• 제목/요약/키워드: Distribution packaging

검색결과 353건 처리시간 0.021초

Membership Wholesale Club에서의 RRP 적재패턴 및 블록패턴 표준규격에 관한 연구 (RRP Loading Patterns and Standard Dimensions for Block Pattern in Membership Wholesale Clubs)

  • 정성태;한규철
    • 유통과학연구
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    • 제13권7호
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    • pp.41-51
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    • 2015
  • Purpose - This study analyzes loading efficiency by loading pattern for package standardization and reduction of logistics costs, along with the creation of revenue for the revenue review panel (RRP) of Membership Wholesale Clubs (MWC). The study aims to identify standard dimensions that can help improve the compatibility of the pallets related to display patterns preferred by the MWC and thereby explore ways to enhance logistics efficiency between manufacturers and retailers through standardization. Research design, data, and methodology - The study investigates and analyzes the current status based on actual case examples, i.e., manufacturer A and Korea's MWC (A company, B company, and C company), and thus devises improvement measures. To achieve this, the case of manufacturer A delivering to MWC was examined, and the actual pallet display patterns for each MWC were investigated by visiting each distribution site. In this study, TOPS (Total Optimization Packaging Software, USA) was used as the tool for pallet loading efficiency simulations the maximum allowable dimension was set to 0.0mm to prevent the pallet from falling outside the parameters, and the loading efficiency was analyzed with the pallet area. In other words, the study focused on dimensions (length x width x height) according to the research purpose and thereby deduced results. Results - The analysis of pallet loading patterns showed that the most preferred loading patterns for loading efficiency according to product specification, such as pinwheel, brick, and block patterns, were used in the case of the general distribution products, but the products were configured with block patterns in most cases when delivered to MWCs. The loading efficiency by loading pattern was analyzed with respect to 104 nationally listed standard dimensions. Meanwhile, No.51 (330 × 220mm) of KS T 1002 (1,100 × 1,100mm) was found to be the dimension that could bring about an improved loading efficiency, over 90.0% simultaneously in both the T-11 and T-12 pallet systems in a loading pattern configuration with the block pattern only, and the loading efficiency simulation results also confirmed this as the standard dimension that can be commonly applied to both the T-11 pallet (90.0%) and the T-12 pallet (90.7%) systems. Conclusions - The loading efficiency simulation results by loading pattern were analyzed: For the T-11 pallet system, 17 standard dimension sizes displayed the loading efficiency of 90.0% or more as block patterns, and the loading capacity was an average of 99.0%. For the T-12 pallet system, 35 standard dimension sizes displayed the loading efficiency of more than 90% as block patterns (the average loading efficiency of 98.6%). Accordingly, this study proposes that the standard dimensions of 17 sizes with the average loading efficiency of 99.0% should be applied in the use of the T-11 pallet system, and those of 35 sizes with the average loading efficiency of 98.6% should be reviewed and applied in the use of the T-12 pallet system.

시설 열무 중 diazinon 및 endosulfan에 대한 잔류농약 분해특성 (Characteristic of Decomposition of Residual Pesticides on Diazinon and Endosulfan in Young Radish)

  • 최근영;김준형;한병재;정양모;서혜영;심성례;김경수
    • Applied Biological Chemistry
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    • 제47권2호
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    • pp.238-243
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    • 2004
  • 열무의 안전한 생산을 위한 시설재배 생산단계에서의 각 농약 잔류량 변화 추이와 최종 소비단계에서의 농산물 안전성 평가자료로 활용하기 위하여 실제 시험포장에 열무를 파종한 후 수확 10일 전에 2 종(diazinon, endosulfan)의 살충제를 각 성분별로 안전사용 기준에 따라 기준량 및 배량의 처리구에 직접 살포하여 열무의 포장상태에서의 잔류량 감소(생물학적 반감기) 변화를 조사하였다. 시설재배포장에서의 열무 중 각 약제의 살포농도별 잔류량 변화는 시간이 경과함에 따라 그 잔류수준이 점차 감소하였다. 약제 살포 후 분해속도는 diazinon이 endosulfan보다 더 빠른 것으로 나타났다. Endosulfan은 대사산물인 sulfate 때문에 잔류기간이 0.6일 더 길어지는 것으로 나타났다. 안전한 농산물 생산을 위한 열무 중 약제 살포 후 수확일은 잔류허용기준(MRL)을 적용시킬 경우 기준량으로 볼 때 diazinon은 6일 후, endosulfan은 10일 후에 수확하는 것이 바람직한 것으로 나타났다.

