• 제목/요약/키워드: Deep RIE

검색결과 48건 처리시간 0.04초

마이크로 렌즈가 집적된 2-자유도 평면구동기의 설계 및 제작 (Integration of a micro lens on a in-plane positioning actuator with 2-DOF)

  • 김재흥;김용권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 G
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    • pp.3322-3324
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    • 1999
  • This paper studies on the design and fabrication of a micro in-plane positioning actuator integrated with a microlens. Proposed in-plane actuator is a micro XY-stage which is composed of two linear comb drive actuators being orthogonal to each other. In the fabrication of actuator, the single crystalline silicon substrate anodically bonded with a #7740 glass substrate is used because of simple release and passivation. The structure of actuator is formed on the silicon facet of bonded fixture by chlorine-based deep RIE and then released by isotropic wet etching of glass (#7740) in hydrofluoric acid solution. Fabricated actuator has a large travel range up to $30({\pm}15){\mu}m$ and high resolution less than 0.01f1l1l in each direction. Experimented resonant frequency of this actuator is 630Hz. The micro-Fresnel lens is fabricated on the square-shape glass structure prepared in the center of actuator.

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광기록장치의 pick-up 헤드용 미러의 설계 및 제작 (Design and fabrication of mirror for optical pick-up head)

  • 천중현;김용권
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 G
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    • pp.3292-3294
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    • 1999
  • In this paper, electrostatic scanner mirror for optical pick-up head is designed and fabricated. The mirror size is $20{\mu}m{\times}2400{\mu}m{\times}2400{\mu}m$ and torsional beam size is $10{\mu}m{\times}20{\mu}m{\times}500{\mu}m$. Static deflection angle is calculated ${\pm}0.4$ degrees when the maximum driving voltage is 20 V. Silicon mirror was fabricated using KOH etching and deep RIE. For passivation of the patterned mirror from KOH solution, parylene thin film was used and its usefulness has been verified. Driving electrode was fabricated using UV LIGA process. Mirror and electrode were bonded.

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Coupled Boundary Effects on a Gas Lubricated Bearing far a Scaled-Up Micro Gas Turbine

  • Hyunduck Kwak;Lee, Yong-Bok;Kim, Chang-Ho;Gunhee Jang
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2000년도 제32회 추계학술대회 정기총회
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    • pp.243-249
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    • 2000
  • In case of the limitation of Deep RIE fabrication for Micro Gas Turbine, bearing aspect ratio is limited in very small value. The characteristics such as pressure distribution load capacity and non-linearity of a short bearing of L/D=0.083 and a conventional bearing of L/D=1.0 with coupled boundary effects are investigated far Micro Gas Tlubine bearings. The coupled efffect was analyzed by mass conservation at coupled end area. The results, increasing load capacity and non-linearity due to the coupled effect of thrust and journal bearing, are obtained and the selection of journal bearing type is discussed.

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Polymer MEMS 공정을 이용한 의료용 미세 부품 성형 기술 개발 (Development of micro check valve with polymer MEMS process for medical cerebrospinal fluid (CSF) shunt system)

  • 장준근;박찬영;정석;김중경;박훈재;나경환;조남선;한동철
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 춘계학술대회 논문집
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    • pp.1051-1054
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    • 2000
  • We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2*0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5*2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

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블록 공중합체를 이용한 나노패턴의 크기제어방법 (Method to control the Sizes of the Nanopatterns Using Block Copolymer)

