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http://dx.doi.org/10.5695/JKISE.2013.46.1.022

Evaluation of Dicing Characteristics of Diamond Micro-blades with Cu/Sn Binder Including Etched WS2 Particles  

Kim, Song-Hee (Department of Advanced Materials Science and Engineering, Kangwon National University)
Jang, Jaecheol (Department of Advanced Materials Science and Engineering, Kangwon National University)
Publication Information
Journal of the Korean institute of surface engineering / v.46, no.1, 2013 , pp. 22-28 More about this Journal
Abstract
$WS_2$ particles were added to micro-diamond blades with Cu/Sn binding metal as lubricants to improve cutting efficiency. It was found in previous works that the added $WS_2$ lubricant could reduce remarkably the momentary energy consumption during dicing tests but increased wear rate slightly owing to weak bonding between lubricant particles and bond metals. In the present work, the surface of $WS_2$ lubricant particles were etched for activating the surface of $WS_2$ particles that provide even distribution of particles during powder mixing process and improvement of wetting at the interfaces between $WS_2$ particles and molten Cu/Sn bond metals during pressurized sintering so that could provide the improved strength of micro-blades and result in extended life. Chipping behavior of workpiece with the types of micro-blades including $WS_2$ were compared because it is important in semiconductor and micro-packaging industries to control average roughness and straightness of sliced surface which is closely related with quality.
Keywords
Micro-blade; Surface etching effect; $WS_2$; Dicing test;
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Times Cited By KSCI : 3  (Citation Analysis)
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