식생활 스타일에 따른 단기소득임산물의 소비행태 (Non-Timber Forest Products Consumption Behaviors According to Dietary Lifestyle)

  • 유현정;송유진
    • Human Ecology Research
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    • 제54권1호
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    • pp.107-118
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    • 2016
  • This study examined differences in consumers' images of short-term income forest products, preference, willingness to pay prices and purchase behavior according to dietary lifestyle as well as investigated what factors influence the degree of satisfaction when purchasing short-term income forest products and willingness to repurchase. According to dietary lifestyle, the results classified consumers as 'frugal housewife type,' 'convenience-seeking type,' and 'food high-involvement type.' A 'food high-involvement group' is defined as a group that wants high quality products regardless of price. In the 'frugal housewife type,' country of origin and hygiene/safety (considered when purchasing food) had positive influences on the degree of satisfaction. In the 'convenience-seeking type,' country of origin (considered when purchasing food) had a positive influence on the degree of satisfaction while country of origin (checked when purchasing food) had a negative influence on degree of satisfaction. Consumers had a lack of perception for short-term income forest products; subsequently, short-term income forest products had a weakness of low access to consumers. Therefore, farms for short-term income forest products need to divide products into 'high-priced' luxury products and 'low-priced' frugal products according to dietary lifestyle characteristics, improve packaging status to enable consumers to check quality certificates, and clearly indicate country of origin as well as improve distribution processes and increase consumer access to products.

공정시간 및 온도에 따른 웨이퍼레벨 패키지 접합 최적설계에 관한 연구 (Wafer Level Package Design Optimization Using FEM)

  • 고현준;임승용;김희태;김종형;김옥래
    • 한국생산제조학회지
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    • 제23권3호
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    • pp.230-236
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    • 2014
  • Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

기업 물류비용의 실증적 분석을 통한 공급사슬 전략의 도입 효과분석 (A study on the introduction effect of supply chain strategies using the analysis of enterprise logistics)

  • 이정;정석재;김경섭
    • 한국경영과학회:학술대회논문집
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    • 한국경영과학회 2007년도 추계학술대회 및 정기총회
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    • pp.482-487
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    • 2007
  • As the importance of logistics is increasing, Enterprises design the supply chain(SC) network to minimize the total costs considering inventory holding cost, transportation cost and apply the efficient strategies of supply chain based on SC network Calculating the logistics costs without reflecting the logistics components like the packaging cost, transportation related cost, storage cost, loading & unloading cost, and distribution costs, the companies should have many limitation to calculate the logistics cost of real enterprise and install the SC network reducing them. Therefore, this research is aimed at establishing SC strategies which can be an efficient alternative for a decision making on supply chain, based on existing reference and current logistics networks of 'L' company in Korea and analyzing interaction effects between strategies and influence on logistics cost by these strategies. As the method of analysis, we analyze the interaction effects between strategies as well as install the optimal SC network reflecting concrete logistics components from the viewpoint of total logistics costs. we expect that analysis method of this paper would be applied various industries and used the efficient tools for the decision mating by planing and execution of the logistics budget from enterprises.

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A Newly Isolated Bacteriophage, PBES 02, Infecting Cronobacter sakazakii

  • Lee, Hyung Ju;Kim, Wan Il;Kwon, Young Chan;Cha, Kyung Eun;Kim, Minjin;Myung, Heejoon
    • Journal of Microbiology and Biotechnology
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    • 제26권9호
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    • pp.1629-1635
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    • 2016
  • A novel bacteriophage, PBES 02, infecting Cronobacter sakazakii was isolated and characterized. It has a spherical head of 90 nm in diameter and a tail of 130 nm in length, and belongs to Myoviridae as observed under a transmission electron microscope. The major virion protein appears to be 38 kilodaltons (kDa) in size. The latent period of PBES 02 is 30 min and the burst size is 250. Infectivity of the phage remained intact after exposure to temperatures ranging from 4℃ to 55℃ for 1 h. It was also stable after exposure to pHs ranging from 6 to 10 for 1 h. The phage effectively removed contaminating Cronobacter sakazakii from broth infant formula. PBES 02 has a double-stranded DNA genome of 149,732 bases. Its GC ratio is 50.7%. Sequence analysis revealed that PBES 02 has 299 open reading frames (ORFs) and 14 tRNA genes. Thirty-nine ORFs were annotated, including 24 related to replication and regulation functions, 10 related to structural proteins, and 5 related to DNA packaging. The genome of PBES 02 is closely related to that of two other C. sakazakii phages, CR3 and CR8. Comparison of DNA sequences of genes encoding the major capsid protein revealed a wide geographical distribution of related phages over Asia, Europe, and America.

