• 제목/요약/키워드: Defect Density

검색결과 464건 처리시간 0.025초

Reduction of the defect density in GaN films

  • Hwang, Jin-Soo;Tanaka, Satoru;Iwai, Sohachi;Aoyagi, Yoshinobu;Chong, Paul Joe
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 1997년도 제12회 학술발표회 논문개요집
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    • pp.47-48
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    • 1997
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실리콘 웨이퍼에서 소수 반송자 재결합 수명과 표면 부위 미세 결함에 의한 기계적 손상 평가 (Estimation of mechanical damage by minority carrier recombination lifetime and near surface micro defect in silicon wafer)

  • 최치영;조상희
    • 한국결정성장학회지
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    • 제9권2호
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    • pp.157-161
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    • 1999
  • 초크랄스키 실리콘 기판의 뒷면에 형성된 기계적 손상이 미치는 효과에 대하여 고찰하였다. 기계적 손상의 정도는 레이저 여기/극초단파 반사 광전도 감쇠법에 의한 소수반송자 재결합 수명, 습식산화/선택적 식각 방법, 표면 부위 미소 결함 및 X-선 단면 측정 분석으로 평가하였다. 그 결과, 웨이퍼 뒷면에 가해지는 기계적 손상의 세기가 강할수 록 소수반송자 재결합 수명은 짧아지고, 표면 부위 미소 결함 밀도는 비례적으로 증가하였으며, 산화 유기 적충 결함 밀 도와도 상호 일치하였다. 그래서, 표면 부위 미소 결함 기술은 산화 유기 적층 결함을 측정하는데 있어서 통상적인 부식 방법과는 별도로 사용될 수 있다.

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금속분말 사출성형 제품의 공정능력분석에 관한 연구 (A Study on the Process Capability Analysis of MIM Product)

  • 최병기;이동길;최병희
    • 한국생산제조학회지
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    • 제19권1호
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    • pp.57-64
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    • 2010
  • Metal Injection Molding (MIM) is attractive because it produces consistent, complex-geometry components for high-volume, high-strength, and high-performance applications. Also MIM using in optical communication field, display field, and semi-conductor field is a cost-effective alternative to metal machining or investment casting parts. It offers tremendous single-step parts consolidation potential and design flexibility. The objective of this paper is to study the suitability of design, flow analysis, debinding and sinterin processes, and capability analysis. The suitable injection conditions were 0.5~1.5 second filling time, 11.0~12.5 MPa injection pressure derived from flow analysis. The gravity of the product is measured after debinding an sintering. The maximum and minimum gravity levels are 7.5939 and 7.5097. the average and standard deviation are 7.5579 and 0.0122; when converted into density, the figure stands at 98.154%. According to an analysis of overall capacity, PPM total, which refers to defect per million opportunities(DPMO), stands at 166,066.3 Z.Bench-the sum of defect rates exceeding the actual lowest and highest limits-is 0.97, which translates into the good quality rate of around 88.4% and the sigma level of 2.47.

Evaluation of crystallinity and defect on (100) ZnTe/GaAs grown by hot wall epitaxy

  • Kim, Beong-Ju
    • 한국결정성장학회지
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    • 제12권6호
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    • pp.299-303
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    • 2002
  • The relationship of crystallinity between defects distribution with (100) ZnTe/GaAs using HWE growth was investigated by four crystal rocking curve (FCRC) and transmission electron microscopy (TEM). The thickness dependence of crystal quality in ZnTe epilayer was evaluated. The FWHM value shows a strong dependence on ZnTe epilayer thickness. For the films thinner than 6 ${\mu}{\textrm}{m}$, the FWHM value decreases very steeply as the thickness increases. For the films thicker than 6 ${\mu}{\textrm}{m}$, it becomes an almost constant value. At the thickness of 12 $\mu\textrm{m}$ with the smallest value of 66 arcsec. which is the best value so far reported on ZnTe epilayers was obtained. Investigation into the nature and behavior of dislocations with film thickness in (100) ZnTe/(100)GaAs heterostructures grown by Hot Wall Epitaxy (HWE). This film defects range from interface to 0.7 ${\mu}{\textrm}{m}$ thickness was high density, due to the large lattice mismatch and thermal expansion coefficients. The thickness of 0.7~1.8 ${\mu}{\textrm}{m}$ was exists low defect density. In the thicker range than 1.8 ${\mu}{\textrm}{m}$ thickness was measured hardly defects.

