• 제목/요약/키워드: DC reactive sputtering

검색결과 196건 처리시간 0.03초

반응성 마그네트론 프로세스에 의한 ITO박막 형성에 관한 연구 (A study on the formation of ITO thin film by DC reactive magnetron sputtering)

  • 곽영순;조정수;박정후;하홍주;성열문
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1992년도 하계학술대회 논문집 B
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    • pp.897-899
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    • 1992
  • This paper deals with the characteristics of Indium Tin Oxide(ITO) sputtered by the reactive magnetron sputtering process. ITO films have been grown at various substrate temperatures(R.T, 100$^{\circ}C$, 200$^{\circ}C$, 240$^{\circ}C$) and we used the target material of alloy of Indium and Tin. The electrical and optical properties of the ITO film have been investigated and the effect of magnetic field to the properties of ITO was studied. We have studied how much the improvement of transmission rate and sheet resistivity by heat treatment was. The sample with good electrical and optical properties can be obtained for the low substrate temperature of 200$^{\circ}C$-250$^{\circ}C$.

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다양한 색상 구현을 위한 물리적 박막 증착 공정에 관한 연구

  • 김병철;김왕렬;김현승;오철욱;송선구;국형원;권민철
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.244.2-244.2
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    • 2014
  • 금속, 플라스틱, 유리 등의 재료 표면에 다양한 색상을 표현하기 위해 일반적으로 습식 도금을 많이 적용하고 있다. 하지만 습식 도금은 공정 수가 많을 뿐만 아니라 위험물질 및 오염물질을 많이 사용하기 때문에 산업사고, 환경오염 등을 야기 시킨다. 따라서 본 연구에서는 친환경적 방법인 물리적기상증착(PVD ; Physical Vapor Deposition) 방식의 한 종류인 스퍼터링(Sputtering)으로 색상을 구현하였다. PVD 방식의 증착은 습식 도금 방식에 비해 친환경적이며, 전처리에서 후처리까지 한 공정으로 가능하다는 점이다. 스퍼터링은 PVD의 다른 방식인 E-beam 방식에 비해 대량생산을 할 수 있다는 장점이 있다. 양산형 스퍼터링 장비(${\Phi}1200mm{\times}H1400mm$)로 실험을 진행하였으며, 증착 물질은 Ti, Al, Cr 을 사용하였고, 반응성 가스(Reactive Gas) 로는 N2, C2H2 가스를 사용하였다. 전처리는 LIS (Linear Ion Source)로 식각(Etching) 하였고, 펄스직류전원공급장치(Pulsed DC Power Supply)를 사용하여 증착 하였으며, 증착시 기판에 bias (-100 V)를 인가 하였다. 그 결과 회색계열, 갈색계열 등 여러가지 색을 구현할 수 있었으며, 증착된 박막의 특성을 알아보기 위하여 색차계, 내마모 시험기, 연필경도 시험기를 사용하였다. 향후 후처리 공정으로 내지문(AF ; anti fingerprint coating) 박막 등과 같은 실용적인 박막을 증착할 계획이다.

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Microstructure and Corrosion Properties of TiNX Thin Films Prepared by High Density Plasma Reactive Magnetron Sputtering with Electromagnetic Field System

