• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Transactions of Materials Processing
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• v.13 no.8
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• pp.663-670
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• 2004

The bending phenomenon has been known to be occurred by the difference of velocity at the die exit. The difference of velocity at the die exit section can be obtained by the different velocity of billets through the multi-hole container. The difference of velocity at the die exit can be controlled by the two variables, the one of them is the different velocity of extrusion punch through the multi-hole container, the other is the difference of hole diameter of muliti-hole container. In this paper the difference of hole diameter is applied. So it can bend during extruding products because of the different amount of two billets when billets would be bonded in the porthole dies cavity. And the bending curvature can be controlled by the size of holes. The experiments with aluminum material for the curved tube product had been done for circular or rectangular curved tube section. The results of the experiments show that the curved tube product can be formed by the extru-bending process without the defects such as distortion of section and thickness change of wall of tube and folding and wrinkling. The curvature of product can be controlled by shape of cross section and the difference of billet diameters. And it is known that the bonding and extruding and bending process can be done simultaneously in the die cavity by the experiments that rectangular hollow curved tubes could be extruded by porthole dies with four different size billets made of aluminum material. And it shows that bending phenomenon can happen during extruding with for different billets from the analysis by DEFORM-3D.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.4
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• pp.79-85
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• 2007

This study was focused on the feasibility of ultrasonic bonding of Au stud flip chip bumps on the flexible printed circuit board (FPCB) with three different surface finishes: organic solderability preservative (OSP), electroplated Au and electroless Ni/immersion Au (ENIG). The Au stud flip chip bumps were successfully bonded to the bonding pads of the FPCBs, irrespective of surface finish. The bonding time strongly affected the joint integrity. The shear force increased with increasing bonding time, but the 'bridge' problem between bumps occurred at a bonding time over 2 s. The optimum condition was the ultrasonic bonding on the OSP-finished FPCB for 0.5 s.

• Design & Manufacturing
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• v.14 no.1
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• pp.15-21
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• 2020

Smart systems in different application areas such as automotive, medical and consumer electronics require a novel manufacturing method of electronic, optical and mechanical functions into products. Traditional methods including mechanical assembly, bonding of plastic and electronic circuit cause the problems in large size of products and complicated manufacturing processes. In this study, thermoforming and film insert molding were applied to fabricate a dome shaped plastic part embedded with electronic circuits. The deformation of patterns printed on PET film was predicted by thermoforming simulation using T-SIM, and the results were compared with those by experiment. In order to decrease spring-back after thermoforming, the Taguchi method of design of experiment was used. Through ANOVA analysis, it was found that mold temperature was the most dominant parameter for spring-back. By using flow analysis, gate design was performed to decrease injection pressure. During film insert molding, the wash-out of ink printed on film occurred for Polycarbonate. When the resin was changed to PMMA, the wash-out disappeared due to low melt temperature.

• Journal of Welding and Joining
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• v.32 no.3
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• pp.11-18
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• 2014

TSV(through silicon via) filling technology is making a hole in Si wafer and electrically connecting technique between front and back of Si die by filling with conductive metal. This technology allows that a three-dimensionally connected Si die can make without a large number of wire-bonding. These TSV technologies require various engineering skills such as forming a via hole, forming a functional thin film, filling a conductive metal, polishing a wafer, chip stacking and TSV reliability analysis. This paper addresses the TSV filling using Cu electrodeposition. The impact of plating conditions with additives and current density on electrodeposition will be considered. There are additives such as accelerator, inhibitor, leveler, etc. suitably controlling the amount of the additive is important. Also, in order to fill conductive material in whole TSV hole, current wave forms such as PR(pulse reverse), PPR(periodic pulse reverse) are used. This study about semiconductor packaging will be able to contribute to the commercialization of 3D TSV technology.