실리콘 이종접합 태양전지에서 계면 결함 밀도의 영향 (Influence of the interface defect density on silicon heterojunction solar cells)

  • 김찬석;이승훈;탁성주;최수영;부현필;이정철;김동환
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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    • pp.103.1-103.1
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    • 2011
  • 실리콘 이종접합 태양전지에서 계면 결함 밀도는 효율을 결정하는데 가장 중요한 요인으로 작용한다. 계면 결함은 캐리어의 재결합 위치로 작용하여, 계면 결함 밀도가 증가하면 재결합 속도가 증가하게 된다. 흡수층으로 사용되는 실리콘 웨이퍼 (결정질 실리콘)를 가능한 깨끗하게 세정함으로써, 또한 emitter로 쓰이는 비정질 실리콘을 낮은 데미지로 증착하여 계면 결함 밀도를 감소 시킬 수 있다. 이러한 계면 결함 밀도의 감소가 어떠한 변화로 인해 태양전지 특성에 영향을 주는지 시물레이션을 통해 알아보았다. n-type 웨이퍼에 p-type 비정질 실리콘을 emitter로 하여 TCO/p/i/n-type wafer/i/n/TCO/metal의 구조를 적용했고, wafer 전면과 i로 쓰인 무첨가된 비정질 실리콘 간의 계면 결함 밀도를 변수로 적용했다. 그 결과, 계면 결함 밀도가 감소함에 따라 재결합이 감소하여 태양전지 특성이 증가하는 측면도 있지만, 흡수층의 장벽 (barrier height)이 높아져 재결합을 더욱 감소시킴으로 인해 태양전지 특성이 증가함을 알 수 있었다.

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Si(111) 기판 위에 MOCVD 법으로 성장시킨 GaN의 성장 특성에 관한 TEM 분석 (A TEM Study on Growth Characteristics of GaN on Si(111) Substrate using MOCVD)

  • 신희연;정성훈;유지범;서수정;양철웅
    • 한국표면공학회지
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    • 제36권2호
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    • pp.135-140
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    • 2003
  • The difference in lattice parameter and thermal expansion coefficient between GaN and Si which results in many defects into the grown GaN is larger than that between GaN and sapphire. In order to obtain high quality GaN films on Si substrate, it is essential to understand growth characteristics of GaN. In this study, GaN layers were grown on Si(111) substrates by MOCVD at three different GaN growth temperatures ($900^{\circ}C$, $1,000^{\circ}C$ and $1,100^{\circ}C$), using AlN and LT-GaN buffer layers. Using TEM, we carried out the comparative investigation of growth characteristics of GaN by characterizing lattice coherency, crystallinity, orientation relationship and defects formed (transition region, stacking fault, dislocation, etc). The localized region with high defect density was formed due to the lattice mismatch between AlN buffer layer and GaN. As the growth temperature of GaN increases, the defect density and surface roughness of GaN are decreased. In the case of GaN grown at $1,100^{\circ}$, growth thickness is decreased, and columns with out-plane misorientation are formed.

홈구조 실리콘 접합 경계면에서의 Void 제거를 위한 실리콘 직접접합 방법 (The Removal Of Voids In The Grooved Interfacial Region Of Silicon Structures Obtained With Direct Bonding Technique)

