• Title/Summary/Keyword: Deposition system

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New SMOLED Deposition System for Mass Production

  • Lee, J.H.;Kim, C.W.;Choi, D.K.;Kim, D.S.;Bae, K.B.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.407-410
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    • 2003
  • We will introduce our new concept deposition system for SMOLED manufacturing in this conference. This system is designed to deposit organic and metal material to downward to overcome the limit of substrate size and process tact time hurdle for OLED mass production, and is organized with organic deposition chamber, substrate pre-cleaning chamber, metal deposition chamber and encapsulation system. These entire process chambers are integrated with linear type substrate transfer system. We also compare our new SMOLED manufacturing system with conventional vacuum deposition systems, and show basic organic thin film property data, organic material deposition property data, and basic device property.

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Development of Sheet Deposition Type Rapid Prototyping System Minimizing Post Processing (후처리를 최소화하는 판재적층방식 쾌속조형기의 개발)

  • Cho, In-Haeng;Lee, Kun-Woo;Song, Yong-Ak
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.7
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    • pp.210-218
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    • 1999
  • Sheet deposition type rapid prototyping system have many advantages : high build speed, low operating cost, large part size, no phase change, no need for support generation, and forth. However, those sheet deposition type rapid prototyping system require an additional post processing to remove excessive material attached to the part. This post processing is time consuming and labor intensive. Moreover, it is difficult for those system to fabricate parts with hollow cores and internal cavities. A new sheet deposition type rapid prototyping system that minimizes the post processing is proposed. The proposed system automatically removes excessive material in a peeling-off process between two cutting processes. In this way, the proposed system can reduce the post-processing time and cost as well as the limitation of the feasible geometric shapes in the conventional sheet deposition system.

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Simulation and Characteristic Measurement with Sputtering Conditions of Triode Magnetron Sputter

  • Kim, Hyun-Hoo;Lim, Kee-Joe
    • Transactions on Electrical and Electronic Materials
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    • v.5 no.1
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    • pp.11-14
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    • 2004
  • An rf triode magnetron sputtering system is designed and installed its construction in vacuum chamber. In order to calibrate the rf triode magnetron sputtering for thin films deposition processes, the effects of different glow discharge conditions were investigated in terms of the deposition rate measurements. The basic parameters for calibrating experiment in this sputtering system are rf power input, gas pressure, plasma current, and target-to-substrate distance. Because a knowledge of the deposition rate is necessary to control film thickness and to evaluate optimal conditions which are an important consideration in preparing better thin films, the deposition rates of copper as a testing material under the various sputtering conditions are investigated. Furthermore, a triode sputtering system designed in our team is simulated by the SIMION program. As a result, it is sure that the simulation of electron trajectories in the sputtering system is confined directly above the target surface by the force of E${\times}$B field. Finally, some teats with the above 4 different sputtering conditions demonstrate that the deposition rate of rf triode magnetron sputtering is relatively higher than that of the conventional sputtering system. This means that the higher deposition rate is probably caused by a high ion density in the triode and magnetron system. The erosion area of target surface bombarded by Ar ion is sputtered widely on the whole target except on both magnet sides. Therefore, the designed rf triode magnetron sputtering is a powerful deposition system.

Studies on the Dissolution Rate of Phenylbutazone Deposited on Excipients by Solvent Deposition Method (용매침착법을 이용한 페닐부타존의 용출속도에 관한 연구)

  • 용재익;손영옥
    • YAKHAK HOEJI
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    • v.29 no.3
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    • pp.124-129
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    • 1985
  • A dissolution characteristics of phenylbutazone deposited on Avicel and dibasic calcium phosphate by solvent deposition method were studied. The solvent deposition was confirmed by scanning electron microscopy. Avicel was superior to dibasic calcium phosphate as excipient in dissolution rate. Total amount of phenylbutazone dissolved from Avicel deposition system at 30minutes were enhanced 1.2-1.6 times compared with physical mixtures of them. The dissolution rate of 10% solvent deposition system was highest and that of 75% solvent deposition system was lowest in Avicel system and dibasic calcium phosphate system. Dissolution profile of commercial products was dependent on manufacturing conditions and dissolution rate of 10% Avicel system was greater than that of commercial products.

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Studies on Dissolution Rate of Flurbiprofen from Solvent Deposition Systems (Flurbiprofen 용매침착물(溶媒沈着物)의 용출특성(溶出特性)에 관(關)한 연구(硏究))

  • Choi, Bo-Kyung;Yong, Jae-Ick
    • Journal of Pharmaceutical Investigation
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    • v.15 no.3
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    • pp.100-112
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    • 1985
  • Dissolution characteristics of flurbiprofen solvent deposited on ${\alpha}-cyclodextrin$, ${\beta}-cyclodextrin$, lactose and corn starch were studied to evaluate the pharmaceutical aspects of solvent deposition method where drug was solvent deposited on the surface of excipients. In a solvent deposition system, the drug to excipient ratio and kind of excipient affect much on dissolution rates of flurbiprofen. The solvent deposition system formation was confirmed by scanning electron microscope. By increasing the amounts of matrix, it was possible to enhance the dissolution rate of flurbiprofen solvent deposition system. The amount of flurbiprofen dissolved from ${\beta}-cyclodextrin$ deposition system (1:10) at 60 minutes was enhanced 6.5 times in water and 28 times in simulated gastric juice compared with flurbiprofen alone. Flurbiprofen solvent deposited system (1:10) enhanced dissolution rate greater than inclusion complex and dispersion system.

