• Title/Summary/Keyword: Defect inspection

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A Study on the Derivation of Key Management Works by Construction Progress through the Analysis of Construction Supervision Data (건설감리 검측데이터 분석을 통한 공사 진행도별 중점관리공종 도출)

  • Yoo, Na-yeong;Kim, Ha-neul;Kim, Ha-rim;Cho, Hun-Hee
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2022.11a
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    • pp.131-132
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    • 2022
  • The type and proportion of construction work varies depending on the stage of progress, and the frequency of inspection and defect occurrences are different. If it is determined to be defective after the inspection, a delay may occur, and additional manpower and resources are required. Therefore, it is necessary to prevent these risks by classifying, deriving, and managing key management woks according to the progress. This study aims to contribute to the efficiency of the supervisor's inspection work by identifying the types of construction that should be managed intensively for each construction progress and deriving the time when defects occur frequently in each construction type.

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Detected Point Clustering Algorithm For Automatic Visual Inspection (자동외관검사를 위한 검출위치 클러스터링 알고리즘)

  • Ryu, Sun Joong
    • Journal of the Semiconductor & Display Technology
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    • v.13 no.3
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    • pp.1-6
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    • 2014
  • Visual defect inspection for electronics parts manufacturing processes is comprised of 2 steps - automatic visual inspection by machine and inspection by human inspectors. It is necessary that spatial points which were detected by the machine should be adequately clustered for subsequent human inspection. This research deals with the spatial clustering algorithm for the purpose of process productivity improvement. Distribution based clustering is newly developed and experimentally confirmed to show better clustering efficiency than existing algorithm - area based clustering.

Fast labeling a1gorithm for the surface defect inspection of Cold Mill Strip (냉연 강판의 개별 흠 분리를 위한 고속 레이블링에 관한 연구)

  • Kim, Kyung-Min;Park, Joo-Jo
    • Proceedings of the KIEE Conference
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    • 2000.07d
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    • pp.3056-3059
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    • 2000
  • This paper describes a fast image labeling algorithm for the feature extraction of connected components. Labeling the connected regions of a digitized image is a fundamental computation in image analysis and machine vision, with a large number of application that can be found in various literature. This algorithm is designed for the surface defect inspection of Cold Mill Strip. The labeling algorithm permits to separate all of the connected components appearing on the Cold Mill Strip.

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Defect Length Estimation Using SQI for Underground Gas Pipelines (SQI를 이용한 지하 매설 가스 배관 결함 길이 추정)

  • Kim, Min-Ho;Choi, Doo-Hyun
    • Journal of the Korean Institute of Gas
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    • v.15 no.2
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    • pp.27-32
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    • 2011
  • In this paper a new defect length estimation algorithm using SQI(self quotient image) is presented for the MFL(magnetic flux leakage) inspection of underground gas pipelines. Gas pipelines are magnetized by the permanent magnets of the MFL PIG(pipeline inspection gauge) when the PIG runs through pipelines. If defects or corrosions exist in the pipeline, magnetic leakage flux is increased. The MFL signals measured by hall sensors are analyzed to estimate defect length using SQI. For 74 real defects carved in KOGAS pipeline simulation facility(KPSF) the accuracy of defect length estimation of the proposed algorithm was compared with that of conventional methods.

A Case Study for Estimating the Defect Rate of PLC Using Sampling Inspection and Improving the Cause of Defects (샘플링검사를 이용한 PLC의 불량률 추정 및 불량원인 개선 사례연구)

  • Moon, In-Sun;Lee, Dong-Hyung
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.44 no.4
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    • pp.128-135
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    • 2021
  • WDM(Wavelength Division Multiplexing) is called a wavelength division multiplexing optical transmission method and is a next-generation optical transmission technology. Case company F has recently developed and sold PLC(Planar Lightwave Circuit), a key element necessary for WDM system production. Although Chinese processing companies are being used as a global outsourcing strategy to increase price competitiveness by lowering manufacturing unit prices, the average defect rate of products manufactured by Chinese processing companies is more than 50%, causing many problems. However, Chinese processing companies are trying to avoid responsibility, saying that the cause of the defect is the defective PLC Wafer provided by Company F. Therefore, in this study, the responsibility of the PLC defect is clearly identified through estimating the defect rate of PLC using the sampling inspection method, and the improvement plan for each cause of the PLC defect for PLC yeild improvement is proposed. The result of this research will greatly contribute to eliminating the controversy over providing the cause of defects between global outsourcing companies and the head office. In addition, it is expected to form a partnership with Company F and a Chinese processing company, which will serve as a cornerstone for successful global outsourcing. In the future, it is necessary to increase the reliability of the PLC yield calculation by extracting more precisely the number of defects.

