• Title/Summary/Keyword: Deposition distance

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Preparation of Nb doped SrTiO$_3$ Film by Pulsed Laser Deposition and Optimum Processing Conditions (Plused Laser Depositon을 이용한 Nb doped SrTiO$_3$ 박막의 제작과 최적 조건)

  • ;Seishiro Ohya
    • Journal of the Korean Ceramic Society
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    • v.36 no.2
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    • pp.116-121
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    • 1999
  • 0.5 wt%Nb-doped SrTiO3(Nb: STO) thin film was prepared on MgO(100) single crystal substrates by Pulsed Laser Deposition (PLD). The Crystallinity and the orientation of Nb:STO thin films were characterized by XRD with changing the thin film processing condition-oxygen partial pressure, substrate temperature, deposition time and the distance between target and substrate. The orientation of Nb:STO thin film showed (100), (110) and (111) orientations at the substrate temperature of $700^{\circ}C$. The lattice parameter of Nb:STO decreased with increasing Po2 and showed 0.3905 nm at Po2=100 Pa, which was similar to that of the bulk. The thickness of Nb:STO thin film increased with increasing the deposition time and with decreasing the distance between target and substrate.

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Deposition Pressure Dependent Electric Properties of (Hf,Zr)O2 Thin Films Made by RF Sputtering Deposition Method

  • Moon, S.E.;Kim, J.H.;Im, J.P.;Lee, J.;Im, S.Y.;Hong, S.H.;Kang, S.Y.;Yoon, S.M.
    • Journal of the Korean Physical Society
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    • v.73 no.11
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    • pp.1712-1715
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    • 2018
  • To study the applications for ferroelectric non-volatile memory and ferroelectric memristor, etc., deposition pressure dependent electric the properties of $(Hf,\;Zr)O_2$ thin films by RF sputtering deposition method were investigated. The bottom electrode was TiN thin film to produce stress effect on the formation of orthorhombic phase and top electrode was Pt thin film by DC sputtering deposition. Deposition pressure was varied along with the same other deposition conditions, for example, sputtering power, target to substrate distance, post-annealing temperature, annealing gas, annealing time, etc. The structural and electric properties of the above thin films were investigated. As a result, it is confirmed that the electric properties of the $(Hf,\;Zr)O_2$ thin films depend on the deposition pressure which affects structural properties of the thin films, such as, structural phase, ratio of the constituents, etc.

Numerical Modeling for GaN Deposition by MOCVD: Effects of the Gas Inlet

  • Yang, Wonkyun;Joo, Junghoon
    • Applied Science and Convergence Technology
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    • v.23 no.3
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    • pp.139-144
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    • 2014
  • GaN deposition equipment and processes for the fabrication of white LEDs (Light Emitting Diode) using MOCVD (Metal Organic Chemical Vapor Deposition) were numerically modeled to analyze the effects of a reactive gas introduction strategy. The source gases, TMGa and $NH_3$, were injected from a shower head at the top of the chamber; the carrier gases, $H_2$ or $N_2$, were introduced using two types of injection structures: vertical and horizontal. Wafers sat on the holder at a radial distance between 100 mm and 150 mm. The non-uniformity of the deposition rates for vertical and horizontal injection were 4.3% and 3.1%, respectively. In the case of using $H_2$ as a carrier gas instead of $N_2$, the uniform deposition zone was increased by 20%.

Characterization of $Al_2O_3$, Thin Film Deposited by Aerosol Deposition Method (에어로졸 증착법에 의한 $Al_2O_3$ 박막의 증착 및 특성 평가)

  • Cho, Hyun-Min;Kim, Hyeong-Joon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.24-24
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    • 2007
  • Aerosol deposition(AD) method is a emerging technology for the room temperature deposition of the dielectric thin films with high quality. In this study, $Al_2O_3$ thin films were deposited by aerosol deposition method directly from raw powders. To get uniform and smooth film surface, Process parameters such as gas consumption rate, nozzle-substrate distance and vibration speed were optimized. From XRD results, $Al_2O_3$ thin films have the same crystal structures with starting powders. $Al_2O_3$ thin films also showed dense microstructure. Electrical properties of the thin films were also investigated.

