• Title/Summary/Keyword: Dimensional Inspection

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Development of Automatic Precision Inspection System for Defect Detection of Photovoltaic Wafer (태양광 웨이퍼의 결함검출을 위한 자동 정밀검사 시스템 개발)

  • Baik, Seung-Yeb
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.5
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    • pp.666-672
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    • 2011
  • In this paper, we describes the development of automatic inspection system for detecting the defects on photovoltaic wafer by using machine vision. Until now, The defect inspection process was manually performed by operators. So these processes caused the produce of poorly-made articles and inaccuracy results. To improve the inspection accuracy, the inspection system is not only configured, but the image processing algorithm is also developed. The inspection system includes dimensional verification and pattern matching which compares a 2-D image of an object to a pattern image the method proves to be computationally efficient and accurate for real time application and we confirmed the applicability of the proposed method though the experience in a complex environment.

The Performance of An Inspection System Providing 3D Spatial Proximity Data and Its' Design Considerations (3차원 근접정보를 이용한 검사시스템의 성능평가와 디자인 고려사항)

  • Jeong, Gyeong-Ho
    • Journal of the Ergonomics Society of Korea
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    • v.23 no.1
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    • pp.13-22
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    • 2004
  • Due to economical or technological reasons. humans are responsible for inspection functions in many cases. Humans. however. are rarely perfect. thus allowing non-confirming parts to be processed. As the attributes of interest or the variety of products increases. the inspection system becomes less effective because of the sensory and cognitive limitations of human inspectors. Any means that can support or aid the human inspectors is necessary to compensate for inspection difficulty. Augmented reality (AR) offers a new approach in designing an inspection system as a means to augment the cognitive capability of inspectors by providing the 3D spatial proximity between two information channels. The experimental results suggest that AR might be an effective tool that reduces inspection time without sacrificing the measuring accuracy.

The Development of 2-Dimensional Inspection Algorithm using Camera for BGA device (카메라를 이용한 BGA 소자의 2차원 결함검출 알고리즘 개발)

  • Kim, Kee-Soon;Kim, Joon-Seek;Joo, Hyo-Nam
    • Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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    • 2005.05a
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    • pp.437-442
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    • 2005
  • In this paper, we proposed the 2-dimensional inspection algorithm for micro-BGA(Ball Grid Array) device using a vision system. The proposed method uses the subpixel algorithm for high precision. The proposed algorithm preferentially extracts the package area of device in the input image. After the extraction of package area, each ball areas are extracted by ball search window method. The parameters for inspection are calculated for the extracted ball area. In the simulation results, we have the average error within $17{\mu}m$.

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A Study on the Evaluation of the Gear Measurement Capability of a 3 Dimensional Coordinate Measuring Machine (3차원 좌표측정기의 기어측정능력평가를 위한 실험적 연구)

  • Shim, Chang-Gun;Byun, Jai-Hyun
    • IE interfaces
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    • v.12 no.2
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    • pp.180-192
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    • 1999
  • A coordinate measuring machine (CMM) is a computer-controlled measuring device that uses a probe to obtain measurements on a manufactured part's surface. CMM's have been very popular over traditional hard gauges due to their flexibility, accuracy, and ease of automated inspection. This paper considers the use of a CMM for the inspection of gears. We compare the inspection capability of a CMM and that of a gear-specific measuring machine. The result of this paper may benefit gear manufacturing companies in their dimensional quality assurance activities, especially for special type gears and for large-scale gears which are not measurable by gear-specific measuring machines.

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3-Dimensional Shape Measurement System for BGA Balls Using PMP Method (PMP 방식을 이용한 BGA 볼의 3차원 형상측정 시스템)

  • Kim, Hyo Jun;Kim, Joon Seek;Joo, Hyonam
    • Journal of Institute of Control, Robotics and Systems
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    • v.22 no.1
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    • pp.59-65
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    • 2016
  • As modern electronic devices get smaller and smaller, high-resolution, large Field-Of-View (FOV), fast, and cost-effective 3-dimensional (3-D) measurement is requested more and more. In particular, defect inspection machines using machine-vision technology nowadays require 3-D inspection as well as the conventional 2-D inspection. Phase Measuring Profilometry (PMP) is one of the fast non-contact 3-D shape measuring methods currently being extensively investigated in the electronic component manufacturing industry. The PMP system is well known and is successfully applied to measuring complex surface profiles with varying reflectance properties. However, for highly reflective surfaces, such as Ball Grid Arrays (BGAs), it has difficulty accurately measuring 3-D shapes. In this paper, we propose a new fast optical system that can eliminate the highly reflective saturated regions in BGA ball images. This is achieved by utilizing four Low Intensity Grating (LIG) images together with the conventional High Intensity Grating (HIG) images. Extensive experiments using BGA samples show a repeatability of under ${\pm}20um$ in standard deviation, which is suitable for most 3-D shape measurements of BGAs.

