• Journal of Korean Institute of Industrial Engineers
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• v.41 no.3
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• pp.253-258
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• 2015

The 3D printing is any of various processes for making a three dimensional object of almost any shape from a 3D model. Recently, a rapidly expanding hobbyist and home-use market has become established with the inauguration of the open-source RepRap and Fab@Home projects. However, this causes problems regarding copyright protection and usage of illegal 3D data. In this paper, we developed a 3D printing open-market system, which guarantees copyright protection using the remote 3D printing without direct distribution of 3D design data. Because most of the home-use 3D printers are FFF (Fused Filament Fabrication) based on NC code system, open-market system uses FFF 3D printers. Also, open-market system inspects the uploaded 3D model data, so the system can prevent distribution of illegal model data such as weapons, etc.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.216-224
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• 2004

In this study, we have developed a new UV$({\lambda}=355nm)$ laser micromachining technology by direct ablation method without masks. This technology allows that 3D micro parts can be fabricated rapidly and efficiently with a low price. And it has a benefit of reducing fabricating process simply. Due to micro parts' fabrication, such technologies need the control of XYZ stages with high precision, the design of optical devices to maintain micron spot sizes of laser beam and the control technology of laser focus. The developed laser manufacturing process for laser micromachining is that, after extracting coordinates of shape data from CAD model data, a beam path considering manufacturing features of laser beam is created by using genetic algorithm. This generated manufacturing process is sent to stage controller. In order to improve the surface quality of micro parts, we have carried out experiments on iteration manufacturing and beam step-over by using a minimum focus size. Moreover, we have fabricated a micro-channel through the developed laser micromachining technology and verified it through the results.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.11 no.3
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• pp.153-163
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• 1986

GaAs, one of the III-V compounding semicondnctors, has been widely employed as base materials for the fabrication of the ultra-high-speed devices in the filelds of DBS, optical communications, MMIC'S and digital IC'S. There have been some reports on 4Kx4bit SRAM by D/E MESFET'S, 4K bit SRAM by HEMT'S, and receiver front ends for X-band by MMIC technologies, respectively. This paper reviews GaAs materials, wafer fabrication processes, device applications, and design aspects, and, finally, descusses the future of the ultra-high-spped-devices.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.295-298
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• 2003

Reflective mode liquid crystal on silicon (LCoS) microdisplay is the major technology that can produce extremely high-resolution displays. A very large number of pixels can be packed onto the CMOS circuit with integrated drivers that can be projected to any size screen. Large size direct-view thin film transistor (TFT) LCDs becomes very difficult to make and to drive as the information content increases. However, the existing LC alignment technology for the LCoS cell fabrication is still the mechanical rubbing method, which is prone to have minor defects that are not visible normally but can be detrimental if projected to a large screen. In this paper, application of photo-alignment to LCoS fabrication is presented. The alignment is done by three-step exposure process. A MTN $90^{\circ}$ mode is chose as to evaluate the performance of this technique. The comparison with rubbing mode shows the performance of photo-alignment is comparable and even better in some aspect, such as sharper RVC curve and higher contrast ratio.

• KSBB Journal
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• v.13 no.1
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• pp.52-57
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• 1998

The present work proposes a simple electrochemical method applicable to any immobilization processes of oxidase using a Clark type oxygen electrode as a base transducer. The present work suggests an optimal immobilization technique among three different methods of glucose oxidase(GOD) onto one side of $37[\mu}$mthick blend membranes, composed o 80% of cellulose triacetate and 20% of polycaprolactone, on the basis of the maximum Michaelis-Menten parameter(Vm) determined by either steady state or transient analyses. The electrode system was made of disk type gold cathode(4mm diameter) and Ag/AgCl anode. One side of the blend membrane was in contact with the cathode surface while the other side was immobilized with GOD either in covalent-bond or cross-linked forms, the latter being covered by $25{\mu}$m thick dialysis membrane of cellulose acetate. The resultant current density was on-line monitored by a potentiostat while glucose level was varied from 1 to 20 mM. The present study shows that direct cross-linking of GOD with glutaraldehyde was mostly preferred for fabrication of glucose sensor, on the basis of resultant kinetic parameters from either steady state or transient analyses.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07b
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• pp.830-833
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• 2003

This paper describes the fabrication and characteristics of 3C-SiCOI sotctures by SDB and etch-back technology for high-temperature MEMS applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si(001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The wafer bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR. The strength of the bond was measured by tensile strengthmeter. The bonded interface was also analyzed by SEM. The properties of fabricated 3C-SiCOI structures using etch-back technology in TMAH solution were analyzed by XRD and SEM. These results indicate that the 3C-SiCOI structure will offers significant advantages in the high-temperature MEMS applications.

