• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.548-551
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• 1999

The cure characteristics of metal particle filled DGEBA/MDA/SN/ zeolite epoxy resin composite system for EMI shielding were investigated by dynamic DSC run method and FT-lR spectroscopy. As the heating rate increased, the peak temperature on dynamic DSC curve increased because of the rapid cure reaction. From the straight line of the Kissinger plot, the curing reaction activation energy and pre-exponential factor could be obtained. As the post-curing time at 15$0^{\circ}C$ increased, the glass increased the glass transition temperature or the thermal stability increased. When the post curing time is too long, the system filled with metallic Al particle can be thermally oxidized by the catalytic reaction of metal filler and the thermal stability of the composite for the EMI shielding application may be decreased.

• Korean Journal of Materials Research
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• v.6 no.6
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• pp.644-650
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• 1996

Diglycidy1 ether of bisphenol A (DGEBA)/4,4'-methylene dianiline(MDA)계의 경화반응 속도에 미치는 pheny1 glycidy1 ether (PGE)-acetamide(AcAm)의 영향을 연구하였다. 반응성 첨가제로 사용된 PGE-AcAm는 PGE와 acetamide를 2:1의 몰 비로 혼합한 후 18$0^{\circ}C$에서 1시간 반응시켜서 합성하였으며, PGE의 에폭사이드기와 AcAm의 아민기가 반응함으로써 수산기를 형성함에 의해 진행되었다. 이 때 생성된 수산기는 DGEBA와 MDA의 반응에서 촉매로 작용하여 반응속도를 크게 활성화 에너지는 11.11 Kcal/mol이었고, 30 phr의 PGE-AcAm이 첨가된 계의 활성화 에너지는 7.91Kcal/mol이었다.

• Bulletin of the Korean Chemical Society
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• v.20 no.11
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• pp.1329-1334
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• 1999

The curing characteristics of diglycidyl ether of bisphenol A (DGEBA) with diaminodiphenylmethane (DDM) as a curing agent were studied using differential scanning calorimetry (DSC), rheometrics mechanical spectrometry (RMS), and dielectric analysis (DEA). The isothermal curing kinetics measured by DSC were well represented with the generalized auto-catalytic reaction model. With the temperature sweep, the inverse relationship between complex viscosity measured by RMS and ionic conductivity obtained from DEA was established indicating that the mobility of free ions represented by the ionic conductivity in DEA measurement and the chain segment motion as revealed by the complex viscosity measured from RMS are equivalent. From isothermal curing measurements at several different temperatures, the ionic conductivity contribution was shown to be dominant in the dielectric loss factor at the early stage of cure. The contribution of the dipole relaxation in dielectric loss factor became larger as the curing further proceeded. The critical degrees of cure, at which the dipolar contribution in the dielectric loss factor starts to appear, increases as isothermal curing temperature is increased. The dielectric relaxation time at the same degree of cure was shorter for a sample cured at higher curing temperature.

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.11a
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• pp.180-180
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• 1996

• Proceedings of the Materials Research Society of Korea Conference
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• 1996.05a
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• pp.129-129
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• 1996

• Korean Journal of Materials Research
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• v.2 no.3
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• pp.191-196
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• 1992

The new epoxy resin, diglycidyl ether of bisphenol A(DGEBA)/4, 4'-methylene dianiline (MDA)/succinonitrile system, containing the reactive additive succionitrile was investigated through the impact test and the stress-strain test on the basis of the behavior of cure reaction and the cure mechanism. The new epoxy resin system, having the different succinonitrile contents, were cured at $80^{\circ}C$for 1.5 hour and then in order to cure completely at $150^{\circ}C$ for 1 hour. It was shown that as the succinonitrile content increased, impact strength was gradually increased, tensile strength was decreased, almost constantly Young's modulus was sustained and elongation was increased until the succinonitrile content was increased to 10phr, and then decreased. From the experimental results, it can be concluded that the chemical bonding length between the main chains was extended by adding the reactive additive succinonitrile. It was also found that the flexibility of epoxy resin was improved by adding the succinonitrile.

• Applied Chemistry for Engineering
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• v.22 no.3
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• pp.266-271
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• 2011

Single-walled carbon nanotube (SWCNT)/Epoxy composites were prepared for improving thermal conductivities and dispersion of SWCNTs in the epoxy matrix. Composites obtained different types of SWCNTs which are pristine and functionalized of the SWCNTs by acid and amine treatments. Three types of SWCNTs were dispersed in diglycidyl ether of bisphenol A (DGEBA) and bisphenol F (DGEBF). Enhanced interaction between functional groups on SWCNT and epoxy resins was evidenced by an improvement in the dispersion of the SWCNTs in the epoxy matrix. Thermal conductivity of composites containing acid SWCNTs were found to be much better than those containing pristine and amine treated SWCNTs.

• Journal of the Semiconductor & Display Technology
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• v.21 no.2
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• pp.57-67
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• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• Korean Chemical Engineering Research
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• v.54 no.3
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• pp.410-418
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• 2016

In this study, we prepared electrically conducting composites using epoxy resin of diglycidyl ether of bisphenol A (DGEBA) as a matrix, triethylenetetramine (TETA) as a hardener and nickel powder or multi-walled carbon nanotubes (MWCNTs) grafted with $-NH_2$ groups (MWCNT-$NH_2$) as electrically conducting fillers. Electrical conductivity of composite films were measured by coating on the slide glass with a doctor blade. We measured modification reactions of MWCNT and reaction of MWCNT-$NH_2$ with DGEBA epoxy resin by fourier transform infrared spectrometer (FTIR), thermogravimetric analyzer (TGA) and elemental analyzer (EA). Morphology of composites was investigated by scanning electron microscope (SEM) and sheet resistances of composites were measured by 4-point probe. We found $(9.87{\pm}1.09){\times}10^4{\Omega}/sq$ of sheet resistance for epoxy composite containing both 40 wt% nickel powder and 0.5 wt% of MWCNT-$NH_2$ as fillers, equivalent to epoxy composite containing 53.3 wt% nickel powder only as a filler.

• Composites Research
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• v.30 no.6
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• pp.379-383
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• 2017

A study on the low Earth orbit (LEO) space environment have been conducted as a use of composites have increased. Among the LEO environmental factors, atomic oxygen is one of the most critical factors because atomic oxygen can react and erode a surface of polymer-based composite materials. POSS (Polyhedral Oligomeric Silsesquioxane) materials have been widely studied as an atomic oxygen-resistant nanomaterial. In this study, nanocomposites, which are composed of OG (Octaglycidyldimethylsilyl) POSS nanomaterials and DGEBA/DDM epoxy, were fabricated to find out its thermal and mechanical properties. FT-IR results showed that the nanocomposites were fully cured and contained OG POSS enough. Thermogravimetric analysis and differential scanning calorimetry were performed to measure the thermal properties of the nanocomposites. The initial mass loss temperature and char yield were increased through the filling of OG POSS. As the content of OG POSS increased, glass transition temperature tended to increase to 5 wt.% of OG POSS, but the temperature decreased significantly at 10 wt.% of OG POSS. The tensile test results showed that the content of OG POSS did not affect tensile strength and tensile stiffness.