• Title/Summary/Keyword: Defect level

Search Result 587, Processing Time 0.028 seconds

Thermal-annealing behavior of in-core neutron-irradiated epitaxial 4H-SiC

  • Junesic Park ;Byung-Gun Park;Gwang-Min Sun
    • Nuclear Engineering and Technology
    • /
    • v.55 no.1
    • /
    • pp.209-214
    • /
    • 2023
  • The effect of thermal annealing on defect recovery of in-core neutron-irradiated 4H-SiC was investigated. Au/SiC Schottky diodes were manufactured using a 4H-SiC epitaxial wafer that was neutron-irradiated at the HANARO research reactor. The electrical characteristics of their epitaxial layers were analyzed under various conditions, including different neutron fluences (1.3 × 1017 and 2.7 × 1017 neutrons/cm2) and annealing times (up to 2 h at 1700 ℃). Capacity-voltage measurements showed high carrier compensation in the neutron-irradiated samples and a recovery tendency that increased with annealing time. The carrier density could be recovered up to 77% of the bare sample. Deep-level-transient spectroscopy revealed intrinsic defects of 4H-SiC with energy levels 0.47 and 0.68 eV below the conduction-band edge, which were significantly increased by in-core neutron irradiation. A previously unknown defect with a high electron-capture cross-section was discovered at 0.36 eV below the conduction-band edge. All defect concentrations decreased with 1700 ℃ annealing; the decrease was faster when the defect level was shallow.

Fault Coverage Metric for Delay Fault Testing (지연 고장 테스팅에 대한 고장 검출율 메트릭)

  • Kim, Myeong-Gyun;Gang, Seong-Ho;Han, Chang-Ho;Min, Hyeong-Bok
    • Journal of the Institute of Electronics Engineers of Korea SD
    • /
    • v.38 no.4
    • /
    • pp.266-276
    • /
    • 2001
  • Due to the rapid development of semiconductor technology, the complexity of VLSI circuits has heavily increased. With the increased densities of integrated circuits, several different types of faults can occur Thus, testing such circuits is becoming a sever problem. Delay testing can detect system timing failures caused by delay faults. However, the conventional delay fault coverage in terms of the number of detected faults may not be an effective measure of delay testing because, unlike a stuck-at-faults, the impact of a delay fault is dependent on its delay defect size rather than on its existence. Thus, the effectiveness of delay testing is dependent on the propagation delay of the path to be tested, the delay defect size, and the system clock interval. This paper proposes a new delay defect fault coverage that considers both propagation delay of the path to be tested and additional delay defect size. And the relationship between delay defect fault coverage and defect level is analyzed.

  • PDF

Comparative Review on Term of Warranty Liability of Reinforced Concrete Work through Occurred Defect Data Analysis in Apartment Building (공동주택 하자실적자료 분석을 통한 철근콘크리트 공사의 하자담보책임기간 비교연구)

  • Seo, Deok-Seok;Park, Jun-Mo
    • Proceedings of the Korean Institute of Building Construction Conference
    • /
    • 2017.05a
    • /
    • pp.266-267
    • /
    • 2017
  • As apartment buildings defect lawsuits become socioeconomic problems, an objective basis system for the term of warranty liability of reinforced concrete constructions is urgent. This study was carried out as a basic study for developing a basis system for the term of warranty liability. To do this, defect data actual collected in apartment complexes were collected and analyzed. As the result of checking the cumulative rate of defect occurrence in reinforced concrete construction by year, the point of time of reaching the 90% level was the 5th years, which was similar with the provision of the Apartment Building Management Act. However, the current Supreme Court precedent has decided that the term of warranty liability for the main structural parts in reinforced concrete construction shall be 10 years and the dispute is expected to continue in the future in the defect lawsuit.

  • PDF

The Detection of the Internal Defect in the Glass Using Auto Focusing Method (자동 초점 기법을 이용한 유리 내부 결함 검출)

  • Jy, Yong-Woo;Jhang, Kyung-Young;Jung, Ji-Hwa;Kim, Suk-Jun
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.28 no.7
    • /
    • pp.1047-1054
    • /
    • 2004
  • Internal defects in the glass, like-as micro-voids, micro-cracks, or inclusions, easily cause the failure when the glass is exposed to the shock or the thermal variation. In order to produce the highly reliable glass product, the precision inspection of the defect in the glass is required. For this purpose, this paper proposes a machine vision technique based on the auto-focusing method, which searches the defect and measures the location under the fact that the edge image of defect must be the most clear when the focal plane of CCD camera is coincided with the defect. As for the search index, the gradient indicator is presented. The basic principles are verified through the simulations for the computer-generated defect images, where the affects of defect shape, gray level of background, and the brightness of the defect image are also analyzed. Finally, experimental results for actual glass specimens are shown to confirm the applicability of this method to the actual field.