• Journal of Mechanical Science and Technology
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• v.19 no.2
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• pp.682-691
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• 2005

This paper describes the design, fabrication, and testing of a microturbine developed at Seoul National University. Here, the term 'microturbine' refers to a radial turbine with a diameter on the order of a centimeter. Such devices can be used to transmit power for various systems. The turbine is designed using a commercial CFD code, and it has a design flow coefficient of 0.238 and work coefficient of 0.542. It has 31 stator blades and 24 rotor blades. A hydrodynamic journal bearing and hydrostatic thrust bearings counteract radial and axial forces on the rotor. The test turbine consists of a stack of five wafers and is fabricated by MEMS technology, using photolithography, DRIE, and bonding processes. The first, second, fourth, and fifth layers contain plumbing, and hydrostatic axial thrust bearings for the turbine. The third wafer contains the turbine's stator, rotor, and hydrodynamic journal bearings. Furthermore, a turbine test facility containing a flow control system and instrumentation has been designed and constructed. In performance tests, a maximum rotation speed of 11,400 rpm and flow rate of 16,000 sccm have been achieved.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1093-1100
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• 2014

The goal of this paper is to investigate preliminary the applicability of 3D printing technologies for the development of the hot bulk forming process and die. 3D printing technology based on the plastic material was applied to the preform design of the hot forging process. Plastic hot forging dies were fabricated by Polyjet process for the physical simulation of the workpiece deformation. The feasibility of application of Laser-aided Direct Metal Rapid Tooling (DMT) process to the fabrication of the hot bulk metal forming die was investigated. The SKD61 hot-working tool steel was deposited on the heat treated SKD61 using the DMT process. Fundamental characteristics of SKD 61 hot-working tool steel deposited specimen were examined via hardness and wear experiments as well as the observation of the morphology. Using the results of the examination of fundamental characteristics, the applicability of the DMT process to manufacture hot bulk forming die was discussed.

• Transactions of Materials Processing
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• v.18 no.4
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• pp.310-316
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• 2009

Micro lens array(MLA) is widely used in information technology(IT) industry fields for various applications such as a projection display, an optical power regulator, a micro mass spectrometer and for medical appliances. Recently, MLA have been fabricated and developed by using a reflow method having the processes of micro etching, electroplating, micro machining and laser local heating. Laser thermal relaxation method is introduced in marking of microdots on the surface of densified glass. In this paper, we have proposed a new direct fabrication process using UV laser local thermal-expansion(UV-LLTE) and investigated the optimal processing conditions of MLA on the surface of negative photo-resist material. We have also studied the 3D shape of the micro lens obtained by UV laser irradiation and the optimal process conditions. And then, we made chrome mold by electroplating. After that, we made MLA using chrome mold by hot embossing processing. Finally, we have measured the opto-physical properties of micro lens and then have also tested the possibility of MLA applications.

• Progress in Superconductivity and Cryogenics
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• v.22 no.1
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• pp.1-6
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• 2020

This is a parameter study for the direct fabrication of a large grain YBCO bulk superconductors using Y₂O₃, BaCO₃ and CuO powders without any grinding step. The cracks, which have been formed due to volume contraction during calcination step, have been prevented by controlling the heating rate at 930~950 ℃. It has been observed that multi-grain growth has occurred due to the dissolution of Sm123 seed due to the retention of carbon in Ba-Cu-O melt. In order to accelerate the carbon release in prior calcination heat treatment, the reduction of pellet thickness and the drilling of artificial holes have been applied. Single-grain YBCO bulk superconductor has been successfully fabricated by stacking multiple thin slab. However, the crack formation has been rather prominent for the compact with artificial holes. The use of buffer pellet, which is supposed to act as diffusion barrier, has prevented the dissolution of Sm123 seed crystal and has led to the growth of single grain of high content of carbon containing specimen.