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Curing Kinetics and Mechanical Properties for Siloxane Contained ETSO-DDM/BPH Epoxy System  

Kim, Hyo-Mi (School of Chemical Engineering & Material Science, Chung-Ang University)
Kim, Jong-Min (School of Mechanical Engineering, Chung-Ang University)
Han, Jung-Geun (Department of Civil Engineering, Chung-Ang University)
Kim, Joo-Heon (School of Chemical Engineering & Material Science, Chung-Ang University)
Publication Information
Polymer(Korea) / v.33, no.4, 2009 , pp. 364-370 More about this Journal
Abstract
The curing kinetics and mechanical properties of siloxane-diaminodiphenylmethane (ETSO-DDM) on the two kinds of bisphenol (BPH) system which are DGEBA and DGEBF were investigated with the different contents of ETSO. To investigate the curing kinetics of the ETSO-DDM/BPH systems, differential scanning calorimeter (DSC) was used. The mechanical properties of ETSO-DDM/BPH systems were also examined by universal testing machine (UTM), tensile test and flexural test. From experimental results, the activation energies and mechanical properties of ETSO-DDM/BPH were improved with the decrease contents of ETSO. This was due to the high cross-linking density made from short length of ETSO-DDM, resulting in improving the mechanical inter-locking between ETSO-DDM and BPH in these systems.
Keywords
epoxy terminated siloxane; epoxy resin; mechanical property; curing behaviors;
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  • Reference
1 G. Tripathi and D. Srivastava, Material Science and EngineeringA, 443, 262 (2007)   DOI   ScienceOn
2 N. Chikhi, S. Fellahi, and M. Bakar, Eur. Polym. J., 38, 251 (2002)   DOI   ScienceOn
3 V. M. Gonazalez-Romero and N. Casillas, ANTEC, 87, 1119 (1987)
4 E. Girard Reydet, C. C. Riccardi, H. Sautereau, and J. P. Pascault, Macromolecules, 28, 23 (1995)
5 J. S. Shim, H. S. Jung, and J. S. Jang, J. Korean Ind. Eng. Chem., 1, 2 (1990)
6 T. Ozawa, Bull. Chem. Soc. Jpn, 38, 1881 (1965)   DOI
7 T. Hatakeyama and Z. Liu, Editors, Handbook of Thermal Analysis, Hatakeyama, New York, 1998
8 M. S. Kim, S. C. Oh, H. P. Lee, H. T. Kim, and K. O. Yoo, J. Korean Ind. Eng. Chem., 10, 4 (1999)
9 K. S. Maeng, K. S. Kim, D. K. Shin, and Y. C. Kim, Polymer (Korea),14, 2, (1990)
10 H. E. Kissinger, Anal. Chem., 29, 1702 (1957)   DOI
11 J. D. Summers, C. A. Arnold, R. H. Bott, L. T. Taylor, T. C. Ward, and J. McGrath, SAMPE Symp., 32, 613 (1987)
12 K. Matsukawa, K. Hasegawa, H. Inoue, A. Fukuda, and Y. Arita, J. Polym. Sci. Polym. Chem., 30, 2045 (1992)   DOI
13 R. S. Bauer, Epoxy resins chemistry, American Chemical Society, Washington D.C., 1979
14 G. C. Tesoro, G. P. Rajendran, D. R. Uhlmann, and C. E. Park, Ind. Eng. Chem. Res., 26, 1672 (1987)   DOI   ScienceOn
15 B. A. Rozenberg, Adv. in Polym. Sci., 75, 113 (1985)   DOI
16 I. H. Myung and J. L. Lee, J. Kor. Soc. for Com. Mat., 18, 4 (2005)
17 S. J. Park, T. J. Kim, and J. R. Lee, J. Korean Ind. Eng. Chem., 10, 7 (1999)
18 C. A. May, Epoxy Resins, Marcel Pekker, New York, 1988