Pipeline defect detection with depth identification using PZT array and time-reversal method

  • Yang Xu;Mingzhang Luo;Guofeng Du
    • Smart Structures and Systems
    • /
    • v.32 no.4
    • /
    • pp.253-266
    • /
    • 2023
  • The time-reversal method is employed to improve the ability of pipeline defect detection, and a new approach of identifying the pipeline defect depth is proposed in this research. When the L(0,2) mode ultrasonic guided wave excited through a lead zirconate titinate (PZT) transduce array propagates along the pipeline with a defect, it will interact with the defect and be partially converted to flexural F(n, m) modes and longitudinal L(0,1) mode. Using a receiving PZT array attached axisymmetrically around the pipeline, the L(0,2) reflection signal as well as the mode conversion signals at the defect are obtained. An appropriate rectangle window is used to intercept the L(0,2) reflection signal and the mode conversion signals from the obtained direct detection signals. The intercepted signals are time reversed and re-excited in the pipeline again, result in the guided wave energy focusing on the pipeline defect, the L(0,2) reflection and the L(0,1) mode conversion signals being enhanced to a higher level, especially for the small defect in the early crack stage. Besides the L(0,2) reflection signal, the L(0,1) mode conversion signal also contains useful pipeline defect information. It is possible to identify the pipeline defect depth by monitoring the variation trend of L(0,2) and L(0,1) reflection coefficients. The finite element method (FEM) simulation and experiment results are given in the paper, the enhancement of pipeline defect reflection signals by time-reversal method is obvious, and the way to identify pipeline defect depth is demonstrated to be effective.

Analysis of the Horizontal Block Mura Defect

  • Mi, Zhang;Jian, Guo;Chunping, Long
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 2007.08b
    • /
    • pp.1597-1599
    • /
    • 2007
  • In TFT-LCD, mura is a defect which degrades the display quality. The resistance difference between gate lines is the main cause of H-Block mura. Two methods could eliminate this defect. A thinner gate layer or gate fan-out pattern decrease mura level. H-Block mura has been reduced after implementing the new schemes.

  • PDF

Development of surface defect inspection algorithms for cold mill strip using tree structure (트리 구조를 이용한 냉연 표면흠 검사 알고리듬 개발에 관한 연구)

  • Kim, Kyung-Min;Jung, Woo-Yong;Lee, Byung-Jin;Ryu, Gyung;Park, Gui-Tae
    • 제어로봇시스템학회:학술대회논문집
    • /
    • 1997.10a
    • /
    • pp.365-370
    • /
    • 1997
  • In this paper we suggest a development of surface defect inspection algorithms for cold mill strip using tree structure. The defects which exist in a surface of cold mill strip have a scattering or singular distribution. This paper consists of preprocessing, feature extraction and defect classification. By preprocessing, the binarized defect image is achieved. In this procedure, Top-hit transform, adaptive thresholding, thinning and noise rejection are used. Especially, Top-hit transform using local min/max operation diminishes the effect of bad lighting. In feature extraction, geometric, moment, co-occurrence matrix, histogram-ratio features are calculated. The histogram-ratio feature is taken from the gray-level image. For the defect classification, we suggest a tree structure of which nodes are multilayer neural network clasifiers. The proposed algorithm reduced error rate comparing to one stage structure.

  • PDF

Traumatic ventricular septal defect - One case report - (외상성 심실중격결손증 1례 보)

  • 성후식
    • Journal of Chest Surgery
    • /
    • v.20 no.2
    • /
    • pp.411-415
    • /
    • 1987
  • We have experienced a rare case of traumatic ventricular septal defect caused by fall down injury. The patient suffered from congestive heart failure after trauma and represented new developing typical murmur. Cardiac catheterization revealed a large left-to-right shunt at the ventricular level and a 4.4:1 ratio of pulmonary to systemic flow. Left ventricular angiogram also showed ventricular septal defect low in the muscular septum. At operation, the right ventricle and pulmonary artery were found to be moderately dilated. A marked systolic thrill was palpable over the right ventricle near the apex. Through a small left ventriculotomy an oval defect, 2x.3 cm with a firm scarred margin, was found in the lower muscular ventricular septum. This defect was repaired using Dacron patch and ventriculotomy was closed with long strip of Teflon felt. Postoperative course was uneventful and discharged in good condition.

  • PDF

Automatic Defect Detection from SEM Images of Wafers using Component Tree

  • Kim, Sunghyon;Oh, Il-seok
    • JSTS:Journal of Semiconductor Technology and Science
    • /
    • v.17 no.1
    • /
    • pp.86-93
    • /
    • 2017
  • In this paper, we propose a novel defect detection method using component tree representations of scanning electron microscopy (SEM) images. The component tree contains rich information about the topological structure of images such as the stiffness of intensity changes, area, and volume of the lobes. This information can be used effectively in detecting suspicious defect areas. A quasi-linear algorithm is available for constructing the component tree and computing these attributes. In this paper, we modify the original component tree algorithm to be suitable for our defect detection application. First, we exclude pixels that are near the ground level during the initial stage of component tree construction. Next, we detect significant lobes based on multiple attributes and edge information. Our experiments performed with actual SEM wafer images show promising results. For a $1000{\times}1000$ image, the proposed algorithm performed the whole process in 1.36 seconds.