  • Kim, Sang-Cheol;Kim, Eun-Dong;Kim, Nam-Kyun;Bahna, Wook;Soo, Gil-Soo;Kim, Hyung-Woo
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2002년도 하계학술대회 논문집
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    • pp.310-313
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    • 2002
  • Structures obtained with a direct boning of two FZ silicon wafers joined in such a way that a smooth surface of one wafer was attached to the grooved surface of the other were studied. A square net of grooves was made with a conventional photo lithography process. After high temperature annealing the appearance of voids and the rearrangement of structural defects were observed with X-ray diffraction topography techniques. It was shown that the formation of void free grooved boundaries was feasible. In the cases when particulate contamination was prevented, the voids appeared in the grooved structures could be eliminated with annealing. Since it was found that the flattening was accompanied with plastic deformation, this deformation was suggested to be intensively involved in the process of void removal. A model was proposed explaining the interaction between the structural defects resulted in "a dissolution" of cavities. The described processes may occur in grooved as well as in smooth structures, but there are the former that allow to manage air traps and undesirable excess of dislocation density. Grooves can be paths for air leave. According to the established mechanisms, if not outdone, the dislocations form local defect arrangements at the grooves permitting the substantial reduction in defect density over the remainder of the interfacial area.

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금속의 양극산화처리 기술 (Anodic Oxidation Treatment Methods of Metals)

  • 문성모
    • 한국표면공학회지
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    • 제51권1호
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    • pp.1-10
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    • 2018
  • Anodic oxidation treatment of metals is one of typical surface finishing methods which has been used for improving surface appearance, bioactivity, adhesion with paints and the resistances to corrosion and/or abrasion. This article provides fundamental principle, type and characteristics of the anodic oxidation treatment methods, including anodizing method and plasma electrolytic oxidation (PEO) method. The anodic oxidation can form thick oxide films on the metal surface by electrochemical reactions under the application of electric current and voltage between the working electrode and auxiliary electrode. The anodic oxide films are classified into two types of barrier type and porous type. The porous anodic oxide films include a porous anodizing film containing regular pores, nanotubes and PEO films containing irregular pores with different sizes and shapes. Thickness and defect density of the anodic oxide films are important factors which affect the corrosion resistance of metals. The anodic oxide film thickness is limited by how fast ions can migrate through the anodic oxide film. Defect density in the anodic oxide film is dependent upon alloying elements and second-phase particles in the alloys. In this article, the principle and mechanisms of formation and growth of anodic oxide films on metals are described.

복막 심낭 횡격막 허니아의 진단 영상 4례 (Peritoneopericardial Diaphragmatic Hernias in Four Dogs)

  • 최지혜;김현욱;장재영;서지민;김준영;윤정희
    • 한국임상수의학회지
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    • 제25권1호
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    • pp.58-63
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    • 2008
  • Peritoneopericardial diaphragmatic hernia(PPDH) is uncommon and congenital disease in dogs and cats. In PPDH, the peritoneal organs such as liver, small intestine, stomach and omentum are displaced into the congenital defect between pericardial sac and diaphragm and cause the abnormal round and enlarged cardiac silhouette. Abnormal cardiac silhouette contacts with the cranial diaphragmatic border consistently and soft tissue- and/or gas- density structures are summated over the cardiac density in radiography. The contrast medium flows from peritoneal cavity into the pericardial sac and demonstrates the herniated abdominal organs and the abnormal defect in positive peritoneography. In this study, 4 dogs was diagnosed as PPDH using radiography, peritoneography and thoracic ultrasonography and showed various clinical signs according to the kind, amount and clinical state of herniated abdominal organs.

강유전체막의 CMP 연마 특성 (Chemical Mechanical Polishing (CMP) Characteristics of Ferroelectric Film)

  • 서용진;박성우;김경태;김창일;장의구;김상용;이우선
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.140-143
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    • 2003
  • BST thin films have a good thermal-chemical stability, insulating effect and variety of phases. However, BST thin films have problems of the aging effect and mismatch between the BST thin film and electrode. Also, due to the high defect density and surface roughness at grain boundarys and in the grains, which degrades the device performances. In order to overcome these weakness, we first applied the chemical mechanical polishing (CMP) process to the polishing of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. BST ferroelectric film was fabricated by the sol-gel method. And then, we compared the structural characteristics before and after CMP process of BST films. We expect that our results will be useful promise of global planarization for FRAM application in the near future.

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