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Simulation and Characteristic Measurement with Sputtering Conditions of Triode Magnetron Sputter

  • Kim, Hyun-Hoo;Lim, Kee-Joe
    • Transactions on Electrical and Electronic Materials
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    • v.5 no.1
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    • pp.11-14
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    • 2004
  • An rf triode magnetron sputtering system is designed and installed its construction in vacuum chamber. In order to calibrate the rf triode magnetron sputtering for thin films deposition processes, the effects of different glow discharge conditions were investigated in terms of the deposition rate measurements. The basic parameters for calibrating experiment in this sputtering system are rf power input, gas pressure, plasma current, and target-to-substrate distance. Because a knowledge of the deposition rate is necessary to control film thickness and to evaluate optimal conditions which are an important consideration in preparing better thin films, the deposition rates of copper as a testing material under the various sputtering conditions are investigated. Furthermore, a triode sputtering system designed in our team is simulated by the SIMION program. As a result, it is sure that the simulation of electron trajectories in the sputtering system is confined directly above the target surface by the force of E${\times}$B field. Finally, some teats with the above 4 different sputtering conditions demonstrate that the deposition rate of rf triode magnetron sputtering is relatively higher than that of the conventional sputtering system. This means that the higher deposition rate is probably caused by a high ion density in the triode and magnetron system. The erosion area of target surface bombarded by Ar ion is sputtered widely on the whole target except on both magnet sides. Therefore, the designed rf triode magnetron sputtering is a powerful deposition system.

Fabrication of Thin $YBa_{2}Cu_{3}O_{7-\delta}$ Films on $CeO_2$Buffered Sapphire Substrate Using Combined Sputter and Pulsed Laser Deposition (스퍼터링과 펄스 레이저를 이용하여 $CeO_2$완충층 위에 층착된 $YBa_{2}Cu_{3}O_{7-\delta}$박막의 제작)

  • 곽민환;강광용;김상현
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.901-904
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    • 2001
  • For the c-axis oriented epitaxial YBa$_2$Cu$_3$O$_{7-{\delta}}$ thin film on r-cut sapphire substrate it is necessary to deposit buffer layers. The CeO$_2$buffer layer was deposited on sapphire substrate using RF magnetron sputtering system. We investigated XRD pattern of CeO$_2$thin films at various sputtering conditions such as sputtering gas ratio, sputtering power, target to substrate distance, sputtering pressure and substrate temperature. The optimum condition was 15 mTorr with deposition pressure, 1:1.2 with $O_2$and Ar ratio and 9cm with target to substrate distance. The CeO$_2$(200) peak was notable for a deposition temperature above 75$0^{\circ}C$. The YBa$_2$Cu$_3$O$_{7-{\delta}}$ was deposited on CeO$_2$buffered r-cut sapphire substrate using pulsed laser ablation. The YBa$_2$Cu$_3$O$_{7-{\delta}}$CeO$_2$(200)/A1$_2$O$_3$thin film was exhibited a critical temperature of 89K.xhibited a critical temperature of 89K.

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The Simulation of Si quantum Dot Formation in PVD Process (PVD 공정을 이용한 Si 양자점 형성 전산모사)

  • Kim, Yun-Sung;Chung, Yong-Chae
    • Journal of the Korean Ceramic Society
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    • v.39 no.5
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    • pp.517-522
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    • 2002
  • In this study, the effect of the processing parameters in PVD process on the size and the distribution of deposited Si quantum dots was quantitatively investigated by computational simulation utilizing Monte Carlo method. The processing parameters, substrate temperature, deposition time, gas pressure and target-substrate distance were selected as variables since those parameters are often selected as variables in PVD experiments. It is predicted that the density of $1{\times}10^{12}cm^{-2}$ Si quantum dots can be deposited on the substrate when the deposition rate is 0.05 nm/sec at the substrate temperature of 490${\circ}$, deposition time of 7 sec, gas pressure of 3 mTorr and target-substrate distance of 8 cm.

