• Proceedings of the IEEK Conference
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• 2000.06e
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• pp.187-190
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• 2000

We presents the construction of radio frequency pad area array package modules which operate at radio frequency of 224MHz, and proposes the structure of RF module packages to improve its electrical characteristics. The module of RF PAA package was constructed in the configuration of three dimensional stacked package and reduced size. RF PAA packages showed the optimized and improved gain of 2dB by partitioning the RF transceiver with 3 dimensional stacked PAA packages.

• Applied Microscopy
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• v.46 no.3
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• pp.127-133
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• 2016

Atom probe tomography is a time-of-flight mass spectrometry-based microanalysis technique based on the field evaporation of surface atoms of a tip-shaped specimen under an extremely high surface electric field. It enables three-dimensional characterization for deeper understanding of chemical nature in conductive materials at nanometer/atomic level, because of its high depth and spatial resolutions and ppm-level sensitivity. Indeed, the technique has been widely used to investigate the elemental partitioning in the complex microstructures, the segregation of solute atoms to the boundaries, interfaces, and dislocations as well as following of the evolution of precipitation staring from the early stage of cluster formation to the final stage of the equilibrium precipitates. The current review article aims at giving a comment to first atom probe users regarding the limitation of the techniques, providing a brief perspective on how we correctly interprets atom probe data for targeted applications.

• ETRI Journal
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• v.36 no.4
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• pp.635-642
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• 2014

Three-dimensional integrated circuits (3D ICs) implement heterogeneous systems in the same platform by stacking several planar chips vertically with through-silicon via (TSV) technology. 3D ICs have some advantages, including shorter interconnect lengths, higher integration density, and improved performance. Thermal-aware design would enhance the reliability and performance of the interconnects and devices. In this paper, we propose thermal-aware floorplanning with min-cut die partitioning for 3D ICs. The proposed min-cut die partition methodology minimizes the number of connections between partitions based on the min-cut theorem and minimizes the number of TSVs by considering a complementary set from the set of connections between two partitions when assigning the partitions to dies. Also, thermal-aware floorplanning methodology ensures a more even power distribution in the dies and reduces the peak temperature of the chip. The simulation results show that the proposed methodologies reduced the number of TSVs and the peak temperature effectively while also reducing the run-time.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.8
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• pp.881-886
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• 2014

The purpose of three-dimensional (3-D) metal printing using 5-axis is to deposit metal powder by changing the orientation of the deposited structure to be built for the overhang or undercut feature on part geometry. This requires a complicated preprocess functionality of providing three dimensionally sliced layers to cover the required part geometry. This study addresses the overhang/undercut problem in 3-D metal printing and discusses a possible solution of providing 3-D layers to be built using the DMT(R) machine.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.29 no.4C
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• pp.533-540
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• 2004

This paper proposes a new multispectral image data compression algorithm that can efficiently reduce spatial and spectral redundancies by applying classified prediction, a Karhunen-Loeve transform (KLT), and the three-dimensional set partitioning in hierarchical trees (3-D SPIHT) algorithm in the wavelet transform (WT) domain. The classification is performed in the WT domain to exploit the interband classified dependency, while the resulting class information is used for the interband prediction. The residual image data on the prediction errors between the original image data and the predicted image data is decorrelated by a KLT. Finally, the 3-D SPIHT algorithm is used to encode the transformed coefficients listed in a descending order spatially and spectrally as a result of the WT and KLT. Simulation results showed that the reconstructed images after using the proposed algorithm exhibited a better quality and higher compression ratio than those using conventional algorithms.

