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Curing and Rheological Behavior of Epoxy Resin Compositions for Underfill  

Kim, Yoon-Jin (Division of Materials Science & Engineering, Korea University)
Park, Min (Polymer Hybrid Center, Korea institute of Science & Technology)
Kim, Jun-Kyung (Polymer Hybrid Center, Korea institute of Science & Technology)
Kim, Jin-Mo (Electronic Chemical Materials Division, Cheil Industries Inc.)
Yoon, Ho-Gyu (Division of Materials Science & Engineering, Korea University)
Publication Information
Elastomers and Composites / v.38, no.3, 2003 , pp. 213-226 More about this Journal
Abstract
The cure and rheological behavior of diglycidyl ether of bisphenol F/nadic methyl anhydride resin system with the kinds of imidazole were studied using a differential scanning calorimeter (DSC) and a rotational rheometer. The isothermal traces were employed to analyze cure reaction. The DGEBF/ anhydride conversion profiles showed autocatalyzed reaction characterized by maximum conversion rate at $20{\sim}40 %$ of the reaction. The rate constants ($k_1,\;k_2$) showed temperature dependance, but reaction order did not. The reaction order (m+n) was calculated to be close to 3. There are two reaction mechanisms with the kinds oi catalyst. The gel time was determined by using G'-G" crossover method, and the activation energy was obtained from this results. From measurement of rheological properties it was found that the logarithmic 1:elation time of fused silica filled DBEBF epoxy compounds linearly increased with the content of filler and decreased with temperature. The highly filled epoxy compounds showed typical pseudoplastic behavior, and the viscosity of those decreased with increasing maximum packing ratio.
Keywords
underfill; diglycidyl ether of bisphenol-F; imidazole; chemical reaction; gelation time;
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