• 제목/요약/키워드: Direct3D

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Mobile 환경에서의 Direct3D 텍스쳐 매핑을 지원하는 효율적인 하드웨어 구조 설계 (Design of an efficient hardware architecture supporting Direct3D texture mapping in mobile environment)

  • 김상덕;이승기;박우찬;한탁돈
    • 한국정보과학회:학술대회논문집
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    • 한국정보과학회 2002년도 가을 학술발표논문집 Vol.29 No.2 (1)
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    • pp.712-714
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    • 2002
  • 현재 3차원 컴퓨터 그래픽 가속기에서 텍스쳐 매핑과 같은 실감기법을 처리해 주기 위해서는 넓은 대역폭과 많은 메모리를 필요로 한다. 또한 PDA와 같은 차세대 mobile 응용분야에서는 점차적으로 3차원 그래픽의 지원이 요구되고 있는 추세이다. 이를 mobile 환경에서 지원하기 위해서는 낮은 소비 전력 및 적은 메모리, 그리고 하드웨어 비용 등의 제약 요건이 따른다. 그러나 이러한 제약 조건에도 불구하고, mobile 환경에 적합한 3차원 그래픽 하드웨어의 연구는 필수적이다. 본 논문에서는 Windows CE 기반의 mobile 환경에서 Direct3D의 압축 텍스쳐 데이터를 효율적으로 처리하는 하드웨어를 제시한다. 이는 1 cycle에 2개 texel을 처리할 수 있으며, 작은 2-level cache를 사용하여 대역폭을 효과적으로 줄였다.

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A Quadrature VCO Exploiting Direct Back-Gate Second Harmonic Coupling

  • Oh, Nam-Jin
    • Journal of electromagnetic engineering and science
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    • 제8권3호
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    • pp.134-137
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    • 2008
  • This paper proposes a novel quadrature VCO(QVCO) based on direct back-gate second harmonic coupling. The QVCO directly couples the current sources of the conventional LC VCOs through the back-gate instead of front-gate to generate quadrature signals. By the second harmonic injection locking, the two LC VCOs can generate quadrature signals without using on-chip transformer, or stability problem that is inherent in the direct front-gate second harmonic coupling. The proposed QVCO is implemented in $0.18{\mu}m$ CMOS technology operating at 2 GHz with 5.0 mA core current consumption from 1.8 V power supply. The measured phase noise of the proposed QVCO is - 63 dBc/Hz at 10 kHz offset, -95 dBc/Hz at 100 kHz offset, and -116 dBc/Hz at 1 MHz offset from the 2 GHz output frequency, respectively. The calculated figure of merit(FOM) is about -174 dBc/Hz at 1 MHz offset. The measured image band rejection is 46 dB which corresponds to the phase error of $0.6^{\circ}$.

디지털 카메라를 이용한 2D 인체계측법 연구 (A Study on a Measurement Method for 2D Anthropometry using Digital Camera)

  • 손희정;김효숙;최창석;손희순;김창우
    • 복식문화연구
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    • 제11권1호
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    • pp.11-19
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    • 2003
  • This study suggests the new 2D anthropometric method using digital camera. It is used MK2001 program that can convert 2D measurements to 3D measurements. To improve that it is measured 100 college students with direct and indirect anthropometric method. The measurements were processed by the SPSS ver10 Statistical Package. The average, standard deviation, and t-test were calculated for each category. Most measurements by 2D measurements are higher than direct measurements but degree. The difference between direct and indirect measurements is less than 2cm. In the results of t-test, height measurements including other 16 measurements which is easy to measure have no meaningful difference within 1cm. The depth measurements are most high difference. The result of each measurement proves that MK2001 program (2D anthropometry method using digital camera) is available for measuring the human body.

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유방이 큰 여성을 위한 브래지어 패턴 설계 -3차원 유방 형상 자료를 중심으로- (Design of Brassiere Pattern for Big Size Breast Women -Based on 3D Breast Scanning Data-)

  • 한초희;이경화
    • 한국의류학회지
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    • 제43권2호
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    • pp.204-214
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    • 2019
  • A CAD program has recently been introduced that can be directly developed into a three-dimensional human body shape and made into a pattern. It is possible to fabricate a bra that reflects the volume and surface area of the breast; however, it still needs to be verified. This study investigates the average size and shape of 20 big-breasted women and designs a brassiere pattern for women with large breasts using a 3D Flattening function of OptiTex PDS v15.6. In addition, the study verifies the reliability of the proposed method compared to a conventional brassiere pattern. The study results are as follows. First, the three dimensional measurement values were smaller than the direct measurement dimensions when the three dimension measurement dimensions of the subjects were compared with the direct measurement dimensions, the replica measurement dimensions and the three dimensional measurement dimensions. Second, the 3D flattening pattern reflects the actual shape, length, and area of the actual breast when comparing a brassiere pattern using a 3D shape and pattern reflecting the direct measurement.

DirectShow를 이용한 사용자 중심적 3D 증강 UI 시스템 (User-Oriented Augmented 3D UI System Based using DirectShow)

  • 이관욱;장성은;최창열;김만배
    • 한국방송∙미디어공학회:학술대회논문집
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    • 한국방송공학회 2010년도 추계학술대회
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    • pp.40-42
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    • 2010
  • 최근 3DTV 등의 3D 디스플레이의 공급으로 기존의 입체 콘텐츠뿐만 아니라, 일반 2D 영상도 자동적으로 입체 콘텐츠로 변환하여 3D로 시청할 수 있다. 이러한 콘텐츠를 시청할 때에 주로 사용하는 3D 디스플레이에는 자체적인 UI를 내장하고 있는데, 입체 모드에서의 이러한 UI를 3D로 변환하여 사용할 수 있는 3D UI기술에 대한 관심이 높아지고 있다. 본 논문에서는, 3D UI의 관심도 증가에 따라 좀 더 편리하고 이해도가 높은 3D UI의 개발 방법에 대하여 제안한다. Directshow를 이용하여, 문자와 UI 배경을 합성한다. 여기에 UI의 투명도, 시차, 밝기 등을 조절 가능하게 하여 사용자의 편의에 따라 선택할 수 있게 한다. 사전에 입체로 제작된 실험 영상을 실행하여 그 위에 메뉴 화면, 메뉴 글씨 등을 띄워 입체감 있는 3D UI를 제작, 증강을 체험할 수 있는 3D UI 플레이어를 구현한다.