A Study on Fabrication of 3D Hydroxyapatite Scaffolds Using a Laser Sintering Deposition System (레이저 소결 적층 시스템을 이용한 3차원 수산화인회석 인공지지체 제작에 관한 연구)

  • Choi, Seung-Hyeok;Sa, Min-Woo;Kim, Jong Young
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.4
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    • pp.70-76
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    • 2022
  • Calcium-phosphate-based bioceramics are promising biomaterials for scaffolds because they can assist in bone regeneration. In this study, a laser sintering deposition system was developed, and 3D hydroxyapatite (HA) scaffolds were fabricated. The main process conditions of the HA scaffolds were laser power, table velocity, and laser focal distance. As the laser power increased, the line width, line height, and layer thickness also increased. Further, the line width, line height, and layer thickness decreased as the table velocity increased. As the laser focal distance increased, the line width increased, but the line height and layer thickness decreased. The fabricated green scaffolds were sintered at 1050 ℃ and 1150 ℃. The sintered scaffolds had a uniform and continuous interconnected shape, with pore sizes ranging from 850 to 950 ㎛ having 53% porosity. The compressive strength of the scaffolds decreased from 0.72 MPa (1050 ℃) to 0.53 MPa (1150 ℃). The biocompatibility of the scaffolds was investigated by analyzing the adhesion of osteoblast-like MG-63 cells cultured on the surfaces of the scaffolds. The results indicate that the scaffold sintered at 1050 ℃ had good mechanical and biological properties compared to that at 1150 ℃.

Amorphous Silicon Carbon Nitride Films Grown by the Pulsed Laser Deposition of a SiC-$Si_3N_4$ Mixed Target

  • Park, Nae-Man;Kim, Sang-Hyeob;Sung, Gun-Yong
    • ETRI Journal
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    • v.26 no.3
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    • pp.257-261
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    • 2004
  • We grew amorphous SiCN films by pulsed laser deposition using mixed targets. The targets were fabricated by compacting a mixture of SiC and $SiC-{Si_3}{N_4}$ powders. We controlled the film stoichiometry by varying the mixing ratio of the target and the target-to-substrate distance. The mixing ratio of the target had a dominant effect on the film composition. We consider the structures of the SiCN films deposited using 30~70 wt.% SiC in the target to be an intermediate phase of SiC and $SiN_x$. This provides the possibility of growing homogeneous SiCN films with a mixed target at a moderate target-to-substrate distance.

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Effect of Contact-tube to Work Distance on the Melting Rate of GMA Welding (GMA 용접의 용착속도에 미치는 Contact-tube와 모재간 거리의 영향)

  • 경규담;이정헌;천홍정;박병희;강봉룡;김희진
    • Journal of Welding and Joining
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    • v.14 no.5
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    • pp.87-94
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    • 1996
  • It has been well known in GMA welding process that wire feeding speed (WFS) or deposition rate increases linealy with the increase of wire extension. In this investigation, however, such an well-known relationship was .reconsidered in terms of contact-tube to work distance (CTWD) instead of wire extension. To verify the proposed relationship between WFS and CTWD, bead-on-plate welding was performed with various CTWDs in the range of 15∼35mm under the condition of near-constant voltage and current As expected, the test results showed an excellent linear relation between WFS and CTWD. Furthermore, the value of the slope turned out to be quite similar to those of previous investigators obtained either theoretically or experimentally through the Precise measurement of electrode extension. Present result also demonstred that the increase of CTWD could be very practical measure for increaring deposition rate without any increase of heat input Depending on the tip recess the practical maximum of CTWD was appeared to be limited somewhere in 25∼30mm mainly due to the entrappment of porocity.

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