• Title/Summary/Keyword: Diffusion layer

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Interdiffusion in Cu/Capping Layer/NiSi Contacts (Cu/Capping Layer/NiSi 접촉의 상호확산)

  • You, Jung-Joo;Bae, Kyoo-Sik
    • Korean Journal of Materials Research
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    • v.17 no.9
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    • pp.463-468
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    • 2007
  • The interdiffusion characteristics of Cu-plug/Capping Layer/NiSi contacts were investigated. Capping layers were deposited on Ni/Si to form thermally-stable NiSi and then were utilized as diffusion barriers between Cu/NiSi contacts. Four different capping layers such as Ti, Ta, TiN, and TaN with varying thickness from 20 to 100 nm were employed. When Cu/NiSi contacts without barrier layers were furnace-annealed at $400^{\circ}C$ for 40 min., Cu diffused to the NiSi layer and formed $Cu_3Si$, and thus the NiSi layer was dissociated. But for Cu/Capping Layers/NiSi, the Cu diffusion was completely suppressed for all cases. But Ni was found to diffuse into the Cu layer to form the Cu-Ni(30at.%) solid solution, regardless of material and thickness of capping layers. The source of Ni was attributed to the unreacted Ni after the silicidation heat-treatment, and the excess Ni generated by the transformation of $Ni_2Si$ to NiSi during long furnace-annealing.

Siliconizing of Bonded Couple between Fe-5.8at.%Si and(Si Wafer or Fe-Si Alloy) (Fe-5.8 at.%Si과 (Si 웨이퍼 또는 Fe-Si합금)과의 접합에 의한 규소침투처리)

  • 이성열;정건영
    • Journal of Advanced Marine Engineering and Technology
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    • v.27 no.1
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    • pp.134-144
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    • 2003
  • Reactive diffusion couples between Fe-5.8at.%Si and (Si wafer, $FeSi_2$, or FeSi alloy) were heat-treated at 1423k. The only layer of $Fe_3Si$ phase was formed in each diffusion couple. The width of $Fe_3Si$ layer was proportional to square root of diffusion time in each kind of diffusion couple. Growth rate of $Fe_3Si$ layer was relied on the concentration of Si in the supplied source of Si atoms. Interdiffusion coefficient of $Fe_3Si$ has been determined from the derived relation between growth rate constant and interdiffusion coefficient in this work. It was shown that the behavior of Kirkendall's void in $Fe_3Si$ layer was not affected by the kind of Si source. But solid solution $\alpha$ was formed in the diffusion couple between Fe-5.8 at.%Si and $Fe_3Si$ alloy. Kirkendall's voids in diffusional $\alpha$ were neglectively smaller than the case of $Fe_3Si$ phase growth.

Cu Diffusion Behavior of Ni-B Diffusion Barrier Fabricated by Electroless Deposition (무전해 도금법으로 제조된 Ni-B 확산 방지막의 Cu 확산 거동)

  • Choi, Jae-Woong;Hwang, Gil-Ho;Han, Won-Kyu;Lee, Wan-Hee;Kang, Sung-Goon
    • Korean Journal of Materials Research
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    • v.15 no.9
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    • pp.577-584
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    • 2005
  • Thin Ni-B layer, $1{\mu}m$ thick, was electrolessly deposited on Cu electrode fabricated by electro-deposition. The purpose of the layer is to encapsulate Cu electrodes for preventing Cu oxidation and to serve as a diffusion barrier. The layers were annealed at $580^{\circ}C$ with and without pre-annealing at $300^{\circ}C$ for . 30minutes. In the layer with pre-annealing, the amount of Cu diffusion was lower about 5 times than the layer without pre-annealing. The difference in Cu concentration may be attributed to $Ni_3B$ formation prior to Cu diffusion. However, the difference in Cu concentration decreased during the annealing time of 5 h due to the grain growth of Ni.

Improved Result on the Pseudorandomness of SPN-type transformation (SPN 구조의 의사 난수성에 대한 향상된 결과)

  • 이원일;홍석희;성재철;이상진
    • Proceedings of the Korea Institutes of Information Security and Cryptology Conference
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    • 2003.07a
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    • pp.57-61
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    • 2003
  • Iwata 등은 SPN 구조에 기반한 블록 암호들 중 Serpent에 대한 의사 난수성을 분석하였다 [2]. 그들은 Serpent의 구조를 최대한 보존한 상태에서 의사 난수성을 분석하기 위하여 Serpent의 Diffusion layer의 특성을 그대로 보존하여 일반화 한 후 이론을 전개하였다. 본 논문에서는 Serpent가 취한 Diffusion layer 뿐만 아니라 SPN 구조에 기반한 블록 암호들이 취할 수 있는 임의의 Diffusion layer에 대하여 적용 가능한 일반적인 이론을 도출해낼 것이다.

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Thin-layer Rewetting Equation for Short Grain Rough Rice (단립종(短粒種)벼의 박층흡습방정식(薄層吸濕方程式))

  • Jung, C.S.;Keum, D.H.;Park, S.J.
    • Journal of Biosystems Engineering
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    • v.12 no.2
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    • pp.38-43
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    • 1987
  • An experimental study was conducted to develop a thin-layer rewetting equation of short grain rough rice of Akihikari variety. Four thin-layer rewetting equations were experimentally determined from $25^{\circ}C$ to $45^{\circ}C$ and 70%RH to 85%RH conditions. Diffusion, Henderson, Page, and Thompson equations widely used as thin-layer drying equations were selected. Experimental data were fitted to these equations using linear regression analysis except diffusion equation. The diffusivity in the diffusion equation was determined by optimization method. Four equations were highly significant. In order to compare the goodness of fit of each equation, the error mean square of each equawas calculated. The diffusion model was not a very good model because the error mean square was very large. The other three models showed the same level or error mean square and could predict satisfactorily the rewetting rate or short grain rough rice.

