• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.133-133
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• 2009

It is desirable to choose a high-k material having a large band offset with the tunneling oxide and a deep trapping level for use as the charge trapping layer to achieve high PIE (Programming/erasing) speeds and good reliability, respectively. In this paper, charge trapping and tunneling characteristics of high-k hafnium oxide ($HfO_2$) layer with various thicknesses were investigated for applications of tunnel barrier engineered nonvolatile memory. A critical thickness of $HfO_2$ layer for suppressing the charge trapping and enhancing the tunneling sensitivity of tunnel barrier were developed. Also, the charge trap centroid and charge trap density were extracted by constant current stress (CCS) method. As a result, the optimization of $HfO_2$ thickness considerably improved the performances of non-volatile memory(NVM).

• 한국재료학회지
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• 제9권5호
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• pp.460-466
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• 1999

The deep level electron traps in AP-MOCVD GaAs/undoped Al\ulcornerGa\ulcornerAs/n-type GaAs heterostructures have been investigated by means of Deep Level Transient Spectroscopy DLTS). In terms of the experimental procedure, GaAs/undoped Al\ulcornerGa\ulcornerAs/n-type GaAs heterostructures were deposited on 2" undoped semi-insulating GaAs wafers by the AP-MOCVD method at $650^{\circ}C$ with TMGa, AsH3, TMAl, and SiH4 gases. The n-type GaAs conduction layers were doped with Si to the target concentration of about 2$\times$10\ulcornercm\ulcorner. The Al content was targeted to x=0.5 and the thicknesses of Al\ulcornerGa\ulcornerAs layers were targeted from 0 to 40 nm. In order to investigate the electrical characteristics, an array of Schottky diodes was built on the heterostructures by the lift-off process and Al thermal evaporation. Among the key results of this experiment, the deep level electron traps at 0.742~0.777 eV and 0.359~0.680 eV were observed in the heterostructures; however, only a 0.787 eV level was detected in n-type GaAs samples without the Al\ulcornerGa\ulcornerAs overlayer. It may be concluded that the 0.787 eV level is an EL2 level and that the 0.742~0.777 eV levels are related to EL2 and residual oxygen impurities which are usually found in MOCVD GaAs and Al\ulcornerGa\ulcornerAs materials grown at $630~660^{\circ}C$. The 0.359~0.680 eV levels may be due to the defects related with the al-O complex and residual Si impurities which are also usually known to exist in the MOCVD materials. Particularly, as the Si doping concentration in the n-type GaAs layer increased, the electron trap concentrations in the heterostructure materials and the magnitude of the C-V hysteresis in the Schottky diodes also increased, indicating that all are intimately related.ated.

• 한국재료학회:학술대회논문집
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• 한국재료학회 1995년도 추계 학술발표 강연 및 논문개요집
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• pp.23-24
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• 1995

기존의 웨이퍼 박막속에 절연박막이 삽입된 SOI(Silicon On Insulator) 웨이퍼 구조와 관련한 반도체 기판 재료가 커다른 관심을 끌어 왔으나, SOI 평가기술은 아직까지 체계적으로 확립된 것이 없으며, DLTS(Deep Level Transient Spectroscopy) 등을 이용한 전기적 평가는 거의 이루어지지 않은 상태이다. 본 연구에서는 직접접합된 웨이퍼를 약 10um내외의 활성화층을 형성시킨 6인치 P-형 SOI 웨이퍼를 제작하여 DLTS로 측정, 평가를 하였고, DLTS 측정후 관찰될 수 있는 에어지 트랩(Energy Trap)과 후속 열처리에서의 트랩의 변화등을 관찰하여, 후속 열처리조건에 따른 접합된 SOI 웨이퍼 계면의 안정화된 조건을 확보하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1989년도 추계학술대회 논문집 학회본부
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• pp.83-86
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• 1989

Electrical conductivity, I - V and DLTS have been measured on polycrystalline samples of $\alpha-Fe_{2}O_{3}$ containing small deviation from stoichiometry and small amounts of added titanium. DLTS (Deep Level Transient Spectroscopy) in the current transient mode has been applied to the measurement of the trap density at the grain boundary. Titanium enters the $\alpha-Fe_{2}O_{3}$ lattice substitutionally as $Ti^{4+}$, thus producing an $Fe^{2+}$ and maintaining the average charge per cation at three. The $Fe^{2+}$acts as a donor center with respect to the surrounding $Fe^{3+}$ions.