  • 강길범;김성일;한일기
    • 한국진공학회지
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    • 제16권5호
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    • pp.366-370
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    • 2007
  • 밀도가 높고 주기적으로 배열된 나노 크기의 기공이 25nm 두께의 실리콘 산화막 기판위에 형성 되었다. 나노미터 크기의 패턴을 형성시키기 위해서 자기조립물질을 사용했으며 폴리스티렌(PS) 바탕에 벌집형태로 평행하게 배열된 실린더 모양의 폴리메틸메타아크릴레이트(PMMA)의 구조를 형성하였다. 폴리메틸메타아크릴레이트를 아세트산으로 제거하여 폴리스티렌만 남아있는 나노크기의 마스크를 만들었다. 폴리스티렌으로 이루어진 나노패턴의 지름은 $8{\sim}30nm$ 였고 높이는 40nm였으며, 패턴과 패턴사이의 간격은 60nm였다. 형성된 패턴을 실리콘 산화막 위에 전사시키기 위해 불소 기반의 화학 반응성 식각을 사용하였다. 실리콘 산화막에 형성된 기공의 지름은 $9{\sim}33nm$였다. 실리콘 산화막을 불산으로 제거하여 실리콘에 형성된 기공을 관찰하였고, 실리콘기판에 형성된 기공의 지름은 $6{\sim}22nm$였다. 형성된 기공의 크기는 폴리메틸메타아크릴레이트의 분자량과 관계가 있음을 알 수 있었다.

$75{\mu}m$ Cu via가 형성된 3D 스택 패키지용 interconnection 공정 및 접합부의 전기적 특성 (Interconnection Process and Electrical Properties of the Interconnection Joints for 3D Stack Package with $75{\mu}m$ Cu Via)

  • 이광용;오택수;원혜진;이재호;오태성
    • 마이크로전자및패키징학회지
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    • 제12권2호
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    • pp.111-119
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    • 2005
  • 직경 $75{\mu}m$ 높이 $90{\mu}m$$150{\mu}m$ 피치의 Cu via를 통한 삼차원 배선구조를 갖는 스택 시편을 deep RIE를 이용한 via hole 형성공정 , 펄스-역펄스 전기도금법에 의한 Cu via filling 공정, CMP를 이용한 Si thinning 공정, photholithography, 금속박막 스퍼터링, 전기도금법에 의한 Cu/Sn 범프 형성공정 및 플립칩 공정을 이용하여 제작하였다. Cu via를 갖는 daisy chain 시편에서 측정한 접속범프 개수에 따른 daisy chain의 저항 그래프의 기울기로부터 Cu/Sn 범프 접속저항과 Cu via 저항을 구하는 것이 가능하였다. $270^{\circ}C$에서 2분간 유지하여 플립칩 본딩시 $100{\times}100{\mu}m$크기의 Cu/Sn 범프 접속저항은 6.7 m$\Omega$이었으며, 직경 $75 {\mu}m$, 높이 $90{\mu}m$인 Cu via의 저항은 2.3m$\Omega$이었다.

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계면활성제 첨가에 따른 함수율에 관한 실험적 연구 (Experimental Study on Moisture Content According to Addition of Surfactants)

  • 김남균;이동호
    • 한국화재소방학회논문지
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    • 제29권2호
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    • pp.79-83
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    • 2015
  • 화재사고는 그 충격과 영향이 업무중단 및 기업의 존폐를 좌우 할 수 있는 대표적인 재난 유형이다. 따라서 사전 예방, 대비는 물론 재난 발생 시 신속한 초기대응이 매우 중요하다. 현재 운용되고 있는 저탄장 및 합판 가공 산업 분야 등에서는 다공성 가연물의 저장이 불가피하다. 다공성 가연물 저장 공간의 화재는 그 특성상 발화시점의 파악 및 초기진압이 어려우며, 초동 대처에 실패할 경우 표면화재에서 심부화재로 이어져 2차 화재피해가 발생할 가능성이 높다. 또한 심부화재는 다량의 독성가스발생과 재발화로 인해 인적 물적 피해를 야기할 수 있으므로 다공성 가연물을 취급하는 저장공간을 중심으로 피해경감 대책이 요구된다. 본 연구는 침윤소화약제 사용 시 다공성 물질의 심부화재 소화 효율 증대에 관한 기초 연구로써, 계면활성제의 농도에 따른 침투성능의 향상에 관한 연구를 수행하였다. 실험에 사용된 다공성 물질은 국내 사용 목재의 75%를 점유하고 있는 뉴질랜드산 소나무의 원목 목분을 사용하였다. 소화용수는 침윤소화약제에 사용되고 있는 Butyl Di Glycol (BDG)을 선택하여 농도에 따른 표면장력별 표준시료를 제작하여 실험을 수행하였다. 실험은 NFPA 18의 Deep-Seated Fire Test를 기초로 수행하였으며, 살수량과 다공성 물질 내부로의 침투량, 다공성 물질 외부로의 배출량 측정 실험을 실시하였다. 실험결과 계면활성제 농도에 따른 표면장력이 감소함에 따라 거시적 침투속도는 감소하나 다공성 물질 내부로의 침투량은 증대되는 특성을 확인하였다.

