Journal of Sensor Science and Technology (센서학회지)

The Korean Sensors Society (한국센서학회)
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Fabrication of Probe Beam by Using Joule Heating and Fusing

절연절단법을 이용한 프로브 빔의 제작

  • Hong, Pyo-Hwan (Shool of Electronics Engineering, Kyungpook National University) ;
  • Kong, Dae-Young (Shool of Electronics Engineering, Kyungpook National University) ;
  • Lee, Dong-In (Shool of Electronics Engineering, Kyungpook National University) ;
  • Kim, Bonghwan (Department of Electronics Engineering, Catholic University Daegu) ;
  • Cho, Chan-Seob (Shool of Electronical Engineering, Kyungpook National University) ;
  • Lee, Jong-Hyun (Shool of Electronics Engineering, Kyungpook National University)
  • 홍표환 (경북대학교 전자전기컴퓨터학부) ;
  • 공대영 (경북대학교 전자전기컴퓨터학부) ;
  • 이동인 (경북대학교 전자전기컴퓨터학부) ;
  • 김봉환 (대구가톨릭대학교 전자공학과) ;
  • 조찬섭 (경북대학교 산업전자전기공학부) ;
  • 이종현 (경북대학교 전자전기컴퓨터학부)
  • Received : 2012.12.06
  • Accepted : 2013.01.21
  • Published : 2013.01.31
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Abstract

In this paper, we developed a beam of MEMS probe card using a BeCu sheet. Silicon wafer thickness of $400{\mu}m$ was fabricated by using deep reactive ion etching (RIE) process. After forming through silicon via (TSV), the silicon wafer was bonded with BeCu sheet by soldering process. We made BeCu beam stress-free owing to removing internal stress by using joule heating. BeCu beam was fused by using joule heating caused by high current. The fabricated BeCu beam measured length of 1.75 mm and width of 0.44 mm, and thickness of $15{\mu}m$. We measured fusing current as a function of the cutting planes. Maximum current was 5.98 A at cutting plane of $150{\mu}m^2$. The proposed low-cost and simple fabrication process is applicable for producing MEMS probe beam.

Keywords

Acknowledgement

Supported by : 경북대학교

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