• 한국결정성장학회지
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• 제4권2호
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• pp.134-138
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• 1994

표면탄성파 소자응요을 위하여 완전용융조성, 48.65 mole % $Li_2O에서 LiTaO_3(LT)$ 단결정(Y, X-axis)을 육성하였다. 육성된 $LiTaO_3(LT)$ 단결정의 SAW 소자성능을 확인하기 위하여 photolithography를 거쳐 기본적인 SAW filter를 제작하였다. Yamaju LT Y-cut 단결정 기판과 본 연구에서 제작된 RIST LT Y-cut 단결정 기판에서의 SAW특성결과를 비교하여 성능을 결정하였다. Yamaju LT 기판에서보다 본 연구에서 육성된 LT 단결정 기판에서 우수한 SAW 성능을 보였다.

• 마이크로전자및패키징학회지
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• 제30권3호
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• pp.88-93
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• 2023

고대역폭 메모리(HBM)에 대한 수요가 증가하고 직경이 더 큰 웨이퍼의 핸들링 기술이 발전함에 따라 본딩 웨이퍼의 두께 균일성에 대해 신뢰성을 확보할 수 있는 측정 방법이 요구되고 있다. 본 연구에서는 300mm 웨이퍼를 대상으로 웨이퍼의 전 영역에 대해 TTV를 측정할 수 있는 모듈을 설계 제직하고, 측정 모듈의 설계를 바탕으로 발생할 수 있는 측정 오차를 분석하였으며, 웨이퍼의 처짐과 척의 기구적 오차를 고려한 모델 해석을 통해 예측된 기울기 값에 따른 측정 오차를 추정하였다. TTV 측정 모듈은 웨이퍼 지지를 위한 센터 척과 리프트 핀을 활용하여 웨이퍼의 전체 영역에 대해 측정이 가능하도록 하였다. 모달 해석을 통해 모듈의 구조적 안정성을 예측하였으며, 구동부와 측정부 모두 100Hz 이상의 강성을 갖는 것을 확인하였다. 설계된 모듈의 측정 오차를 예측한 결과 두께 1,500um의 본딩 웨이퍼를 측정할 경우 예측된 측정 오차는 1.34nm로 나타났다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.463-464
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• 2013

• 한국정밀공학회지
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• 제22권12호
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• pp.34-41
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• 2005

There is a strong demand fur the contactless transportation device fur a hard disk and silicon wafer without contaminating and damaging them. To fulfill this requirements, A transportation device fur them has been proposed. But the device needs many of costly displacement sensors positioned along the transportation interval and possesses a very complicated controller and driving scheme. To overcome those kinds of drawback, in this paper, we present a very simple and cost-effective transportation device which only consists of a linear guide, very simple electrostatic suspension system and driving circuit of stepping motor. The principle of stable suspension by relay feedback control, derivation of lateral restoring force, the design of transportation system are described, fellowed by the experimental system. Experimental results show that a 3.5-inch hard disk has been transported with a speed of approximately 20mm/s while being suspended stably at a gap of 0.25mm.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2000년도 추계학술대회 논문집 학회본부 C
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• pp.467-469
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• 2000

We give pressure stimulation into organic thin films and then manufacture a device under the accumulation condition that the state surface pressure is 20[mN/m]. LB layers of Arac. acid deposited by LB method were deposited onto Y-type silicon wafer as x, y, z-type film. In processing of a device manufacture, we can see the process is good from the change of a surface pressure for organic thin films and transfer ratio of area per molecule. The structure of manufactured device is Au/arachidic acid/Al, the number of accumulated layers Also, we then examined of the MIM device by means of I-V. The I-V characteristic of the device is measured from 0 to +2[V].

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.287-290
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• 2000

We give pressure stimulation into organic thin films and then manufacture a device under the accumulation condition that the state surface pressure is 20[mN/m]. LB layers of Arac. acid deposited by LB method were deposited onto y-type silicon wafer as x, y, z-type film. In processing of a device manufacture, we can see the process is good from the change of a surface pressure for organic thin films and transfer ratio of area per molecule. The structure of manufactured device is Au/arachidic acid/Al, the number of accumulated layers. Also, we then examined of the MIM device by means of I-V. The I-V characteristic of the device is measured from 0 to +2[V].