절연절단법을 이용한 프로브 빔의 제작 (Fabrication of Probe Beam by Using Joule Heating and Fusing)

  • 홍표환;공대영;이동인;김봉환;조찬섭;이종현
    • 센서학회지
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    • 제22권1호
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    • pp.89-94
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    • 2013
  • In this paper, we developed a beam of MEMS probe card using a BeCu sheet. Silicon wafer thickness of $400{\mu}m$ was fabricated by using deep reactive ion etching (RIE) process. After forming through silicon via (TSV), the silicon wafer was bonded with BeCu sheet by soldering process. We made BeCu beam stress-free owing to removing internal stress by using joule heating. BeCu beam was fused by using joule heating caused by high current. The fabricated BeCu beam measured length of 1.75 mm and width of 0.44 mm, and thickness of $15{\mu}m$. We measured fusing current as a function of the cutting planes. Maximum current was 5.98 A at cutting plane of $150{\mu}m^2$. The proposed low-cost and simple fabrication process is applicable for producing MEMS probe beam.

Nanowire Patterning for Biomedical Applications

  • Yun, Young-Sik;Lee, Jun-Young;Yeo, Jong-Souk
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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    • pp.382-382
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    • 2012
  • Nanostructures have a larger surface/volume ratio as well as unique mechanical, physical, chemical properties compared to existing bulk materials. Materials for biomedical implants require a good biocompatibility to provide a rapid recovery following surgical procedure and a stabilization of the region where the implants have been inserted. The biocompatibility is evaluated by the degree of the interaction between the implant materials and the cells around the implants. Recent researches on this topic focus on utilizing the characteristics of the nanostructures to improve the biocompatibility. Several studies suggest that the degree of the interaction is varied by the relative size of the nanostructures and cells, and the morphology of the surface of the implant [1, 2]. In this paper, we fabricate the nanowires on the Ti substrate for better biocompatible implants and other biomedical applications such as artificial internal organ, tissue engineered biomaterials, or implantable nano-medical devices. Nanowires are fabricated with two methods: first, nanowire arrays are patterned on the surface using e-beam lithography. Then, the nanowires are further defined with deep reactive ion etching (RIE). The other method is self-assembly based on vapor-liquid-solid (VLS) mechanism using Sn as metal-catalyst. Sn nanoparticle solutions are used in various concentrations to fabricate the nanowires with different pitches. Fabricated nanowries are characterized using scanning electron microscopy (SEM), x-ray diffraction (XRD), and high resolution transmission electron microscopy (TEM). Tthe biocompatibility of the nanowires will further be investigated.

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상변화를 이용한 열공압형 마이크로 펌프용 액츄에이터 성능에 관한 연구 (A study on the Thermopneumatic Actuator with Phase Change for Micro Pump)

  • 박승인;황준영;이상호;강경태;강희석;장재혁;이홍렬;강신일
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2006년도 추계학술대회
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    • pp.425-428
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    • 2006
  • Recently, Direct Methanol Fuel Cell (DMFC) for portable devices has been received much attention because DMFC has a possibility of higher energy density than electrical batteries and smaller size than other fuel cells. This paper presents the fabrication and test of a thermopneumatic microactuator with a phase change for DMFC. A microactuator consists of an inlet an outlet a chamber, a heater and a sensor of resistance temperature detector(RTD). The micoractuator is fabricated by the spin-coating process, the lithograph process, the deep RIE process and so on. The total size of microactuator is $20{\times}20{\times}0.53mm^3$. When the current is applied, the heater heats liquid in chamber. As a result the liquid vaporizes. The response of temperature in the chamber was measured using thermocouple The changed temperature is $3^{\circ}C$ for 5 sec at 0.032W.

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