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Direct Write 기술을 이용한 3DCD의 제작 (Fabrication of 3D-Printed Circuit Device using Direct-Write Technology)

  • 윤해룡;김호찬;이인환
    • 한국기계가공학회지
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    • 제15권2호
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    • pp.1-8
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    • 2016
  • Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

간접급전 패드를 이용한 이중 대역 GPS 배열 안테나 설계 (Design of Dual-Band GPS Array Antenna Using In-Direct Feeding Pad)

  • 강승석;서승모;변강일;추호성
    • 한국전자파학회논문지
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    • 제28권5호
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    • pp.355-365
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    • 2017
  • 본 논문에서는 간접급전 패드를 이용한 이중 대역 GPS 패치 안테나를 제안하였다. 제안된 안테나는 GPS L1 대역에서 공진하는 상부패치, L2 대역에서 공진하는 하부패치, 중간층에 위치하는 2개의 간접급전 패드로 구성되며, 광대역 원형 편파 특성구현을 위해 하이브리드 칩커플러를 사용하여 두 급전 포트 사이에 $90^{\circ}$의 위상차를 갖도록 급전하였다. 제안된 개별 안테나의 측정 결과, 전면 방향 이득은 GPS L1, L2 대역에서 각각 3.0 dBic, 5.1 dBic를 나타내며, 축비 특성은 각각 3.3 dB, 0.3 dB를 나타내는 것을 확인하였다. 제안된 안테나를 동일한 유전체 기판 가장자리에 7소자 배열하여 제작하여 active element pattern을 측정한 결과, 전면 방향 이득은 GPS L1, L2 대역에서 각각 -0.4 dBic, -2.4 dBic를 나타내어 GPS 배열안테나의 개별 소자로 사용 가능함을 확인하였다.

A Study on i-Fashion 3D Avatar's Consumer satisfaction & Comparison of 3D and Direct Masurement - Based of Domestic University Students

  • Choi, Eunhee;Do, Wolhee
    • 한국의류산업학회지
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    • 제17권3호
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    • pp.421-428
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    • 2015
  • This research is to understand customer satisfaction with virtual fitting based on a 3D body scanner and avatars as well as differences between avatars and the 'real me'. To this end, this research examined Korean college students to facilitate 3D body scanning, avatar generation and surveys. The author used 3D body scan data with direct measurements to identify differences between the 3D body scan data-based 'my avatar' and 'real me' in the virtual dress fitting system. The survey results on 'the level of customer awareness on 3D body scanner' found that the majority of both genders did not know about it and indicated a lower usability to incorporate IT technology into the fashion industry. The question in the 3D body scanning and avatar found an affirmative attitude. Satisfaction levels on the 3D avatars' similarity with 'own body' and garment fitting were positive and indicated a need for further technological improvements to express the avatars identical to customers' own body. More research is necessary for the accuracy of sizes for 3D body scanning that measure body sizes while wearing clothes. Avatars based on such datamay be less similar to 'own body' and cause customer dissatisfaction. Thus, further technology development is required to narrow gaps using data to make avatars that provide more accurate virtual fitting simulation services to customers.

물체의 3-D 형상 복원을 위한 삼각측량 시스템 (A Study on the 3-D Information Abstraction of object using Triangulation System)

  • 김국세;이정기;조애리;배일호;이준
    • 한국정보처리학회:학술대회논문집
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    • 한국정보처리학회 2003년도 춘계학술발표논문집 (상)
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    • pp.409-412
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    • 2003
  • The 3-D shape use to effect of movie, animation, industrial design, medical treatment service, education, engineering etc... But it is not easy to make 3-D shape from the information of 2-D image. There are two methods in restoring 3-D video image through 2-D image; First the method of using a laser; Second, the method of acquiring 3-D image through stereo vision. Instead of doing two methods with many difficulties, I study the method of simple 3-D image in this research paper. We present here a simple and efficient method, called direct calibration, which does not require any equations at all. The direct calibration procedure builds a lookup table(LUT) linking image and 3-D coordinates by a real 3-D triangulation system. The LUT is built by measuring the image coordinates of a grid of known 3-D points, and recording both image and world coordinates for each point; the depth values of all other visible points are obtained by interpolation.

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MEMS-based 마이크로 터보기계의 개발 (Development of MEMS-based Micro Turbomachinery)

  • 박건중;민홍석;전병선;송성진;주영창;민경덕;유승문
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2001년도 춘계학술대회논문집E
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    • pp.169-174
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    • 2001
  • This paper reports on the development of high aspect ratio structure and 3-D integrated process for MEMS-based micro gas turbines. To manufacture high aspect ratio structures, Deep Reactive Ion Etching (DRIE) process have been developed and optimized. Specially, in this study, structures with aspect ratios greater than 10 were fabricated. Also, wafer direct bonding and Infra-Red (IR) camera bonding inspection systems have been developed. Moreover, using glass/silicon wafer direct bonding, we optimized the 3-D integrated process.

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