• 제목/요약/키워드: Dielectric capability

검색결과 66건 처리시간 0.026초

뇌임펄스전압에 대한 SF6와 dry-air의 절연특성 (Dielectric Characteristics of SF6 and Dry-Air Gases under Lightning Impulse Voltage)

  • 이봉;유양우;김동규;이복희
    • 조명전기설비학회논문지
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    • 제24권8호
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    • pp.142-149
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    • 2010
  • 본 논문은 준평등전계에서 뇌임펄스전압에 대한 $SF_6$와 dry-air의 절연파괴 특성에 대하여 기술하였다. 준평등전계로 사용된 구-평판전극계의 전계이용률은 71[%]이다. $SF_6$는 0.1~0.2[MPa] 범위에서, dry-air는 0.2~0.6[MPa]에서 $SF_6$와 dry-air의 절연파괴전압을 임펄스전압의 극성과 가스압력에 따라 측정 분석하였다. 그 결과 뇌임펄스전압에 대한 두 가스의 절연파괴전압은 정극성이 부극성보다 높았으며, $SF_6$의 절연파괴전압이 dry-air의 절연파괴전압보다 약 2.67배정도 높았다. 본 연구결과는 뇌서지에 대하여 우수한 성능을 가지는 배전기기에서 $SF_6$의 대체가스 성능 평가에 유용한 정보가 될 것이다.

반도체 메모리 소자 제조에서 High Aspect Ratio Contact 식각 연구 동향 (Research Trend of High Aspect Ratio Contact Etching used in Semiconductor Memory Device Manufacturing)

  • 탁현우;박명호;이준수;최찬혁;김봉선;장준기;김은구;김동우;염근영
    • 한국표면공학회지
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    • 제57권3호
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    • pp.165-178
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    • 2024
  • In semiconductor memory device manufacturing, the capability for high aspect ratio contact (HARC) etching determines the density of memory device. Given that there is no standardized definition of "high" in high aspect ratio, it is crucial to continuously monitor recent technology trends to address technological gaps. Not only semiconductor memory manufacturing companies such as Samsung Electronics, SK Hynix, and Micron but also semiconductor manufacturing equipment companies such as Lam Research, Applied Materials, Tokyo Electron, and SEMES release annual reports on HARC etching technology. Although there is a gap in technological focus between semiconductor mass production environments and various research institutes, the results from these institutes significantly contribute by demonstrating fundamental mechanisms with empirical evidence, often in collaboration with industry researchers. This paper reviews recent studies on HARC etching and the study of dielectric etching in various technologies.

Wafer-Level Three-Dimensional Monolithic Integration for Intelligent Wireless Terminals

  • Gutmann, R.J.;Zeng, A.Y.;Devarajan, S.;Lu, J.Q.;Rose, K.
    • JSTS:Journal of Semiconductor Technology and Science
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    • 제4권3호
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    • pp.196-203
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    • 2004
  • A three-dimensional (3D) IC technology platform is presented for high-performance, low-cost heterogeneous integration of silicon ICs. The platform uses dielectric adhesive bonding of fully-processed wafer-to-wafer aligned ICs, followed by a three-step thinning process and copper damascene patterning to form inter-wafer interconnects. Daisy-chain inter-wafer via test structures and compatibility of the process steps with 130 nm CMOS sal devices and circuits indicate the viability of the process flow. Such 3D integration with through-die vias enables high functionality in intelligent wireless terminals, as vertical integration of processor, large memory, image sensors and RF/microwave transceivers can be achieved with silicon-based ICs (Si CMOS and/or SiGe BiCMOS). Two examples of such capability are highlighted: memory-intensive Si CMOS digital processors with large L2 caches and SiGe BiCMOS pipelined A/D converters. A comparison of wafer-level 3D integration 'lith system-on-a-chip (SoC) and system-in-a-package (SiP) implementations is presented.

