• 한국염색가공학회지
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• 제33권2호
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• pp.79-86
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• 2021

This study investigated the effect of a pigment (C. I. Pigment Red 122) addition on mechanical properties of the epoxy resin, diglycidyl ether of bisphenol F (DGEBF) and G640 curing agent. The K/S value, thermal properties, tensile properties, and fracture toughness of the prepared epoxy samples were evaluated. When the pigment was added to the DGEBF/G640 epoxy system, the color of the epoxy resin changed to red from transparent and yellowish color, and the K/S value in the red region increased as the pigment content increased. When the pigment content was increased up to 0.1 phr, the tensile strength was improved up to 21.8 %, whereas the pigment content was over 0.1 phr, the tensile strength decreased. The fracture toughness was improves up to 23.1 % until the amount of pigment added was up to 0.2 phr, and then decreased when the amount of the pigment added was more than 0.2 phr. This attributed to the aggregation of the pigments in the epoxy resin when the amount of the pigment added was more than 0.2 phr. Therefore, the coloration of the epoxy resin with an organic pigment must be carried out very carefully because the coloration of epoxy resin affects its mechanical properties.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.152-157
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• 2002

The cure and rheological behavior of Diglycidyl ether of bisphenol F, catalyzed by four kinds of imidazoles and a Nadic methyl anhydride curing agent were studied using a differential scanning calorimeter (DSC) and rheometer. The isothermal traces were employed to analyze cure reaction. The DGEBF/anhydride conversion profiles showed autocatalyzed reaction characterized by maximum conversion rate at 20~40 % of the reaction. The rate constants obtained from isothermal test showed temperature dependance, but reaction order did not. The order of reaction (m+n) was calculated to be close to 3. The measurements of viscosity and relation time in the presence of inorganic fillers were carried out at different isothermal curing temperatures. The viscosity and gelation time increased with filler content at the same isothermal temperature.

• Macromolecular Research
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• 제10권6호
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• pp.332-338
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• 2002

The effect of an electron beam and ${\gamma}$-ray irradiation on the curing of epoxy resins was investigated. Diglycidyl ether of bisphenol A (DGEBA) and diglycidyl ether of bisphenol F (DGEBF) as epoxy resin were used. The epoxy resins containing 1.0-3.() wt% of triarylsulphonium hexafluoroantimonate(TASHFA) and triarylsulphonium hexafluorophosphate(TASHFP) as initiator were irradiated under nitrogen at room temperature with different dosage of EB and ${\gamma}$-rays from a Co$^{60}$ u source. The chemical and mechanical characteristics of irradiated epoxy resins were compared after curing of EB and ${\gamma}$-ray irradiation. The thermal properties of cured epoxy were investigated using dynamic mechanical thermal analysis. The chemical structures of cured epoxy were characterized using near infrared spectroscopy. Mechanical properties such as flexural strength, modulus were measured. The gel fraction of DGEBA with ${\gamma}$-ray was higher than that of the epoxy with EB at the same dose. Young's modulus of the sample irradiated by ${\gamma}$-ray is higher than that of sample cured by EB. From the result of strain at yield, it was found that the epoxy cured by ${\gamma}$-ray had a higher stiff property compared with the irradiated by EB.

• 한국재료학회지
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• 제21권5호
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• pp.283-287
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• 2011

As the performance of microelectronic devices is improved, the use of copper as a heat dissipation member is increasing due to its good thermal conductivity. The high thermal conductivity of copper, however, leads to difficulties in the joining process. Satisfactory bonding with copper is known to be difficult, especially if high shear and peel strengths are desired. The primary reason is that a copper oxide layer develops rapidly and is weakly attached to the base metal under typical conditions. Thus, when a clean copper substrate is bonded, the initial strength of the joint is high, but upon environmental exposure, an oxide layer may develop, which will reduce the durability of the joint. In this study, an epoxy adhesive formulation was investigated to improve the strength and reliability of a copper to copper joint. Epoxy hardeners such as anhydride, dihydrazide, and dicyandiamide and catalysts such as triphenylphosphine and imidazole were added to an epoxy resin mixture of DGEBA and DGEBF. Differential scanning calorimetry (DSC) analyses revealed that the curing temperatures were dependent on the type of hardener rather than on the catalyst, and higher heat of curing resulted in a higher Tg. The reliability of the copper joint against a high temperature and high humidity environment was found to be the lowest in the case of dihydrazide addition. This is attributed to its high water permeability, which led to the formation of a weak boundary layer of copper oxide. It was also found that dicyandiamide provided the highest initial joint strength and reliability while anhydride yielded intermediate performance between dicyandiamide and dihydrazide.

