• Bulletin of the Korean Chemical Society
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• v.20 no.11
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• pp.1329-1334
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• 1999

The curing characteristics of diglycidyl ether of bisphenol A (DGEBA) with diaminodiphenylmethane (DDM) as a curing agent were studied using differential scanning calorimetry (DSC), rheometrics mechanical spectrometry (RMS), and dielectric analysis (DEA). The isothermal curing kinetics measured by DSC were well represented with the generalized auto-catalytic reaction model. With the temperature sweep, the inverse relationship between complex viscosity measured by RMS and ionic conductivity obtained from DEA was established indicating that the mobility of free ions represented by the ionic conductivity in DEA measurement and the chain segment motion as revealed by the complex viscosity measured from RMS are equivalent. From isothermal curing measurements at several different temperatures, the ionic conductivity contribution was shown to be dominant in the dielectric loss factor at the early stage of cure. The contribution of the dipole relaxation in dielectric loss factor became larger as the curing further proceeded. The critical degrees of cure, at which the dipolar contribution in the dielectric loss factor starts to appear, increases as isothermal curing temperature is increased. The dielectric relaxation time at the same degree of cure was shorter for a sample cured at higher curing temperature.

• Journal of Welding and Joining
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• v.33 no.5
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• pp.41-46
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• 2015

The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

• Macromolecular Research
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• v.17 no.8
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• pp.585-590
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• 2009

The cure behaviors, dielectric characteristics and fracture toughness of diglycidylether of bisphenol-A (DGEBA)/poly(ethylene terephthalate) (PET) blend system were investigated. The degree of conversion for the DGEBA/PET blend system was measured using Fourier transform infrared (FTIR) spectroscopy. The cure kinetics were investigated by measuring the cure activation energies ($E_a$) with dynamic differential scanning calorimetry (DSC). The dielectric characteristic was examined by dielectric analysis (DEA). The mechanical properties were investigated by measuring the critical stress intensity factor ($K_{IC}$), critical strain energy release rate ($G_{IC}$), and impact strength test. As a result, DGEBAIPET was successfully blended. The Ea of the blend system was increased with increasing PET content to a maximum at 10 phr PET. The dielectric constant was decreased with increasing PET content. The mechanical properties of the blend system were also superior to those of the neat DGEBA. These results were attributed to the increased cross-linking density of the blend system, resulting from the interaction between the epoxy group of DGEBA and the carboxyl group of PET.

• Bulletin of the Korean Chemical Society
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• v.18 no.7
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• pp.715-719
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• 1997

In order to study the dielectric properties of the oriental lacquer films, three different films have been prepared differing purification and curing procedures. Dielectric properties were measured in the frequency range of 1 Hz to 105 Hz at various temperatures between - 50 ℃ and 150 ℃. The DEA using 1 Hz showed that glass transition and secondary relaxation temperatures of oriental lacquer film are very time dependent. In addition, the frequency-independent negative peak between 25 ℃ and 45 ℃ was observed, which could represent the formation of crosslink by laccase enzyme during heating. On the contrary, the high temperature cured film showed a hardly noticeable negative peak at the temperature range. The relationship between thermodynamic properties and chemical structures has been discussed based on the analysis of the dielectric relaxation behavior using the Cole-Cole plot and the dielectric relaxation intensity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.401-402
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• 2005

The important parts of material science in the film preparation fields and sol-gel technology are presented. For the present work, a series of amorphous films was prepared in air by sol-gel method without using some alkoxide stabilizer, which reduces the reactivity of the metal alkoxides. The choice of precursors can affect the chemical-reaction kinetics, microstructures and properties of the product. In this report author compared the crystallization behavior of oxide functional films derived from the same precursors, stressing the influence of experiment conditions and where it was possible to obtain the uniform amorphous or crystalline dielectric films. A short analysis of sol-gel technology and thin film methods about development of dielectric materials has been given.

• Proceedings of the KIEE Conference
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• 2004.11a
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• pp.230-232
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• 2004

In this paper, we investigated dielectric and insulation characteristics of epoxy resin which includes elastomers to improve mechanical property, as varied additive elastomer contents with 5[phr], 10[phr], 15[phr], and 20[phr]. We measured permittivity and tan $\delta$ at 1kHz of signal frequency and room temperature. And we also measured BVD(break-down voltage) and volume resistivities. According to the experimental results, it is appeared that when the additive elastomer contents are increasing, permittivity, volume resistivity, BVD and volume resistance are decreasing because elastomer remains inferior to epoxy resin on electrical properties.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.78-78
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• 2010