• 한국전기전자재료학회논문지
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• 제13권5호
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• pp.365-370
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• 2000

Schottky contacts on n-In$\_$0.53//Ga$\_$0.47//As have been made by metal deposition on substrates cooled to a temperature of 77K. The current-voltage and capacitance-voltage characteristics showed that the Schottky diodes formed at low temperature had a much improved barrier height compared to those formed at room temperature. The Schottky barrier height ø$\_$B/ was found to be increased from 0.2eV to 0.6eV with Ag metal. The saturation current density of the low temperature diode was about 4 orders smaller than for the room temperature diode. A current transport mechanism dominated by thermionic emission over the barrier for the low temperature diode was found from current-voltage-temperature measurement. Deep level transient spectroscopy studies exhibited a bulk electron trap at E$\_$c/-0.23eV. The low temperature process appears to reduce metal induced surface damage and may form an MIS (metal-insulator-semiconductor)-like structure at the interface.

• E2M - 전기 전자와 첨단 소재
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• 제3권3호
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• pp.195-204
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• 1990

본 논문에서는 컴퓨터를 근본으로 한 Deep Level Transient Spectroscopy (DLTS) 장치를 구성하고 이를 이용하여 P형 Si MOS 캐패시터의 Si- $SiO_{2}$ 계면상태를 측정하여 트랩의 활성화에너지와 포획단면적 그리고 계면트랩밀도를 조사하였다. 실리콘 band gap내에 연속적으로 분포하고 있는 계면트랩을 상세히 고찰하기 위해 quiescent 전압의 위치를 변화시키면서 0.1volt의 미소한 펄스를 MOS에 주입하여 그 각각이 분리된 트랩이라고 생각되는 매우 좁은 에너지 영역에서 나오는 DLTS신호를 측정하였다. 또한 quiescent 전압의 위치, 주입펄스전압의 진폭 그리고 rate window의 선택이 DLTS 신호에 미치는 영향 등을 조사하였다. 측정결과, 계면트랩의 활성화에너지는 가전자대로 부터 0.16-0.45eV이고 포획단면적은 1.3*$10^{-19}$~3.2*$10^{-15}$$cm^{2}$, 계면트랩밀도는 1.8*$10^{10}$ ~ 2.5*$10^{11}$$cm^{-2}$e$V^{-1}$로 측정되었다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2000년도 제18회 학술발표회 논문개요집
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• pp.112-112
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• 2000

직접 천이형 물질인 GaN는 그 연구가 활발히 진행되어 청색 발광 및 레이저 다이오드 구현을 이룩하였고, 열적인 안정성이 뛰어나 고온, 고출력 소자용으로도 주목받을 뿐 아니라, piezoelectric, acoustioptic modulators와 negative electron affinity devices와 같은 소자개발도 유망하다. 그러나 이렇게 다양한 응용과 물리적 특성에도 불구하고 깊은 준위의 불순물에 대한 문제는 해결되지 않은 상태이다. 많은 연구에도 불구하고 GaN에 존재하는 불순물의 성격과 그것들이 전도대에 미치는 영향에 관해서는 잘 이해되지 않고 있다. 본 연구에서는 MBE로 성장된 undoped GaN 박막의 깊은 준위에 대한 연구를 위하여 TSC 장치를 이용하여 GaN 깊은 준위를 분석하였다. TSC 실험은 77K에서 400K 사이 온도의 전류 변화를 관찰하였으며 깊은 준위의 활성화 에너지 및 포획 단면적 그리고 방출 진동수를 구하기 위하여 Initial rise method, Peak shape method, Heating rate method, Peak temperature method 등을 이용하였다. 또한 trap의 origin을 밝히기 위해서 수소화를 한후에 TSC 측정을 해보았다.

