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http://dx.doi.org/10.5762/KAIS.2021.22.1.461

A Study on the Release Characteristics During Wafer-Level Lens Molding Using Thermosetting Materials  

Park, Si-Hwan (Faculty of Mechanical Engineering, Ulsan College)
Hwang, Yeon (Korea Photonics Technology Institute)
Kim, Dai-Geun (Korea Photonics Technology Institute)
Publication Information
Journal of the Korea Academia-Industrial cooperation Society / v.22, no.1, 2021 , pp. 461-467 More about this Journal
Abstract
Among the defect factors that can occur when a wafer-level lens is molded using a thermosetting material, the mold sticking problem of a molded lens during the release process can damage the molded substrate and deform the substrate at the wafer level. An experiment was conducted to examine the factors affecting the demolding force in the lens forming process. The demolding force was examined according to the coating material of the molds. The mold was surface-treated with ITO and Ti, followed by plasma treatment in an O2 atmosphere. A DLC coating was then performed, and the curing and releasability were examined. A coating method for the pull-off experiment was selected based on the results. To measure the demolding force according to the curing process conditions, a method of curing at a constant pressure and a method of curing at a constant position were applied. As a result, the TiO2 surface treatment reduced the release force. When cured by controlling the location, curing shrinkage can reduce the adhesion energy of the interface during curing, resulting in better demolding.
Keywords
Wafer-Level Lens; Curing; Demolding Force; Thermosetting; Coating;
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Times Cited By KSCI : 1  (Citation Analysis)
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1 S. H. Lee, J. D. Jo, K. Y. Kim, Y. M. Choi, "Recent Research Trend of Micro Hot-Embossing", J. Korean Soc. Precis. Eng, Vol.35, No.11, pp.1027-1034, 2018. DOI: http://doi.org/10.7736/KSPE.2018.35.11.1027   DOI
2 S. H. Park, J. S. Moon, "Analysis of the shrinkage and warpage of Wafer lens during UV curing" Journal of the Korea Academia-Industrial cooperation Society, Vol.15, No.11 pp.6464-6471, 2014. DOI: https://doi.org/10.5762/KAIS.2014.15.11.6464   DOI
3 D. S. Baek, J. S. Nam, S. W. Lee, "A Development of Feature Extraction and Condition Diagnosis Algorithm for Lens Injection Molding Process", J. Korean Soc. Precis. Eng, Vol.31, No.11, pp.1031-1040, 2014. DOI: http://doi.org/10.7736/KSPE.2014.31.11.1031   DOI
4 H. S. Lee, W. T. Jeon, S. W. Kim, "Development of Plastic Lenses for High-Resolution Phone Camera by Injection-Compression Molding", Trans. Korean Soc. Mech. Eng. A, Vol.37, No.1, pp.39-46, 2013. DOI: https://doi.org/10.3795/KSME-A.2013.37.1.039   DOI
5 Y. Dagan, "Wafer-level optics enables low cost camera phones" Integrated Optics: Devices, Materials, and Technologies XIII, Proceedings of SPIE, Vol.7218, 72180P, Feb. 2009. DOI: https://doi.org/10.1117/12.811609   DOI
6 H. Han, K. Main, "Low Cost Camera Modules Using Integration of Wafer-Scale Optics and Wafer-Level Packaging of Image Sensors" Asia Communications and Photonics Conference and Exhibition, Shanghai, Vol.7631, pp.1-7, Nov, 2009. DOI: https://doi.org/10.1364/ACP.2009.FH6   DOI
7 G. Humpston, B. Kidron, M. Kriman, "Low Cost Through Silicon Via Solution Compatible with Existing Assembly Infrastructure and Suitable for Single Die and Die Stacked Packages," IEEE International Microsystems, Packaging, Assembly & Circuits Technology Conference, Taipei, pp.61-64, October, 2008. DOI: https://doi.org/10.1109/EMAP.2008.4784229   DOI
8 G. Humpston, "Novel and Low Cost Through Silicon Via Solution for Wafer Scale Packaging of Image Sensors," IEEE Electrical Design of Advanced Packaging and Systems Symposium, Seoul, pp.179-182, Dec. 2008. DOI: https://doi.org/10.1109/EDAPS.2008.4736029   DOI
9 S. Xie, X. Wan, X. Wei, "Fabrication of Multiscale-Structure Wafer-Level Microlens Array Mold", Appl. Vol.9, No.3: 487. Jan. 2019. DOI: https://doi.org/10.3390/app9030487   DOI
10 H. Nagaoka, M. Furuyama, T. Akahoshi, D. Mizutani, S. Sakuyama, M. Nagatake, N. Itoh, "Thermal Stress Simulation Method in Substrate with Cure Shrinkage Reaction of Thermosetting Resin," 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan, pp.135-138, Oct. 2018. DOI: https://doi.org/10.1109/IMPACT.2018.8625779   DOI
11 H. J. Kim, J. H. Kim, Y. G. Kim, J. Y. Song, D. H. Moon, "A Simulation Study on the Development of Injection Mold for the Parts of Phone Camera Lens Module", Journal of the Korea Society for Simulation, Vol.22, No.4, pp.83-92, Dec. 2013. DOI: https://doi.org/10.9709/JKSS.2013.22.4.083   DOI
12 Roger. A. Sauer, "Survey of Computational Models for Adhesion", The Journal of Adhesion, Vol.92, No.2, pp.81-120, Oct. 2015. DOI: https://doi.org/10.1080/00218464.2014.1003210   DOI
13 B. Persson. E. Tosatti, "The effect of surface roughness on the adhesion of elastic solids" The Journal of Chemical Physics, Vol.115, No.12, pp.5597-5610, Jul. 2001. DOI: https://doi.org/10.1063/1.1398300   DOI