• Journal of the Optical Society of Korea
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• v.19 no.1
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• pp.29-37
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• 2015

The wavefront printer records a volume-reflection hologram as a two-dimensional array of elemental holograms from computer-generated holograms (CGHs) displayed on a spatial light modulator (SLM). The wavefront coming from the object is extracted by filtering in the spatial-frequency domain. This paper presents a method to improve color reproduction in a wavefront printer with spatial division of exposures at primary colors, by adaptive partitioning of the SLM in accordance with the color content encoded in the input CGHs, and by the controllable change of exposure times for the recording of primary colors. The method is verified with a color wavefront printer with demagnification of the object beam. The quality of reconstruction achieved by the proposed method proves its efficiency in eliminating the stripe artifacts that are superimposed on reconstructed images in conventional mosaic recording.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.11
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• pp.1785-1795
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• 2001

A multi-layered brick element fur the finite element method is developed for analyzing the three-dim-ensionally layered composite structures subjected to both thermal and mechanical boundary conditions. The element has eight nodes with one degree of freedom for the temperature and three for the display-ements at each node, and can contain arbitrary number of layers with different material properties with-in the element; the conventional element should contain one material within an element. Thus the total number of nodes and elements, which are needed to analyze the multi-layered composite structures, can be tremendously reduced. In solving the global equation, a partitioning technique is used to obtain the temperature and the displacements which are caused by both the mechanical boundary conditions and temperature distributions. The results by using the developed element are compared wish the commercial package, ANSYS and the conventional finite element methods, and they are in good agreement. It is also shown that the Number of nodes and elements can be tremendously reduced using the element without losing the numerical accuracies.

• Journal of Microbiology and Biotechnology
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• v.3 no.4
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• pp.256-260
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• 1993

DNA subfragments, sopA, sopB and sopC which help to maintain the stability of an ori C plasmid, were derived from a mini-F plasmid DNA (EcoRI restriction fragment f5) after digestion with restriction endonuclease, and cloned in the vector plasmid pBR322. The recombinant plasmids obtained were introduced into E. coli KY7231 and E. coli CSR603 strains, and proteins specified by the mini-F fragments were analysed by SDS-PAGE. Two proteins encoded by the F fragments were detected, and their molecular weights were 41,000 and 37,000 daltons. Fluorography after one and two dimensional gel electrophoresis of the lysates showed that these two proteins had been overproduced in the cells which were allowed to incorporate radioactive amino acid after plasmid amplification by chloramphenicol treatment. The isoelectric points of sopA and sopB proteins were 6.6 and 7.0, respectively.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.50 no.12
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• pp.889-898
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• 2022

In this paper, parallel computing method on the three-dimensional electromagnetic field is proposed. The present electromagnetic scattering analysis is conducted based on the time-harmonic vector wave equation and the finite element method. The edge-based element and 2^nd -order absorbing boundary condition are used. Parallelization of the elemental numerical integration and the matrix assemblage is accomplished by allocating the partitioned finite element subdomain for each processor. The graph partitioning library, METIS, is employed for the subdomain generation. The large sparse matrix computation is conducted by MUMPS, which is the parallel computing library based on the multi-frontal method. The accuracy of the present program is validated by the comparison against the Mie-series analytical solution and the results by ANSYS HFSS. In addition, the scalability is verified by measuring the speed-up in terms of the number of processors used. The present electromagnetic scattering analysis is performed for a perfect electric conductor sphere, isotropic/anisotropic dielectric sphere, and the missile configuration. The algorithm of the present program will be applied to the finite element and tearing method, aiming for the further extended parallel computing performance.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.4B
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• pp.708-714
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• 2000

In this paper, an one-dimensional VLSI array for high speed processing of fractal image compression algorithm based the quad-tree partitioning method is proposed. First of all, the single assignment code algorithm is derived from the sequential Fisher's algorithm, and then the data dependence graph(DG) is obtained. The two-dimension array is designed by projecting this DG along the optimal direction and the one-dimensional VLSI array is designed by transforming the obtained two-dimensional array. The number of Input/Output pins in the designed one-dimensional array can be reduced and the architecture of process elements(PEs) can he simplified by sharing the input pins of range and domain blocks and internal arithmetic units of PEs. Also, the utilization of PEs can be increased by reusing PEs for operations to the each block-size. For fractal image compression of 512X512gray-scale image, the proposed array can be processed fastly about 67 times more than sequential algorithm. The operations of the proposed one-dimensional VLSI array are verified by the computer simulation.