Evaluation of Detectable Defect Size for Inner Defect of Pressure Vessel Using Laser Speckle Shearing Interferometry (레이저 스페클 전단간섭법을 이용한 압력용기 내부결함의 측정 가능한 결함 크기의 평가)

  • Kim, Kyeong-Suk;Seon, Sang-Woo;Choi, Tae-Ho;Kang, Chan-Geun;Na, Man-Gyun;Jung, Hyun-Chul
    • Journal of the Korean Society for Nondestructive Testing
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    • v.34 no.2
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    • pp.135-140
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    • 2014
  • Pressure vessels are used in various industrial fields. If a defect occurs on the inner or outer surface of a pressure vessel, it may cause a massive accident. A defect on the outer surface can be detected by visual inspection. However, a defect on the inner surface is generally impossible to detect with visual inspection. Nondestructive testing can be used to detect this type of defect. Laser speckle shearing interferometry is one nondestructive testing method that can optically detect a defect; its advantages include noncontact, full field, and real time inspection. This study evaluated the detectable size for an internal defect of a pressure vessel. The material of the pressure vessel was ASTM A53 Gr.B. The internal defect was detected when the pressure vessel was loaded by internal pressure controlled by a pneumatic system. The internal pressure was controlled from 0.2 MPa to 0.6 MPa in increments of 0.2 MPa. The results confirmed that an internal defect with a 25 % defect depth could be detected even at 0.2 MPa pressure variation.

Inspection Technology of Detection of Propellant/Liner Debond Using Ultrasonic Multi-reflection (초음파 다중 반사를 이용한 추진제/라이너 미접착 검출 기법 연구)

  • Na, Sung-Youb;Kim, Dong-Ryun;Ryoo, Baek-Neung
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2007.04a
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    • pp.17-21
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    • 2007
  • Ultrasonic inspection method is more profitable than X-ray radiographic inspection in cost and effect of defect detection such as debond, and it doesn't need special facilities. The method can also be a possible real time inspection with safety. This report explains the experiment and theoretical modeling analysis of the inspection methods of propellant/liner debond using ultrasonic multi-reflection in rocket motor. From the results, it is possible to detect the defect of propellant/liner debond and its signal is distinguishable with normal. And, it is approximately coincide with both experimental signal and modeling.

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결함검출을 위한 실험적 연구

  • 목종수
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 1996.03a
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    • pp.24-29
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    • 1996
  • The seniconductor, which is precision product, requires many inspection processes. The surface conditions of the semiconductor chip effect on the functions of the semiconductors. The defects of the chip surface is crack or void. Because general inspection method requires many inspection processes, the inspection system which searches immediately and preciselythe defects of the semiconductor chip surface. We propose the inspection method by using the computer vision system. This study presents an image processing algorithm for inspecting the surface defects(crack, void)of the semiconductor test samples. The proposed image processing algorithm aims to reduce inspection time, and to analyze those experienced operator. This paper regards the chip surface as random texture, and deals with the image modeling of randon texture image for searching the surface defects. For texture modeling, we consider the relation of a pixel and neighborhood pixels as noncasul model and extract the statistical characteristics from the radom texture field by using the 2D AR model(Aut oregressive). This paper regards on image as the output of linear system, and considers the fidelity or intelligibility criteria for measuring the quality of an image or the performance of the processing techinque. This study utilizes the variance of prediction error which is computed by substituting the gary level of pixel of another texture field into the two dimensional AR(autoregressive model)model fitted to the texture field, estimate the parameter us-ing the PAA(parameter adaptation algorithm) and design the defect detection filter. Later, we next try to study the defect detection search algorithm.

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A Mixed 0-1 Linear Program for the Inspection Location Problem

  • Yum, Bong-Jin
    • Journal of Korean Institute of Industrial Engineers
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    • v.10 no.1
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    • pp.11-16
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    • 1984
  • An economic model is developed for determining optimal locations of screening inspection stations in a multistage production system. The effect of screening inspection on the production rate is explicitly considered, and a fixed cost for maintaining an inspection station is assumed. The product is allowed to have multiple defects, each of which may be inspected at any inspection station after the defect-generating operation. The problem is formulated as a mixed 0-1 linear program which offers the advantage of versatility in handling various system constraints.

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Application of Generic Algorithm to Inspection Planning of Fatigue Deteriorating Structure

  • Kim, Sung-chan;Fujimoto, Yukio;Hamada, Kunihiro
    • Journal of Ship and Ocean Technology
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    • v.2 no.1
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    • pp.42-57
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    • 1998
  • Genetic Algorithm (GA) is applied to obtain optimal Inspection plan for fatigue deteriorating structures. The optimization problem is defined so as to minimize inspection cost in the 1ifs-time of the structure under the constraint that the increment of failure probability in each inspection interval is maintained below a target value. Optimization parameters are the inspection timing and the inspection quality. The inspection timing is selected from the discrete intervals such as one year, two years, three years, etc. The inspection quality is selected from the followings; no inspection, normal inspection, sampling inspection or precise inspection. The applicability of the proposed GA approach is demonstrated through the numerical calculations assuming a structure consisting of four member sets. Influences of the level of target failure probability, initial defect condition and stress increase due to plate thickness reduction caused by corrosion on inspection planning are discussed.

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