• 한국진공학회지
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• 제15권3호
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• pp.280-286
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• 2006

디지털 합금 (digital-alloy) 성장방법을 사용한 AIGaAs층을 이용하여 $1.3{\mu}m$ vertical cavity surface emitting laser (VCSEL)에 사용될 수 있는 AlGaAs/GaAs distributed Bragg reflector (DBR)를 분자선 에피탁시 (molecular beam epitaxy) 방법을 통해 제작하였다. 3인치 1/4 크기의 기판에 디지털 합금 AlGaAs층을 사용한 DBR을 성장하고 기판 여러 부분에서의 반사율을 측정하여 각 부분 간의 반사율 편차가 0.35%이내임을 확인하였다. TEM 사진을 통한 계면분석을 통해 디지털 합금 AlGaAs층의 조성과 두께가 균일함을 확인하였는데, 이는 디지털 합금 AlGaAs층의 성장시 기판 표면의 온도가 불균일하더라도 크게 영향을 받지 않음을 보여준다. 이를 통해 DBR의 균일성에 따라 소자의 특성에 큰 영향을 받는 InAs 양자점을 활성층으로 사용하는 VCSEL의 수율을 향상시키는데 디지털 합금 AlGaAs층을 이용한 DBR이 응용될 수 있음을 보였다.

• 대한기계학회논문집B
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• 제26권4호
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• pp.524-530
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• 2002

Micro electric spark discharge device was fabricated on a FOTURAN glass wafer using MEMS processing technique and its performance of electron discharge and subsequent formation of ignition kernel were tested. Micro electric spark device is an essential subsystem of a power MEMS that has been under development in this laboratories. In a combustion chamber of sub millimeter scale depth, spark electrodes are formed by electroplating Ni on a base plate of FOTURAN glass wafer. Optimization of spark voltage and spark gap is crucial for stable ignition and endurance of the electrodes. Namely, wider spark gaps insures stable ignition but requires higher ignition voltage to overcome the spark barrier. Also, electron discharge across larger voltage tends to erode the electrodes limiting the endurance of the overall system. In the present study, the discharge characteristics of the proptotype ignition device was measured in terms of electric quantities such as voltage and currant with spark gap and end shape as parameters. Discharge voltage shows a little decrease in width of less than 50㎛ and increases with electrode gap size. Reliability test shows no severe damage over 10$\^$6/ times of discharge test resulting in satisfactory performance for application to proposed power MEMS devices.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.545-545
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• 2008

Poly-Si is an essential material for floating gate in NAND Flash memory. To fabricate this material within region of floating gate, chemical mechanical polishing (CMP) is commonly used process for manufacturing NAND flash memory. We use colloidal silica abrasive with alkaline agent, polymeric additive and organic surfactant to obtain high Poly-Si to SiO2 film selectivity and reduce surface defect in Poly-Si CMP. We already studied about the effects of alkaline agent and polymeric additive. But the effect of organic surfactant in Poly-Si CMP is not clearly defined. So we will examine the function of organic surfactant in Poly-Si CMP with concentration separation test. We expect that surface roughness will be improved with the addition of organic surfactant as the case of wafering CMP. Poly-Si wafer are deposited by low pressure chemical vapor deposition (LPCVD) and oxide film are prepared by the method of plasma-enhanced tetra ethyl ortho silicate (PETEOS). The polishing test will be performed by a Strasbaugh 6EC polisher with an IC1000/Suba IV stacked pad and the pad will be conditioned by ex situ diamond disk. And the thickness difference of wafer between before and after polishing test will be measured by Ellipsometer and Nanospec. The roughness of Poly-Si film will be analyzed by atomic force microscope.

• 한국전기전자재료학회논문지
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• 제19권12호
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• pp.1073-1077
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• 2006

Proton irradiation technology was used for improvement of switching characteristics of the PT-IGBT. Proton irradiation was carried out at 5.56 MeV energy with $1{\times}10^{12}/cm^2$ doze from the back side of the wafer. The I-V, breakdown voltage, and turn-off delay time of the device were analyzed and compared with those of un-irradiated device and e-beam irradiated device which was conventional method for minority carrier lifetime reduction. For proton irradiated device, the breakdown voltage and the on-state voltage were 733 V and 1.85 V which were originally 749 V and 1.25 V, respectively. The turn-off time has been reduced to 170 ns, which was originally $6{\mu}s$ for the un-irradiated device. The proton irradiated device was superior to e-beam irradiated device for the breakdown voltage and the on-state voltage which were 698 V and 1.95 V, respectively, nevertheless turn-off time of proton irradiated device was reduced to about 60 % compared to that of the e-beam irradiated device.