents a nonlinear change in a bias voltage range [-1.5 V, -0.5 V] and [0.5 V, 1.5 V]. The tangent slope of the current-voltage curve can be changed by the gate voltage to realize the regulation of the current. The regulation effect under negative bias voltage is more significant. For the larger diameter semiconducting Y-type zigzag branched CNT (10, 0)-(5, 0)-(5, 0), only the value of drain-source current increases due to the larger diameter. For metallic Y-type zigzag branched CNT (12, 0)-(6, 0)-(6, 0), the drain-source current presents a linear change in a bias voltage range [-1.5 V, 1.5 V] and is symmetrical about (0, 0). The slope of current-voltage line can be changed by the gate voltage to realize the regulation of the current. For three kinds of Y-type zigzag branched CNT with different diameters and different conductivity, the current-voltage curve trend changes from decline to rise when the branch of drain-source is exchanged. The current regulation effect of semiconducting Y-type zigzag branched CNT under negative bias voltage is also more significant.

• 한국항행학회논문지
• /
• 제13권3호
• /
• pp.358-364
• /
• 2009

본 논문에서는 설계된 전력증폭기에서 가변 바이어스 기법을 이용하면 전력부가효율을 증가시킬 수 있다는 것을 보였다. 서로 다른 출력전력을 갖는 이중 모우드에서 높은 효율을 얻기 위하여 가변 바이어스 기법을 이용하고 바이어스 변화에 따른 영향을 시뮬레이션 하였다. 게이트 전압을 고정하고 드레인 바이어스를 시뮬레이션으로 최적값을 구하여 이를 변화하여 전력증폭기의 효율을 향상시킬 수 있었다. 또한 전력증폭기의 비선형 특성을 분석하고 디지털 사전왜곡 기법을 이용하여 이중 대역 증폭기의 송신기의 ACPR 특성을 최대 10dB 개선되었다.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1998년도 하계학술대회 논문집 D
• /
• pp.1315-1317
• /
• 1998

We have investigated the effects of electrical stress on poly-Si TFTs with different hydrogen passivation conditions. The amounts of threshold voltage shift of hydrogen passivated poly-Si TFTs are much larger than those of as-fabricated devices both under the gate bias stressing and under the gate and drain bias stressing. Also, we have quantitatively analized the degradation phenomena using by analytical method. we have suggested that the electron trapping in the gate dielectric is the dominant degradation mechanism in only gate bias stressed poly-Si TFT while the creation of defects in the poly-Si is prevalent in gate and drain bias stressed device.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1996년도 하계학술대회 논문집 C
• /
• pp.1502-1504
• /
• 1996

The effects of electrical stress in hydrogen passivated and as-fabricated poly-Si TFT's are investigated. It is observed that the charge trapping in the gate dielectric is the dominant degradation mechanism in poly-Si TFT's which has been stressed by the gate bias alone while the creation of defects in the poly-Si film is prevalent in gate and drain bias stressed devices. The degradation due to the gate bias stress is dramatically reduced with hydrogenation time while the degradation due to the gate and drain bias stress is increased a little. From the experimental results, it is considered that hydrogenation suppress the charge trapping at gate dielectrics as well as improve the characteristics of poly-Si TFT's.