• Design & Manufacturing
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• v.13 no.4
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• pp.17-22
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• 2019

Currently, studies on weight reduction and fuel efficiency increase are the most important topics in the automotive industry and many studies are under way. Among them, weight reduction is the best way to raise fuel efficiency and solve environmental pollution and resource depletion. Materials such as aluminum, magnesium and carbon curing materials can be found in lightweight materials. Among these, research on improvement of bonding technology and manufacturing method of materials and improvement of material properties through study of ultrahigh strength steel sheet is expected to be the biggest part of material weight reduction. As the strength of the ultra hight strength steel sheet increases during forming, it is difficult to obtain the dimensional accuracy as the elastic restoring force increases compared to the hardness or high strength steel sheet. It is known that the spring back phenomenon is affected by various factors depending on the raw material and processing process. We have conducted analytical evaluations and studies to analyze the springback that occurs according to the cross-sectional shape of the ultra high tensile steel sheet.

• Journal of the Korean Society for Precision Engineering
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• v.28 no.10
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• pp.1204-1209
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• 2011

In this study, fatigue life is evaluated by comparing with lighter car body through the experiment on SPR joints. An experimental activity on sheet metal samples of Aluminum 5J32 and Steel SPRC440 has been conducted to achieve better understanding of the process. In addition, SPR joint used less than the existing Spot Welding improves joint strength and fatigue life is evaluated by using SPR and adhesive joining Hybrid. Joining(bonding) strength and fatigue life on SPR and Hybrid (SPR + adhesive) are evaluated throughout the experiment. With joining strength than 20 % of the aluminum material, dissimilar materials has improved over 2 times as large as the strength In case of dissimilar materials, the fatigue life of aluminum is increased by 1.6 to 2.5 times as large as the life.

• Korean Journal of Metals and Materials
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• v.47 no.4
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• pp.261-266
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• 2009

The mechanical and electrical properties of ball grid array (BGA) solder joints were measured, consisting of Sn-3.5Ag, with organic solderability preservative (OSP)-finished Cu pads and Electroless Nickel/Immersion Gold (ENIG) surface finishes. The mechanical properties were measured by die shear test. When ENIG PCB was upper joint and OSP PCB was lower joint, the highest shear force showed at the third reflow. When OSP PCB was upper joint and ENIG PCB was lower joint, the highest shear force showed at the forth reflow. For both joints, after the die shear results reached the highest shear force, shear force decreased as a function of increasing reflow number. Electrical property of the solder joint decreased with the function of increasing reflow number. The scanning electron microscope results show that the IMC thickness at the bonding interface gets thicker while the number of reflow increases.

• Archives of Metallurgy and Materials
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• v.66 no.4
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• pp.1033-1036
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• 2021

Laser cladding is a method that can be applied to repair the crack and break on the mold and die surfaces, as well as generate new attributes on the surface to improve toughness, hardness, and corrosion resistance. It is used to extend the life of the mold. It also has the advantages of superior bonding strength and precision coating on a local area compared with the conventional thermal spraying technology. In this study, we investigated the effect of cladding on low carbon alloy steel using 18%Cr-2.5%Ni-Fe powder (Rockit404), which showed high hardness on the die surface. The process conditions were performed in an argon atmosphere using a diode laser source specialized for 900-1070 nm, and the output conditions were 5, 6, and 10 kW, respectively. After the cladding was completed, the surface coating layer's shape, the hardness according to the cross-section's thickness, and the microstructure were analyzed.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.79-84
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• 2016

A flexible electronic device deformed by external force causes the failure of a semiconductor die. Even without failure, the repeated elastic deformation changes carrier mobility in the channel and increases resistivity in the interconnection, which causes malfunction of the integrated circuits. Therefore it is desirable that a semiconductor die be placed on a neutral line where the mechanical stress is zero. In the present study, we investigated the effects of design factors on the position of neutral line by finite element analysis (FEA), and expected the possible failure behavior in a flexible face-down packaging system assuming flip-chip bonding of a silicon die. The thickness and material of the flexible substrate and the thickness of a silicon die were considered as design factors. The thickness of a flexible substrate was the most important factor for controlling the position of the neutral line. A three-dimensional FEA result showed that the von Mises stress higher than yield stress would be applied to copper bumps between a silicon die and a flexible substrate. Finally, we suggested a designing strategy for reducing the stress of a silicon die and copper bumps of a flexible face-down packaging system.