• Title/Summary/Keyword: Digital technology integration

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Integrating Digital Technology into Elementary Mathematics: Three Theoretical Perspectives

  • Yeo, Sheunghyun
    • Research in Mathematical Education
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    • v.23 no.3
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    • pp.165-179
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    • 2020
  • In this article, the author's intent is to begin a conversation centered on the question: How was the integration of digital technology into elementary mathematics classrooms framed? In the first part of the discussion, the author provides a historical perspective of the development of theoretical perspectives of the integration of digital technology in learning mathematics. Then, the author describes three theoretical perspectives of the role of digital technology in mathematics education: microworlds, instrumental genesis, and semiotic mediation. Last, based on three different theoretical perspectives, the author concludes the article by asking the reader to think differently.

Image Retrieval Based on the Weighted and Regional Integration of CNN Features

  • Liao, Kaiyang;Fan, Bing;Zheng, Yuanlin;Lin, Guangfeng;Cao, Congjun
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.16 no.3
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    • pp.894-907
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    • 2022
  • The features extracted by convolutional neural networks are more descriptive of images than traditional features, and their convolutional layers are more suitable for retrieving images than are fully connected layers. The convolutional layer features will consume considerable time and memory if used directly to match an image. Therefore, this paper proposes a feature weighting and region integration method for convolutional layer features to form global feature vectors and subsequently use them for image matching. First, the 3D feature of the last convolutional layer is extracted, and the convolutional feature is subsequently weighted again to highlight the edge information and position information of the image. Next, we integrate several regional eigenvectors that are processed by sliding windows into a global eigenvector. Finally, the initial ranking of the retrieval is obtained by measuring the similarity of the query image and the test image using the cosine distance, and the final mean Average Precision (mAP) is obtained by using the extended query method for rearrangement. We conduct experiments using the Oxford5k and Paris6k datasets and their extended datasets, Paris106k and Oxford105k. These experimental results indicate that the global feature extracted by the new method can better describe an image.

DDC in DSpace: Integration of Multi-lingual Subject Access System in Institutional Digital Repositories

  • Roy, Bijan Kumar;Biswas, Subal Chandra;Mukhopadhyay, Parthasarathi
    • International Journal of Knowledge Content Development & Technology
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    • v.7 no.4
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    • pp.71-84
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    • 2017
  • The paper discusses the nature of Knowledge Organization Systems (KOSs) and shows how these can support digital library users. It demonstrates processes related to integration of KOS like the Dewey Decimal Classification, $22^{nd}$ edition (DDC22) in DSpace software (http://www.dspace.org/) for organizing and retrieving (browsing and searching) scholarly objects. An attempt has been made to use the DDC22 available in Bengali language and highlights the required mechanisms for system-level integration. It may help a repository administrator to build an IDR (Institutional Digital Repository) integrated with SKOS-enabled multilingual subject access systems for supporting subject descriptors based indexing (DC.Subject metadata element), structured navigation (browsing) and efficient searching.

Impact of Moral Intensity on Moral Behavior in the context of Artificial Intelligence: The Mediating Role of Technology Moral Sense

  • Wen Wu;Xiuqing Huang;Seth Y. Ntim;Yue Shen;Xinyu Li;GuoPeng Wang
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.18 no.6
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    • pp.1583-1598
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    • 2024
  • With the popularization and application of artificial intelligence technology in daily life, new ethical and moral problems constantly appear in human society. These ethical and moral problems have been associated with people's moral behavior and have become crucial issues. In traditional social situations, researches have proved that moral intensity affects people's moral behavior. However, in the context of applying artificial intelligence technology, the mechanism between moral intensity and moral behavior is unknown. Therefore, this study focuses on the relationship between moral intensity and moral behavior in the context of applying artificial intelligence technology, and introduces a new concept - technology moral sense (TMS) into the theoretical model. Research method: We set various situations of applying artificial intelligence technology and adopt the situational experiment method to analyze the relationship between moral intensity and moral behavior in different application scenarios. The results show that moral intensity has a significant influence on moral behavior, while the technology moral sense performs a mediating function.

Research on Digital Human Character Design Applicable to Stage Art

  • Zhihui Chen;Xinyi Shan;Jeanhun Chung
    • International journal of advanced smart convergence
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    • v.13 no.3
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    • pp.227-233
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    • 2024
  • With the rapid development of digital technology, digital human character design has brought richer visual experiences and creative expressions to stage art. This thesis focuses on its unique application in stage art, exploring design and performance optimization, immersive experiences, and multimedia integration. The study shows that digital human character design enhances stage art with immediacy, interactivity, and multimedia integration, while also driving innovation in traditional stage art expressions.