Thermochemical Stability and Mechanical Properties of Ceramic-Filler Added BaO-ZnO-$B_2O_3$ Based Glass for Application to Barrier Rib in Plasma Display Panels

  • Kim, Sang-Gon;Shin, Hyun-Ho;Park, Jong-Sung;Hong, Kug-Sun;Kim, Hyung-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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    • pp.220-222
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    • 2004
  • Feasibility of BaO-ZnO-$B_2O_3$ (BZB) based glass system in the light of dielectric and thermal expansion properties are reported in the literature. Effects of addition of various types of ceramic fillers to the BZB-based glass on the thermochemical stability and mechanical properties were investigated in the present work. The studied filler-glass system demonstrated a capability to host various types of ceramic fillers to form thermochemically stable microcomposites at the processing temperature suitable for PDP systems. At the same time, mechanical strength of the filler-glass composites was much improved as compared to the glass itself These observations brighten the feasibility of the Pb-free BZB-based glass system as a host to employ various types of crystalline ceramic fillers so that it can be applied to barrier rib material in plasma display panels.

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Feasibility Study on the Use of Vegetable Oil (Natural Ester) in Malaysia Power System Transformers

  • Suleiman, Abubakar A.;Muhamad, Nor Asiah Binti
    • Transactions on Electrical and Electronic Materials
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    • 제15권3호
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    • pp.113-116
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    • 2014
  • Power transformer insulation oil is critical to the useful life of the transformer. Although mineral base insulation oil is the most common type of transformer insulation oil in use, environmental and safety concerns has encouraged the development of biodegradable alternatives. Today, $Envirotemp^{(R)}\;FR3^{TM}$ is in commercial use and this study is aimed at ascertaining the possibility of applying the oil in Malaysia power transformers. A sample of $Envirotemp^{(R)}\;FR3^{TM}$ was tested to measure and compare the technical (including electrical, chemical and physical) properties of the oil according to Malaysian standards. The study found that the oil sample had better qualities, such as higher dielectric strength, lower dissipation factor, higher flash and fire points, higher moisture absorption capability, and less dissolved gases composition amongst others. However, it was also ascertained that further development in this area could be hindered due to Malaysia's lack of standards for biodegradable oil.

GSM/CDMA 대역용 LTCC Diplexer 설계 연구 (Study on a LTCC Diplexer Design for GSM/CDMA Applications)

  • 김태완;이영철
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2008년도 추계종합학술대회 B
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    • pp.632-635
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    • 2008
  • 본 논문에서는 LTCC 다층회로 기술을 이용하여 GSM/CDMA 대역을 분리하는 Diplexer를 설계하였다. Diplexer의 집적도를 높이기 위해 3차원 적층형 인덕터와 커패시터를 이용하여 설계되었다. Diplexer는 유전율 7.2인 총 6층의 LTCC 기판에 설계되었고, 설계 되어진 다이플렉서의 크기는 CB-CPW pad를 포함하여 $3,450{\times}4,000{\times}600{\mu}m^3$이다. GSM 대역의 통과 필터는 -0.23dB 이하의 삽입 손실과 -10dB 이하의 반사 손실, CDMA 대역의 통과 필터는 -0.53dB 이하의 삽입 손실과 -10dB 이하의 반사 손실의 특성을 보였다.

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Precise pressure sensor using piezoelectric nanocomposites integrated directly in organic field-effect transistors

  • Tien, Nguyen Thanh;Trung, Tran Quang;Seol, Young-Gug;Lee, Nae-Eung
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.500-500
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    • 2011
  • With recent advances in flexible and stretchable electronics, the development of physically responsive field-effect transistors (physi-FETs) that are easily integrated with transformable substrates may enable the omnipresence of physical sensing devices in electronic gadgets. However, physical stimuli typically induce whole sensing physi-FET devices under global influences that also cause changes in the parameters of FET transducers, such as channel mobility and dielectric capacitance that prevent proper interpretations of response in sensing materials. Extended-gate structures with isolated stimuli have been used recently in physi-FETs to demonstrate performances of sensing materials only. However, such approaches are limited to prototype researches since isolated stimuli rarely occur in real-life applications. In this report, we theoretically and experimentally demonstrated that integrating piezoelectric nanocomposites directly into flexible organic FETs (OFETs) as gate dielectrics provides a general research direction to physi-FETs with a simple device structure and the capability of precisely investigating functional materials. Measurements with static stimulations, which cannot be performed in conventional systems, exhibited giant-positive d33 values of nanocomposites of barium titanate (BT) NPs and poly (vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)).