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Development of the Novel Dry and Wet Deposition Collector (새로운 건성 및 습성 침착 채취기의 개발)

  • 이병규;이채복
    • Journal of Korean Society for Atmospheric Environment
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    • v.16 no.6
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    • pp.675-684
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    • 2000
  • A novel dry and wet deposition collector, which can overcome the several problems such as water evaporation cartridge cracks and high costs founded in the previous collector systems, has been constructed. ENVI-18 SPE adsorption cartridge has been used to measure atmospheric deposition of polycylic aromatic hydrocarbons (PAHs). A surrogate surface, consisted of water and methanol, was filled in the dry deposition funnel to simulate dry deposition onto water surface. A water supply system in order to compensat evaporation of the surrogate surface was used and it was consisted of a piston pump, a tubing pump, a overflow tube and a chamber system. A novel water vaporizing system to supply water onto the wet SPE cartridge system with a constant flow rate was developed. The novel water vaporizing system, consisted of a vacuum pump, a water supply reserviour and tube and a mini space heater, could prevent the PAHs adsorption cartridge cracks occurred in the previous collector and effectively adsorb PAHs. The novel dry and wet deposition collector showed a good adsorption, desorption, and recovery rates of PAHs. By reducing the number of pumps used and employing polypyopylene (PP) instead of teflon as a material of collection funnel, the total construction costs were much reduced as compared with the previous dry and wet deposition collectors.

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Characteristic evaluations and production of triode magnetron sputtering system (Triode magnetron sputtering system의 제작 및 특성평가)

  • Kim, H.H.;Lee, M.Y.;Kim, K.T.;Yoon, S.H.;Yoo, H.K.;Kim, J.M.;Park, C.H.;Lim, K.J.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07b
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    • pp.787-790
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    • 2003
  • A rf triode magnetron sputtering system is designed and installed its construction in vacuum chamber. In order to calibrate the rf triode magnetron sputtering for thin films deposition processes, the effects of different glow discharge conditions were investigated in terms of the deposition rate measurements. The basic parameters for calibrating experiment in this sputtering system are rf power input, gas pressure, plasma current, and target-to-substrate distance. Because a knowledge of the deposition rate is necessary to control film thickness and to evaluate optimal conditions which are an important consideration in preparing better thin films, the deposition rates of copper as a testing material under the various sputtering conditions are investigated. Furthermore, a triode sputtering system designed in our team is simulated by the SIMION program. As a result, it is sure that the simulation of electron trajectories in the sputtering system is confined directly above the target surface by the force of $E{\times}B$ field. Finally, some teats with the above 4 different sputtering conditions demonstrate that the deposition rate of rf triode magnetron sputtering is relatively higher than that of the conventional sputtering system. This means that the higher deposition rate is probably caused by a high ion density in the triode and magnetron system. The erosion area of target surface bombarded by Ar ion is sputtered widely on the whole target except on both magnet sides. Therefore, the designed rf triode magnetron sputtering is a powerful deposition system.

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Construction of CVD by using RF Helicon Plasma (RF 헬리콘 플라즈마를 이용한 회학기상 증착기의 제작)

  • 신재균;현준원;박상규
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.8
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    • pp.607-612
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    • 1998
  • RF HPCVD(Helicon Plasma Chemical Vapor Deposition) has been successfully constructed for diamond thin films. The system consists of plasma generation tube, deposition chamber, pumping lines for gas system. A mixture of $CH_4 and H_2$is used for reaction. Two thermocouples, a quartz tube surrounded by a RF antenna and a magnet, and a high temperature heater were set up in the deposition chamber. The process for the thin film diamond deposition has been carried put in a high vacuum system at a substrate temperature of $800^{\circ}C$, and pressure of 5 mtorr. It is also demonstrated. that the RF HPCVD system has advantages for controlling deposition parameters easily.

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Implementing a Simultaneous Pattern Measurement System for Measuring the Size of the Standard Pattern and the Deposition Pattern of an OLED Panel (OLED 패널의 기준패턴과 증착패턴의 크기 측정을 위한 패턴 동시 측정 시스템의 구현)

  • Kwak, Byeong Ho;Cheoi, Kyung Joo
    • Journal of Korea Multimedia Society
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    • v.22 no.2
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    • pp.117-127
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    • 2019
  • Simultaneous pattern measurement system is new research subject for OLED panel inspection. It is defect inspection of OLED panel after deposition. This research suggests the system that calculates the size and center point of each patterns after obtaining standard and deposition pattern as one image. This system could be applied to OLED manufacturing process. The research result shows that the size and center point of each patterns could be obtained by displaying the standard pattern and deposition pattern in one image.

Particle Deposition Characteristics with Electrostatic Effect on Semiconductor Wafers (정전효과를 고려한 반도체 웨이퍼의 입자침착 특성)

  • Lee, Kun-Hyung;Chae, Seung-Ki;Moon, Young-June
    • Proceedings of the SAREK Conference
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    • 2006.06a
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    • pp.779-785
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    • 2006
  • Particle transport and deposition characteristics on semiconductor wafers inside the chamber were experimentally investigated via a particle generation & deposition system and a wafer surface scanner. Especially the relation between particle size($0.083{\sim}0.495{\mu}m$) and particle deposition velocity with ESA(Electrostatic Attraction) effect was studied. Spot deposition technique with the deposition system using nozzle type outlets of the chamber was newly conducted to derive particle deposition velocity and all experiment results were compared with the previous study and were in a good agreement as well.

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