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Dynamic Response of Charge Transfer and Recombination at Various Electrodes in Dye-sensitized Solar Cells Investigated Using Intensity Modulated Photocurrent and Photovoltage Spectroscopy

  • Kim, Gyeong-Ok;Ryu, Kwang-Sun
    • Bulletin of the Korean Chemical Society
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    • v.33 no.2
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    • pp.469-472
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    • 2012
  • Intensity modulated photocurrent spectroscopy and intensity modulated photovoltage spectroscopy were investigated to measure the dynamic response of charge transfer and recombination in the standard, $TiCl_4$-treated and the combined scattering layer electrode dye-sensitized solar cells (DSSCs). IMPS and IMVS provided transit time ($\tau_n$), lifetime ($\tau_r$), diffusion coefficient ($D_n$) and effective diffusion length ($L_n$). These expressions are derived that generation, collection, and recombination of electrons in a thin layer nanocrystalline DSSC under conditions of steady illumination and with a superimposed small amplitude modulation. In this experimental, IMPS/IMVS showed that the main effect of $TiCl_4$ treatment is to suppress the recombination of photogenerated electrons, thereby extending their lifetime. And the Diffusion coefficient of combined scattering layer electrode is $6.10{\times}10^{-6}$ higher than that of the others, resulting in longer diffusion length.

The Formation Rate and Activation Energy of Diffusion Layer and Compound Layer in Ion-Nitriding (이온질화 에 있어 확산층 및 합성층 의 생성속도 및 질소 의 활성화에너지)

  • 성환태;유봉환;조규식
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.8 no.5
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    • pp.476-480
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    • 1984
  • This paper deals with nitrogen diffusion velocity and activation energy in diffusion layer and compound layer in ion-nitriding, and presents observations on the effect of deformation according to nitriding methods. During the experiment the activation energy and diffusion velocity of nitrogen have been examined in S45C steel samples. It is found that the results of an investigation correspond with the theoretical data and the ion-nitriding method offers less deformation than conventional salt-bath method of nitriding.

The Change in Diffusion Coefficient and Wear Characteristic in Carbonitriding Layer of SCM415 Steel (침탄질화 처리된 SCM415강의 깊이에 따른 확산 및 마모특성 변화)

  • Lee, Su-Yeon;Youn, Kuk-Tea;Huh, Seok-Hwan;Lee, Chan-Gyu
    • Journal of the Korean institute of surface engineering
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    • v.44 no.5
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    • pp.207-212
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    • 2011
  • In this study, the change in diffusion coefficient and wear characteristic with depth in the carbonitriding layer of SCM415 steel was discussed. To determine the diffusion coefficient, depth profile of carbon was measured from the surface using the Glow Discharge Spectrometer. In otherwise, measurements of carbide fraction, micro vickers hardness of surface and observation of microstructure have been implemented through the SEM image. $Fe_3$(C,N) layer and effective depth were increased as the time for carbonitriding takes longer. According to wear experiment, the results showed that wear resistance was improved by $Fe_3$(C,N) layer and effective depth.

Diffusion Bonding of Mo with Coating Layer (코팅층을 이용한 몰리브덴의 확산접합)

  • 박재현;권영각;장래웅
    • Journal of Welding and Joining
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    • v.10 no.3
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    • pp.26-39
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    • 1992
  • Diffusion bonding of Mo was performed by using the metallic coating of Cu and Cr on the surface to be bonded. Joint characteristics of Mo with or without coating layer were compared in metallurgical and fractograpical aspects. The results showed that the diffusion bonding with coating layer, especially with Cu coating, increased the bending strength of joint. Variation of heating cycle(elevation of temperature for a moment) did not affect significantly the mechanical properties of joint. Fractographical analysis showed that the fracture of joint bonded with Cr coating occurred at the coating layer, while that with Cu coating occurred at the base metal.

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A Study on the Cyclic Oxidation Properties of Aluminum Diffusion Coated Materials (알루미늄 확산코팅재료의 주기산화 특성에 관한 연구)

  • 강석철;민경만;김길무
    • Journal of the Korean institute of surface engineering
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    • v.32 no.1
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    • pp.49-60
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    • 1999
  • The protective oxide scales and coatings formed on high temperature materials must be preserved in high temperature atmosphere. And the thermal stresses induced by thermal cycling and the growth stresses by the formation of oxide scales can cause the loss of adherence and spalling of the oxide scales and coated layers. Among the coating processes Al diffusion coating is favored due to thermochemical stability and superior adherence in an hostile atmosphere. In this study, protective oxide forming element, Al was coated on Ni, Inconel 600 and 690 by diffusion coating process varying coating temperature and time. And the surface stability and adherence of oxide scales formed on those Al diffusion coated materials were evaluated by thermal cycling test. Al diffusion coated specimens showed superior cyclic oxidation resistance compared to bare ones and specimens coated for longer period had better cyclic oxidation resistance, due to the abundant amount of Al in the coated layer. Meanwhile Al diffusion coated Inconel 600 and 690 showed improved cyclic oxidation resistance by the effect of Al in the coated layer and Cr in the substrate. Comparing both Al diffusion coated Inconel 600 and 690, Al diffusion coated Inconel 690 maintained better adhesion between coated layer and substrate by virtue of the bridging effect resulting from the segregation of Cr in the interdiffusion zone.

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