• 폴리머
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• 제33권4호
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• pp.364-370
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• 2009

본 연구에서는 ETSO-DDM(epoxy terminated siloxane-diaminodiphenylmethane) 복합 경화제상 siloxane 함량 변화에 따른 bisphenol계 레진(BPH)과의 경화 특성 변화와 이에 따른 기계적 특성 변화를 고찰해 보았다. ETSO-DDM/BPH 복합재료의 경화 특성 변화는 DSC를 통해 관찰하였으며, 만능 물성기의 인장 시험과 굴곡 시험을 통해 기계적 특성 변화를 측정하였다. ETSO-DDM/BPH 시스템의 경화 활성화 에너지는 ETSO의 함량이 감소함에 따라 지속적으로 증가하는 경향을 보였다. 이는 ETSO 함량이 감소함에 따라 합성된 ETSO-DDM 공단량체의 사슬길이가 짧아지게 되고 이로 인해 ETSO-DDM/BPH간의 가교거리 역시 짧아지게 되어 결국 가교밀도를 증가시켰기 때문으로 판단된다. ETSO 함량이 감소할수록 인장강도, 인장탄성률, 굴곡강도 및 굴곡탄성률 등의 기계적 특성은 증가를 보이는데 이는 짧은 사슬길이의 ETSO-DDM 공단량체가 rigid한 구조를 형성하여 공간상 존재하는 분자구조의 에너지 상태가 최소가 되도록 packing하였기 때문으로 사료된다.

• 대한안전경영과학회지
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• 제19권1호
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• pp.211-217
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• 2017

In this study, we investigated to the heat transfer performance of coating nano-structure with various shapes and patterns on the heat transfer surface. As a result of the measurement of the 3D nano shape, it was confirmed that the roughness generally increases when the adhesive is sprayed on the coating surface and finished durability experiment. In the case of TEOS adhesive, the roughness increased by $0.074{\mu}m$, $0.012{\mu}m$ and $0.015{\mu}m$, and the contact angle decreased $12.64^{\circ}$, $1.31^{\circ}$, $9.84^{\circ}$ at the coating time of 120 seconds, 180 seconds and 240 seconds, respectively. In the case of PVA adhesive, the roughness increased by $0.069{\mu}m$, $0.056{\mu}m$ and $0.03{\mu}m$, and the contact angle decreased $2.85^{\circ}$, $4.82^{\circ}$, $6.96^{\circ}$ at the coating time of 120 seconds, 180 seconds and 240 seconds, respectively. In the case of DGEBF adhesive, the roughness increased by $0.042{\mu}m$, $0.053{\mu}m$ and $0{\mu}m$, and the contact angle decreased $0.81^{\circ}$ at the coating time of 120 seconds, increased $4.82^{\circ}$, $6.96^{\circ}$ at the coating time of 180 seconds and 240 seconds, respectively. As a result, the durability tends to decrease as more nano-structures are deposited, and 3D nano shapes, contact angles and SEM photographs showed that the performance of the PVA adhesive was superior among the three adhesives.

• Elastomers and Composites
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• 제38권3호
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• pp.213-226
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• 2003

Imidazole 촉매의 종류에 따른 bisphenol-F계 에폭시 (Diglycidyl ether of bisphenol-F)/nadic methyl anhydride 수지 시스템의 경화 및 유변학적 거동이 시차주사열량계 (differential scanning calorimeter)와 회전 점도계를 사용하여 연구되었다. 경화반응기구를 분석하기 위해서 몇 개의 등온경화온도에서 등온시험이 수행되었다. Bisphenol-F계 에폭시/anhydride 조성물의 경화곡선은 전환량이 $20{\sim}40 %$일 때 최대 값을 보이는 자체촉매반응을 나타내었다. 속도상수($k_1,\;k_2$)는 온도 의존성을 가지나 반응차수 (m+n)는 온도 의존성이 없었으며, 반응차수는 거의 3으로 계산되었다. 촉매의 종류에 따라 두 개의 반응기구를 가지고 있었다. G'-G" crossover 방법을 통해 겔화 시간을 측정하였으며, 이 결과로부터 활성화에너지를 구하였다. 용융 실리카를 첨가한 조성물의 유변학적 거동으로부터 온도와 충전제 함량에 따른 겔화 시간의 대수 변화가 직선적인 관계를 나타낸다는 것을 알 수 있었다. 고충전된 에폭시 수지 조성물은 전형적인 준소성 거동을 보였으며, 최대충전밀도가 클수록 점도는 낮아졌다.