Development of Smart Factory-Based Technology Education Platform Linking CPPS and VR (CPPS 및 VR을 연계한 스마트팩토리 기반 기술 교육 플랫폼 개발)

  • Lee, Hyun
    • Journal of Practical Engineering Education
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    • v.13 no.3
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    • pp.483-490
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    • 2021
  • In this paper, we proposed the development of a smart factory intergrated technology education platform using smart factory based CPPS (Cyber Physical Production System) and VR (Vitrual Reality) technology and educational methods using the platform. A platform has been developed to learn how to integrate 3D digital twin and BOP (Bill of Process)-based manufacturing processes. In addition, Digital Twin established a smart factory-based integrated education platform by linking mechanical systems, digital twins, and virtual reality through the OPC-UA server. Based on this platform, the smart factory integration platform is proposed to have individual elements of the smart factory integration platform through BOP-based digital twin simulation, OPC-UA integration, MES system, SCADA system, and VR interworking.

Development of Pointcloud Data Integration Technology in Construction Sites via Drone Photogrammetry and MMS LiDAR (드론 및 MMS를 활용한 건설현장 점군 데이터 통합 기술 개발)

  • Jae-Woo Park;Dong-Jun Yeom
    • Journal of the Korean Society of Industry Convergence
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    • v.26 no.6_2
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    • pp.1145-1153
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    • 2023
  • This study presents the development of pointcloud data integration technology in construction sites via drone photogrammetry and MMS LiDAR. The integration of pointcloud data from drones and MMS technology can provide precise and accurate 3D digital maps of construction sites, which can benefit the development of smart construction and BIM. The advantages of using both drones and MMS technology for pointcloud data acquisition in construction sites are discussed, along with the limitations and challenges of using drone photogrammetry and MMS LiDAR for pointcloud data integration. The results of this study can contribute to the advancement of pointcloud data integration technology in construction sites and improve the efficiency and accuracy of construction projects.

Analyzing Productivity Enhancement and Task Replacement Rates in Digitized Construction Supervision Process: A Comprehensive Study with Construction Supervision Checklists in South Korea

  • Dahee KIM;Chanhyuk PARK;Wangyoung JUNG;Wisung YOO;Joonseo LEE;Seongmi KANG
    • International conference on construction engineering and project management
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    • 2024.07a
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    • pp.815-822
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    • 2024
  • This study aims to facilitate the integration of digital technology into construction supervision by leveraging construction supervision checklists, a fundamental tool for inspections in this field. To achieve this, this research analyzed the tools and practices used in construction supervision, identifying 12 key supervision task types. These task types formed the basis for developing four distinct digital technologies, each tailored to specific inspection tasks based on practical feasibility. A checklist development process followed with the use of predefined criteria. Checklist items from the Ministry of Land, Infrastructure, and Transport of South Korea were analyzed and categorized according to the identified inspection task types. Digital technologies were then integrated for each task type, with corresponding supervision locations documented. This process enhanced the checklist's effectiveness by incorporating methods for digitizing tasks. The findings suggested that approximately 61% of traditional tasks could be potentially replaced by digital technology, highlighting the potential for successful digitization implementation. In addition, surveys among industry professionals provided insights into the level of productivity enhancement achievable through technology adoption compared to traditional practices, offering a basis for predicting productivity improvements across various disciplines. In conclusion, this research supports the effective integration of digital technology into construction supervision through an enhanced checklist. It also sheds light on practitioners' perceptions of technology usage and aids in developing strategies for technology adoption in this domain.

Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals

  • Gutmann, R.J.;Zeng, A.Y.;Devarajan, S.;Lu, J.Q.;Rose, K.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.3
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    • pp.196-203
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    • 2004
  • A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

A Study on the Design of the Technology Reference Model Based on Technologies of Interoperability in Digital Libraries (디지털 도서관 상호운영성 기술요소에 기반한 기술 참조 모델 설계에 관한 연구)

  • Kim, Seong-Hee;Lee, Jeong-Soo
    • Journal of the Korean Society for information Management
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    • v.24 no.4
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    • pp.239-254
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    • 2007
  • In order to solve the problems of the digital library's Interoperability and integrated management, we analyzed core technologies for interoperability in digital library in terms of information creation, organization, service. And then we proposed information technology reference model that is composed of 7 scopes. The proposed scope included 1)Metadata Management, 2)Library Services, 3)Service Integration 4)Service Management, 5)Open Interface, 6)Network, 7)Architecture. Those results can be used as a framework for developing interoperable digital library system.