• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2008년도 춘계학술대회 논문집
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• pp.607-608
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• 2008

• 한국생산제조학회지
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• 제23권2호
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• pp.127-132
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• 2014

Micro/nano-injection molding is one of the main processing techniques for polymer micro-fabrication. Most of the difficulties encountered in polymer micro-molding are caused by the demolding, rather than the filling of molds. Therefore, studying the demolding process is vitally important for manufacturing polymer replicas. The most important parameters are the thermal stress, friction and adhesion forces, and mechanical strength of the resist. In this research, we determinedthe effects of the processing conditions on the ejection force for cases involving two common thermoplastic polymers. The results showed that the processing conditions noticeably influenced the ejection force.

• 한국산학기술학회논문지
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• 제22권1호
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• pp.461-467
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• 2021

열경화성 소재를 이용하여 열경화방식의 웨이퍼 레벨 렌즈를 성형할 때 발생될 수 있는 불량요인 중 이형과정에서 성형 렌즈의 금형 고착문제는 웨이퍼 레벨에서 성형된 기판의 파손 및 기판의 변형으로 성형된 웨이퍼 기판의 적층시 웨이퍼 양면의 렌즈 형상 및 센터 정렬 오차에 영향을 미친다. 본 연구에서는 웨이퍼 레벨 렌즈 성형 공정에서 이형력에 영향을 미치는 인자를 검토하기 위한 실험을 수행하였다. 먼저 상·하 금형의 코팅 재질에 따른 이형력을 검토하기 위하여 금형 표면을 ITO 및 Ti로 표면처리 후 O2분위기에서 플라즈마 처리하였고, 또한 DLC 코팅도 진행하였으며 경화 및 이형성을 검토하였다. 그 결과를 바탕으로 pull-off 실험을 위한 코팅방법을 선정하였다. 또한 경화공정조건에 따른 이형력을 측정하기 위하여 압력을 유지하면서 경화시키는 방법과 일정한 간격을 유지하면서 경화시키는 방법을 실험적으로 적용하였다. 그 결과 Ti 코팅 후 O2 플라즈마 표면처리 방법이 이형력을 감소시키고 위치를 제어하면서 경화시킬 경우 경화수축에 의해 경화 중 계면의 접착에너지를 감소시켜 보다 나은 이형이 될 수 있음을 확인하였다.

• 대한기계학회논문집A
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• 제34권11호
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• pp.1649-1657
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• 2010

성형조건에 따른 GFRP 복합재료를 관찰하여, 성형품 표면의 불량원인을 조사했다. 표면거칠기에 영향을 주는 요철의 가장 주요한 발생원인은 보압 냉각 과정에서 발생하는 모재의 수축이었다. GFRP 복합재료 성형품 표면은 성형 시의 보압하중이 높을수록 좋아졌고, 서냉실험에서는 탈형온도가 낮을수록 성형품의 표면이 좋아졌다. 그리고 보압하중과 탈형온도를 고려하여, 성형품의 표면요철 생성과정과 섬유돌출 높이 변화를 규명했다.

• 반도체디스플레이기술학회지
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• 제16권4호
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• pp.68-74
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• 2017

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.284-289
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• 2004

Since polymer materials at elevated temperatures are usually rate-sensitive, the analysis of RTP process requires considering the effect of the rate-dependent. The material behavior that exhibits rate-sensitivity is called visco-plastic. A two-dimensional visco-plastic finite element formulation which constitutive equation is based on the formulation proposed by Perzyna is presented. This Paper is purposed to calcuate pressure distribution on PMMA in compression process and to predict the relationship with defects after demolding process. This paper analyzes, both analytically and numerically, the pressure distributions on the surface of PMMA during open-die RTP process. In this research, PMMA is used to be simulated at $110^{\circ}C$ near the transition temperature.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2004년도 추계학술대회논문집
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• pp.305-310
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• 2004

The Hot Embossing Lithography(HEL) as a method for the fabrication of nanostructure with polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this study, we investigated the characteristics of hot embossing lithography as a nanoreplication technique. To grasp characteristics of nano patterning rheology by process parameters(embossing temperature, pressure and time), we have carried out various experiments by using the DVD(400nm pattern width) and Blu-ray nickel stamps(150nm pattern width). During the hot embossing process, we have observed the characteristics of the size effect. The quality of products made by hot embossing is affected by its cooling shrinkage. The demolding process at the glass transition temperature results in low quality because of the shrinkage of the polymer. Therefore, the quantification of the temperature condition is essential for the replication of high quality.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권1호
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• pp.316-319
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• 2007

In this paper, high precision molding process was developed using a soft mold to fabricate fine closed-types of the barrier ribs for PDP. A green sheet was employed to fabricate the barrier ribs in this process. The soft mold with good demolding characteristics was replicated from a master mold. An optimal forming load which would not fracture the soft mold was also determined. The barrier ribs of rectangular type with upper width of $30\;{\mu}m$ would be fabricated by this process.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제51권4호
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• pp.175-183
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• 2002

In this paper, the surface modification effect of self-assembled monolayer(SAM) of 1-dodecanethiol [$CH_3$($CH_2$)$_{11}$SH] used as an anti-adhesive film in micromolding process was studied. Monolayers of 1-dodecanethiol[$CH_3$(CH$_2$)$_{11}$SH] were obtained by immersing a metal place in pure 1-dodecanethiol. SAM film on the nickel plate has been examined by using X-ray photoelectron spectroscopy(XPS). The focus has been placed on S-Ni bonding. From the XPS analysis, sulfur atoms were detected from the SAM film as a chemical composition of S-Ni. In order to measure an adhesion force of the SAM-coated nickel surface, atomic force microscopy(AFM) was used in force-distance mode, which whows the micro-adhesive force on solid surface. It was shown that adhesion forces measured from the SAM-coated nickel surface and the Ni surface without SAM coating were 3.52nN and 5.32nN, respectively. In order to investigate the effect of SAM coating on the surface foughness the replica in demolding process, hot embossing experiments were performed using a SAM-coated nickel master and a nickel master without SAM coating. Surface roughness of replica from the SAM-coated master showed 25nm and that of replica from master without SAM coating was 35nm. The smoother surface roughness of the replica from the SAM-coated, master is believed to result from reduction in the adhesion forces.ces.