• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.607-608
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• 2008

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.2
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• pp.127-132
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• 2014

Micro/nano-injection molding is one of the main processing techniques for polymer micro-fabrication. Most of the difficulties encountered in polymer micro-molding are caused by the demolding, rather than the filling of molds. Therefore, studying the demolding process is vitally important for manufacturing polymer replicas. The most important parameters are the thermal stress, friction and adhesion forces, and mechanical strength of the resist. In this research, we determinedthe effects of the processing conditions on the ejection force for cases involving two common thermoplastic polymers. The results showed that the processing conditions noticeably influenced the ejection force.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.1
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• pp.461-467
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• 2021

Among the defect factors that can occur when a wafer-level lens is molded using a thermosetting material, the mold sticking problem of a molded lens during the release process can damage the molded substrate and deform the substrate at the wafer level. An experiment was conducted to examine the factors affecting the demolding force in the lens forming process. The demolding force was examined according to the coating material of the molds. The mold was surface-treated with ITO and Ti, followed by plasma treatment in an O2 atmosphere. A DLC coating was then performed, and the curing and releasability were examined. A coating method for the pull-off experiment was selected based on the results. To measure the demolding force according to the curing process conditions, a method of curing at a constant pressure and a method of curing at a constant position were applied. As a result, the TiO2 surface treatment reduced the release force. When cured by controlling the location, curing shrinkage can reduce the adhesion energy of the interface during curing, resulting in better demolding.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.11
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• pp.1649-1657
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• 2010

We have investigated the unexpected phenomena on the surface of molded GFRP composites. The major cause of the unevenness, as a result of which the surface becomes rough, is a shrinking of the matrix in the process of holding pressure and cooling temperature. The higher holding pressure load in a molding process and the lower demolding temperature in an annealing experiment, the better GFRP composites moldings improved its appearance. In addition, by taking the holding pressure and demolding temperature into consideration, we evaluate the process that causes the surface unevenness and the variation in the fiber projection height.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.68-74
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• 2017

Nanoimprint lithography (NIL) is a next generation technology for fabrication of micrometer and nanometer scale patterns. There have been considerable attentions on NIL due to its potential abilities that enable cost-effective and high-throughput nanofabrication to the display device and semiconductor industry. Up to now there have been a lot of researches on thermal NIL, but most of them have been focused on polymer deformation in the molding process and there are very few studies on the cooling and demolding process. In this paper a cooling process of the polymer resist in thermal NIL is analyzed with finite element method. The modeling of cooling process for mold, polymer resist and substrate is developed. And the cooling process is numerically investigated with the effects of imprinting temperature and residual layer thickness of polymer resist on stress distribution of the polymer resist. The results show that the lower imprinting temperature, the higher the maximum von Mises stress and that the thicker the residual layer, the greater maximum von Mises stress.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.284-289
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• 2004

Since polymer materials at elevated temperatures are usually rate-sensitive, the analysis of RTP process requires considering the effect of the rate-dependent. The material behavior that exhibits rate-sensitivity is called visco-plastic. A two-dimensional visco-plastic finite element formulation which constitutive equation is based on the formulation proposed by Perzyna is presented. This Paper is purposed to calcuate pressure distribution on PMMA in compression process and to predict the relationship with defects after demolding process. This paper analyzes, both analytically and numerically, the pressure distributions on the surface of PMMA during open-die RTP process. In this research, PMMA is used to be simulated at $110^{\circ}C$ near the transition temperature.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.10a
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• pp.305-310
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• 2004

The Hot Embossing Lithography(HEL) as a method for the fabrication of nanostructure with polymer is becoming increasingly important because of its simple process, low cost, high replication fidelity and relatively high throughput. In this study, we investigated the characteristics of hot embossing lithography as a nanoreplication technique. To grasp characteristics of nano patterning rheology by process parameters(embossing temperature, pressure and time), we have carried out various experiments by using the DVD(400nm pattern width) and Blu-ray nickel stamps(150nm pattern width). During the hot embossing process, we have observed the characteristics of the size effect. The quality of products made by hot embossing is affected by its cooling shrinkage. The demolding process at the glass transition temperature results in low quality because of the shrinkage of the polymer. Therefore, the quantification of the temperature condition is essential for the replication of high quality.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.316-319
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• 2007

In this paper, high precision molding process was developed using a soft mold to fabricate fine closed-types of the barrier ribs for PDP. A green sheet was employed to fabricate the barrier ribs in this process. The soft mold with good demolding characteristics was replicated from a master mold. An optimal forming load which would not fracture the soft mold was also determined. The barrier ribs of rectangular type with upper width of $30\;{\mu}m$ would be fabricated by this process.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.51 no.4
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• pp.175-183
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• 2002

In this paper, the surface modification effect of self-assembled monolayer(SAM) of 1-dodecanethiol [$CH_3$($CH_2$)$_{11}$SH] used as an anti-adhesive film in micromolding process was studied. Monolayers of 1-dodecanethiol[$CH_3$(CH$_2$)$_{11}$SH] were obtained by immersing a metal place in pure 1-dodecanethiol. SAM film on the nickel plate has been examined by using X-ray photoelectron spectroscopy(XPS). The focus has been placed on S-Ni bonding. From the XPS analysis, sulfur atoms were detected from the SAM film as a chemical composition of S-Ni. In order to measure an adhesion force of the SAM-coated nickel surface, atomic force microscopy(AFM) was used in force-distance mode, which whows the micro-adhesive force on solid surface. It was shown that adhesion forces measured from the SAM-coated nickel surface and the Ni surface without SAM coating were 3.52nN and 5.32nN, respectively. In order to investigate the effect of SAM coating on the surface foughness the replica in demolding process, hot embossing experiments were performed using a SAM-coated nickel master and a nickel master without SAM coating. Surface roughness of replica from the SAM-coated master showed 25nm and that of replica from master without SAM coating was 35nm. The smoother surface roughness of the replica from the SAM-coated, master is believed to result from reduction in the adhesion forces.ces.