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GIS내에서 금속이물이 절연파괴에 미치는 영향 (The Effect of Conducting Particles on Breakdown Phenomena in GIS)

  • 김민규;문인옥;김윤택;김익수;이형호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1994년도 하계학술대회 논문집 C
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    • pp.1574-1576
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    • 1994
  • $SF_6$ gas has become an important insulation medium in modern electric power apparatus, because of its high insulation withstand levels and good arc quenching capability. For the application of $SF_6$ gas in GIS the estimation of insulation properties is a fundamental point. Moreover the reduction of withstand levels in case of inhomogeneous fields caused by particles or fixed protrusions is of special interest. It is known that the presence of free conducting particles in GIS can significantly lower the insulating level of $SF_6$ gas at elevated pressure and also it has been recently shown that dielectric strength is greatly reduced by fast transients such as disconnector surges where metallic particles are involved. In this paper, we have disigned the particle test chamber rated 362kV for the purpose of investigating the discharge characteristics in SF6 gas where inhomogenius fields are caused by metallic particles.

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MEMS-IR SENSOR용 식각-접합-박막증착 기반공정 (Etching-Bonding-Thin film deposition Process for MEMS-IR SENSOR Application)

  • 박윤권;주병권;박흥우;박정호;염상섭;서상희;오명환;김철주
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 하계학술대회 논문집 G
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    • pp.2501-2503
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    • 1998
  • In this paper, the silicon-nitride membrane structure for IR sensor was fabricated through the etching and the direct bonding. The PTO layer as a IR detection layer was deposited on the membrane and its characteristics were measured. The attack of PTO layer during the etching of silicon wafer as well as the thermal isolation of the IR detection layer can be solved through the method of bonding/etching of silicon wafer. Because the PTO layer of c-axial orientation raised thermal polarization without polling, the more integration capability can be achieved. The surface roughness of the membrane was measured by AFM, the micro voids and the non-contacted area were inspected by IR detector, and the bonding interface was observed by SEM. The polarization characteristics and the dielectric characteristics of the PTO layer were measured, too.

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접지평면상의 공간에 위치한 마이크로스트립 페치 단일 안테나와 배열 안테나에 의한 산란과 복 사에 관한 혼합유한요소법 해석 (An Analysis of the Hybrid Finite Element Method for Scattering and Radiation by Microstrip Patch Antennas and Arrays Residing in a Cavity in a Ground Plane)

  • 안중수;박동희;권희훈
    • 한국통신학회논문지
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    • 제19권12호
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    • pp.2468-2478
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    • 1994
  • 혼합유한요소법은 접지평면내의 구멍에 존재하는 마이크로스트립 패치 단일 및 병렬안테나의 전자파 산란과 복사성질의 특성화에 대해 제시되었다. 해석방법은 개구부상에서 전자장과 자유공간에서 R.C.S(Radar Cross Section)와 산란 전자장의 해에 대한 계통적 수식화를 위해 유한요소법과 경제적분법을 혼합한다. 제시된 방법은 유한요소법의 특성에 따라 손실 및 무손실 유전체 기판상에 존재하거나 박힌 단일 및 병렬 패치안테나에 적용할 수 있고, 또한 여러형태의 여기구조를 다룰 수 있다. 여러 수치적 결과들을 제시된 방법의 타당성, 효율성 그리고 가능성을 입증하기 위해 제시되었다

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