모바일 정보통신기기를 중심으로 패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있고 있으며 접속피치의 미세화에 따라 솔더 및 언더필을 사용하는 C4 공법보다 ACA(Anisotropic Conductive Adhesive), NCA (Non-conductive Adhesive) 등의 접착제를 이용하는 칩본딩 공법에 대한 요구가 증가하고 있다. 특히, NCA 공법의 경우 산업 현장의 대량생산에 대응하기 위해서는 접착제의 속경화 특성이 요구되어 진다. 일반적으로 접착제의 경화거동은 DSC(Differential Scanning Calorimeter)를 사용해 확인하지만, 수초 이내에 경화되는 접착제의 경우는 적용되기 어렵다. 본 연구에서는 이러한 전자패키지용 접착제의 속경화 거동을 효과적으로 평가할 수 있는 방법을 조사 하였다. 실험에서 사용된 접착제는 에폭시계 레진 기반에 이미다졸계 경화제를 사용한 기본적인 포뮬레이션을 사용하였고, 경화시간은 160^{\circ}C에서 1분 이내에 경화되는 특성을 가지고 있다. 경화 거동을 확인하기 위해서 isothermal DSC와 DEA(Dielectric Analysis)의 두가지 방법을 사용해 비교하였다. 두 실험 방법 모두 $160^{\circ}C$를 유지하며 경화 거동을 확인하였고, DoC(Degree of Cure)의 측정오차를 비교 분석하였다. DEA는 이온 모빌리티 변화에 따른 유전손실율을 측정하는 방법으로 80~90% 이후의 경화도는 측정되지 않았지만, 수초 이내에 경화되는 속경화 특성을 평가하기에 적합한 것으로 확인되었다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.64.1-64.1
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• 2011

LCD 디스플레이 등에 사용되는 글래스 패널 위에 bare si die를 직접 실장하는 COG 플립칩 패키지의 경우 Au 범프와 ITO 패드 간의 전기적 접속 및 접합부 신뢰성 확보를 위해 접속소재로서 ACF (anisotropic conductive film)가 사용되고 있다. 그러나 ACF는 고가이고 접속피치 미세화에 따라 브릿지 형상에 의한 쇼트 등의 문제가 발행할 수 있어 NCP (non-conductive paste)의 상용화가 요구되고 있다. 본 연구에서는 NCP를 적용한 COG 패키지에 있어서 온도, 압력 등의 열압착 본딩 조건과 NCP 물성이 Au-ITO 접합부의 전기적 및 기계적 특성에 미치는 영향을 조사하였다. NCP는 에폭시 레진과 경화제, 촉매제를 사용하여 다양하게 포뮬레이션을 하였고 DSC (Differential Scanning Calorimeter), TGA (Thermogravimetric Analysis), DEA (Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화 거동을 확인하였다. 테스트 베드는 면적 $5.2{\times}7.2\;mm^2$, 두께 650 ${\mu}m$, 접속피치 200 ${\mu}m$의 Au범프가 형성된 플립칩 실리콘 다이와 접속패드가 ITO로 finish된 글래스 기판을 사용하였다. 글래스 기판과 실리콘 칩은 본딩 전 PVA Tepla사의 Microwave 플라즈마 장비로 Ar, $O_2$ 플라즈마 처리를 하였으며, Panasonic FCB-3 플립칩 본더를 사용하여 본딩하였다. 본딩 후 접합면의 보이드를 평가하고 die 전단강도로 접합강도를 측정하였다.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.74-74
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• 2010

모바일 정보통신기기를 중심으로 전자패키지의 초소형화, 고집적화를 위해 플립칩 공법의 적용이 증가되고 있는 추세이다. 플립칩 패키징 접합소재로는 솔더, ICA(Isotropic Conductive Adhesive), ACA(Anisotropic Conductive Adhesive), NCA(Non Conductive Adhesive) 등과 같은 다양한 접합소재가 사용되고 있다. 최근에는 언더필을 사용하는 플립칩 공법보다 미세피치 대응성을 위해 NCP를 이용한 플립칩 공법에 대한 요구가 증가되고 있는데, NCP의 상용화를 위해서는 공정성과 함께 신뢰성 확보가 필요하다. 본 연구에서는 LDI(LCD drive IC) 모듈을 위한 COF(Chip-on-Film) 플립칩 패키징용 NCP 포뮬레이션을 개발하고 이를 적용한 COF 패키지의 신뢰성을 조사하였다. 테스트베드는 면적 $1.2{\times}0.9mm$, 두께 $470{\mu}m$, 접속피치 $25{\mu}m$의 Au범프가 형성된 플리칩 실리콘다이와 접속패드가 Sn으로 finish된 폴리이미드 재질의 flexible 기판을 사용하였다. NCP는 에폭시 레진과 산무수물계 경화제, 이미다졸계 촉매제를 사용하여 다양하게 포뮬레이션을 하였다. DSC(Differential Scanning Calorimeter), TGA(Thermogravimetric Analysis), DEA(Dielectric Analysis) 등의 열분석장비를 이용하여 NCP의 물성과 경화거동을 확인하였으며, 본딩 후에는 보이드를 평가하고 Peel 강도를 측정하였다. 최적의 공정으로 제작된 COF 패키지에 대한 HTS (High Temperature Stress), TC (Thermal Cycling), PCT (Pressure Cooker Test)등의 신뢰성 시험을 수행한 결과 양산 적용 가능 수준의 신뢰성을 갖는 것을 확인할 수 있었다.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.