Flexible inspection system using CAD detabase and vision guided coordinate measuring machine (3차원 측정기를이용한 Flexible Inspection System)

  • 조명우;박용길
    • Journal of the Korean Society for Precision Engineering
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    • v.10 no.4
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    • pp.16-29
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    • 1993
  • The objective of this research is in the development of a flexible 3-dimensional inspection system for the sculptured surface by integrating the Coordinate Measuring Machine (CMM), CAD database, and vision system. To achieve the proposed flexible inspection system, two research categories are discussed in the study: new inspection planning method includes a new measuring point selection method and various new probe path generation methods. The object recognition and localization process for the unknown surface can be easily carried out by introducing a new concept called "Z-Layer". The experimental results indicate that the developed flexible inspection system, with the proposed algorithm, can be inplemented in real situation.situation.

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A Stereo Vision-based Algorithm for the 3-Dimensional Inspection of a Crimped Terminal (압착단자의 3차원 검사를 위한 스테레오 비젼 알고리즘)

  • Lee, Moon-Kyu;Jang, Sang-Won
    • IE interfaces
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    • v.11 no.2
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    • pp.93-106
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    • 1998
  • This paper suggests a stereo vision-based algorithm for the 3-dimensional inspection of a crimped terminal. The crimped terminal is one of wire harness assemblies which transmit current or signals between a pair of electrical or electronic assemblies. Four types of nonconformities considered includes terminal rolling, band up/down, twist, and crimp height. To obtain stereo image correspondence, an algorithm using Hough transform is proposed. Coordinate transform is then applied to evaluate the degree of 3-dimensional nonconformities. The algorithm has been successfully tested on a number of real specimens collected from a wire harness factory. The test results show the feasibility of the proposed algorithm.

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A Study on the 2-Dimensional Vision Inspection Algorithm for the Defects Detection of BGA Device (BGA 소자의 결함검출을 위한 2차원 비젼 검사알고리즘에 관한 연구)

  • Kim, Joon-Seek;Kim, Kee-Soon;Joo, Hyo-Nam
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.19 no.7
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    • pp.53-59
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    • 2005
  • In this paper, we proposed the 2-dimensional inspection algorithm for micro-BGA(Ball Grid Array) device using a vision system. The reposed method uses the subpixel algorithm for high precision. The proposed algorithm preferentially extracts the package area of device in the input image. After the extraction of package area, each ball areas are extracted by ball search window method. The parameters for inspection are calculated for the extracted ball area. In the simulation results, we have the average error within 17[${\mu}m$].

Evaluation of Safety by Structural Analysis of Traditional Wooden Building (전통 목조 건축물의 구조해석에 의한 안전성 평가)

  • Jo, Sung-San;Kim, Hyong-Kee;Park, Bok-Man
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.9 no.4
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    • pp.149-158
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    • 2005
  • In order to grasp and evaluate the characteristics and the safety of traditional wooden building, we select one of the representative traditional wooden building, Buseoksa Muryangsujeon in this study. After the two and three-dimensional structural analysis of this building are performed, the results are compared and analyzed. Following main conclusion are obtained: 1) By comparison between the results of two and three-dimensional structural analysis, they show that the exterior members of this building tend to transfer more load in the three-dimensional analysis. 2) The result of three-dimensional structural analysis shows that the every member stress of Buseoksa Muryangsujeon except Chobang and Jangyon is below allowable stress. 3) For exact modelling of joints of members in traditional wooden building such as Gongpo, it is necessary to accumulate and analyze the technical data through structural test and systematic analysis study.

Noise Reduction and C-Scan Image Shaping of Ultrasonic Signal for Welding Quality Inspection (용접 품질 검사를 위한 초음파 신호의 노이즈 제거 및 C-Scan 영상 형상화)

  • Kim, Tae-Kyu;SEO, JONGDOCK;Lee, Dong-Hyung;Kang, Eon-uck;Kwon, Seong-Geun
    • Journal of Korea Multimedia Society
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    • v.20 no.10
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    • pp.1662-1670
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    • 2017
  • A-Scan NDT equipment is widely used in the industrial field because it is inexpensive and easy to carry but it is necessary to have a skilled inspection specialist who is trained to analyze the waveform of ultrasonic signal. Since the welding quality is judged subjectively by the specialist, there is a problem in the reliability of the quality. In the C-Scan NDT which overcomes the shortcomings of the A-Scan, welding part can be represented in the form of two dimensional image by combining one dimensional ultrasonic waveform so that the quality of welding can be grasped without the help of specialist. In order to develop C-Scan NDT, it is necessary to develop an array type two dimensional transducer and an algorithm to composing image by combining ultrasonic signals generated from a two dimensional transducer. In addition, the noise component must be minimized in the ultrasonic signal in order to display the quality of welding in the form of images. Therefore we propose a method to remove noise component from the ultrasonic wave and construct a two dimensional ultrasonic image.