기업 물류비용의 실증적 분석을 통한 공급사슬 전략의 도입 효과분석 (A Study on the Introduction Effect of Supply Chain Strategies Using the Analysis of Enterprise Logistics)

  • 이정;정석재;김경섭
    • 경영과학
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    • 제25권2호
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    • pp.89-109
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    • 2008
  • As the importance of logistics is increasing, Enterprises try to design the supply chain(SC) network to minimize the total costs considering inventory holding cost, transportation cost and apply the efficient strategies of supply chain based on SC network. Despite of this efforts, Calculating the logistics costs without reflecting the real components of logistics like the packaging cost, transportation related cost, storage cost, loading & unloading cost, and distribution costs, the companies has many limitation to calculate the logistics cost of real enterprise. For overcoming such problem, this paper is aimed at establishing SC strategies which can be an efficient alternative for a decision making on supply chain, based on existing reference and current logistics networks of 'L' company in Korea. Also, we analyze the interaction effects between strategies as well as install the optimal SC network reflecting concrete logistics components from the viewpoint of total logistics costs using the simulation and statistic methods. we expect that analysis results of this paper would be applied various industries and be utilized to the efficient tools for the decision making by planing and execution of the logistics budget from enterprises.

패키징으로 인한 응력이 MEMS 소자에 미치는 영향 분석 및 개선 (Effects of Package Induced Stress on MEMS Device and Its Improvements)

  • 좌성훈;조용철;이문철
    • 한국정밀공학회지
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    • 제22권11호
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    • pp.165-172
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    • 2005
  • In MEMS (Micro-Electro-Mechanical System), packaging induced stress or stress induced structure deformation becomes increasing concerns since it directly affects the performance of the device. In the decoupled vibratory MEMS gyroscope, the main factor that determines the yield rate is the frequency difference between the sensing and driving modes. The gyroscope, packaged using the anodic bonding at the wafer level and EMC (epoxy molding compound) molding, has a deformation of MEMS structure caused by thermal expansion mismatch. This effect results in large distribution in the frequency difference, and thereby a lower yield rate. To improve the yield rate we propose a packaged SiOG (Silicon On Glass) process technology. It uses a silicon wafer and two glass wafers to minimize the wafer warpage. Thus the warpage of the wafer is greatly reduced and the frequency difference is more uniformly distributed. In addition. in order to increase robustness of the structure against deformation caused by EMC molding, a 'crab-leg' type spring is replaced with a semi-folded spring. The results show that the frequency shift is greatly reduced after applying the semi-folded spring. Therefore we can achieve a more robust vibratory MEMS gyroscope with a higher yield rate.

고분자 패키징 용기 중량 절감을 위한 프리폼 설계에 관한 연구 (Study on Preform Design for Reducing Weight of PET Packaging Bottle)

  • 김정순
    • 한국산학기술학회논문지
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    • 제11권1호
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    • pp.1-6
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    • 2010
  • 본 연구에서는 성형해석 및 실험적 방법을 통하여 페트 용기의 두께 편차를 최소화하기 위한 프리폼 최적화 설계를 수행하였다. 사출성형과정을 정확하게 묘사하기 위하여 3차원 모델을 이용하여 충진, 보압 및 냉각해석을 통하여 최적의 프리폼 설계변수를 설정하였으며, 이 결과를 이용하여 블로우 성형해석을 수행하였다. 성형해석결과를 평가하기 위한 사출성형 및 블로우 성형실험을 수행하였으며, 실험결과와 해석결과는 정성적으로 일치하는 것을 확인하였다. 이러한 실험결과 데이타를 설계에 반영함으로서 최적의 프리폼 형상을 얻을 수가 있었다.

표면 부식 처리한 WS2 입자를 첨가한 Cu/Sn계 다이아몬드 마이크로 블레이드의 절삭특성 (Evaluation of Dicing Characteristics of Diamond Micro-blades with Cu/Sn Binder Including Etched WS2 Particles)

  • 김송희;장재철
    • 한국표면공학회지
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    • 제46권1호
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    • pp.22-28
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    • 2013
  • $WS_2$ particles were added to micro-diamond blades with Cu/Sn binding metal as lubricants to improve cutting efficiency. It was found in previous works that the added $WS_2$ lubricant could reduce remarkably the momentary energy consumption during dicing tests but increased wear rate slightly owing to weak bonding between lubricant particles and bond metals. In the present work, the surface of $WS_2$ lubricant particles were etched for activating the surface of $WS_2$ particles that provide even distribution of particles during powder mixing process and improvement of wetting at the interfaces between $WS_2$ particles and molten Cu/Sn bond metals during pressurized sintering so that could provide the improved strength of micro-blades and result in extended life. Chipping behavior of workpiece with the types of micro-blades including $WS_2$ were compared because it is important in semiconductor and micro-packaging industries to control average roughness and straightness of sliced surface which is closely related with quality.