• 한국통신학회논문지
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• 제17권1호
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• pp.58-67
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• 1992

MgGa2Se4 및 MgGa2Se4 : Co2+단결정을 bridgman 방법으로 성장하여 광흡수와 광발광을 가시광 영역과 근적외선 영역에서 조사하였다. 광흡수 스펙트럼은 MgGa2Se4단결정의 Td Symmetry를 갖는 host lattice에 점유하여 바닥상태와 여기상태의 Co2+ ion 에너지 ㅣlevel간 전자전이에 의해서 760nm, 1640nm, 그리고 2500nm에서 3개의 흡수피크를 관측하였다. 광발광 스펙트럼에서 이 단결정은 가시광 발광ㄸ들을 관찰하였다.가시영역의 발광 band들은 에너지 준위도에서 제안된 바와 같이 자전자대의 우의 꼭대기 acceptor 준위에서 전도대 아래의 밑에 분포된 trap으로부터 끊임없이 전자전에 의한다고 볼수 있다. 한편, 이들은 적외선 발광 band가 deep level에서 acceptor level부터 전자전이에 기인한다고 고려할 수 있다. 광전이의 mechanism은 MgGa2Se4 결정의 에너지 diagram의 항으로 잘 설명되고 있다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.180-180
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• 2010

Thin film transistors (TFTs) based on oxide semiconductors have emerged as a promising technology, particularly for active-matrix TFT-based backplanes. Currently, an amorphous oxide semiconductor, such as InGaZnO, has been adopted as the channel layer due to its higher electron mobility. However, accurate and repeatable control of this complex material in mass production is not easy. Therefore, simpler polycrystalline materials, such as ZnO and $SnO_2$, remain possible candidates as the channel layer. Inparticular, ZnO-based TFTs have attracted considerable attention, because of their superior properties that include wide bandgap (3.37eV), transparency, and high field effect mobility when compared with conventional amorphous silicon and polycrystalline silicon TFTs. There are some technical challenges to overcome to achieve manufacturability of ZnO-based TFTs. One of the problems, the stability of ZnO-based TFTs, is as yet unsolved since ZnO-based TFTs usually contain defects in the ZnO channel layer and deep level defects in the channel/dielectric interface that cause problems in device operation. The quality of the interface between the channel and dielectric plays a crucial role in transistor performance, and several insulators have been reported that reduce the number of defects in the channel and the interfacial charge trap defects. Additionally, ZnO TFTs using a high quality interface fabricated by a two step atomic layer deposition (ALD) process showed improvement in device performance In this study, we report the fabrication of high performance ZnO TFTs with a $Si_3N_4$ gate insulator treated using plasma. The interface treatment using electron cyclotron resonance (ECR) $O_2$ plasma improves the interface quality by lowering the interface trap density. This process can be easily adapted for industrial applications because the device structure and fabrication process in this paper are compatible with those of a-Si TFTs.

• 한국전기전자재료학회논문지
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• 제16권12S호
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• pp.1242-1247
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• 2003

In order to passivate the GaAs surface, silicon-nitride films were fabricated by using laser CVD method. SiH$_4$ and NH$_3$ were used to obtain SiN films in the range of 100∼300$^{\circ}C$ on p-type (100) GaAs substrate. To determine interface characteristics of the metal-insulator-GaAs structure, electrical measurements were performed such as C-V curves and deep level transient spectroscopy (DLTS). The results show that the hysteresis was reduced and interface trap density was lowered to 1,012 ∼ 1,013 at 100 ∼ 200$^{\circ}C$. According to the study of surface leakage current, the passivated CaAs has less leakage current compared to non-passivated substrate.