  • 김정혁;박지봉;송풍근
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2011년도 제40회 동계학술대회 초록집
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    • pp.311-311
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    • 2011
  • $TiN{\times}$박막은 우수한 내마모성 및 내부식성, 높은 경도 그리고 열적 안정성 등으로 인하여, 절삭공구 및 기계적 부품의 하드코팅, 2차 연료 전지용 확산방지막의 코팅재료로서 광범위하게 사용되어지고 있다. 일반적으로 $TiN{\times}$ 박막은 화학 기상 증착법(CVD)을 이용하였으나, 최근에는 대면적에 균일한 코팅이 가능하고 기판과 박막상의 부착력이 우수하며, 프로세스를 제어하기 쉬운 물리적 기상 증착법(PVD)의 스퍼터링법에 대한 관심이 고조되고 있다. 그러나 스퍼터링법으로 증착된 $TiN{\times}$ 박막의 물성은 주상구조와 국부적 표면결함을 포함하는 박막의 미세구조에 의존하기 때문에 주상구조 사이에 존재하는 Void 와 Pinhole 그리고 crack들이 원인으로 작용하여, 내부식성 및 기계적 특성이 급속도로 저하되는 단점이 있다. 이러한 단점을 보완하기 위해서, 본 연구에서는 기판온도를(RT, $200^{\circ}C$, $400^{\circ}C$)증가시켜 실험 하였다. 이는 온도증가에 따른 박막의 치밀화가 이루어지고 결함이 감소하여 내부식성 특성향상이 기대되어진다. 또한 플라즈마 밀도를 높이기 위해서, 기존 DC 마그네트론 스퍼터링법에 전자기장을 추가로 인가하였다. 이는 플라즈마 밀도증가에 따른 고반응성의 질소 래디컬의 생성율 증가에 기인하여 박막 형성시 질화반응을 촉진시킴으로써 박막의 치밀화 및 내부식성 특성향상이 기대되어진다.

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고품위 자성체 박막 코팅 시스템 (Coating System for High Quality Ferromagnetic Thin Films)

  • 김기범;황윤식;김영식;박장식;박재범
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2007년도 추계학술대회 논문집
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    • pp.231-232
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    • 2007
  • Nickel oxide thin films were deposited by the DC magnetron reactive sputtering process under the conditions such as various oxygen flow rates(0, 3, 6, 8, 10 sccm) with constant 33 sccm argon flow rate for the sputtering time of 40 second with the power of 0.3 kW. Sheet resistances were measured by the four point probes. In order to observe discharge voltage characteristics according to the oxygen flow rates, the sputtering processes were performed under the powers of 0.2kW and 0.3kW. The feasibility of the coating system for high quality ferromagnetic thin films was tested through the electromagnetic simulation and the thin film thickness measurement from the experiment. It was shown that a discharge voltage was decreased under the low power and low oxygen flow rate, since the oxygen was quickly saturated on nickel target surface. The sheet resistance was increased as oxygen flow rate increased. The film thickness deposited by the coating system for ferromagnetic target was improved approximately 10% in comparison with previous coating systems.

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Tribological Properties of Sputtered Boron Carbide Coating and the Effect of ${CH}_4$ Reactive Component of Processing Gas

  • Cuong, Pham-Duc;Ahn, Hyo-Sok;Kim, Jong-Hee;Shin, Kyung-Ho
    • KSTLE International Journal
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    • 제4권2호
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    • pp.56-59
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    • 2003
  • Boron carbide thin coatings were deposited on silicon wafers by DC magnetron sputtering using a ${B}_4$C target with Ar as processing gas. Various amounts of methane gas (${CH}_4$) were added in the deposition process to better understand their influence on tribological properties of the coatings. Reciprocating wear tests employing an oscillating friction wear tester were performed to investigate the tribological behaviors of the coatings in ambient environment. The chemical characteristics of the coatings and worn surfaces were studied using X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES). It revealed that ${CH}_4$addition to Ar processing gas strongly affected the tribologcal properties of sputtered boron carbide coating. The coefficient of friction was reduced approximately from 0.4 to 0.1, and wear resistance was improved considerably by increasing the ratio of ${CH}_4$gas component from 0 to 1.2 vol %. By adding a sufficient amount of ${CH}_4$(1.2 %) in the deposition process, the boron carbide coating exhibited lowest friction and highest wear resistance.

Effect of Non-lattice Oxygen Concentration and Micro-structure on Resistance Switching Characteristics in Nb-doped HfO2 by DC Magnetron Co-Sputtering

  • 이규민;김종기;김영재;김종일;손현철
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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    • pp.378.1-378.1
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    • 2014
  • In this study, we investigated that the resistance switching characteristics of Nb-doped HfO2 films with increasing Nb doping concentration. The Nb-doped HfO2 based ReRAM devices with a TiN/Nb-doped HfO2/Pt/Ti/SiO2 were fabricated on Si substrates. The Nb-doped HfO2 films were deposited by reactive dc magnetron co-sputtering at $300^{\circ}C$ and oxygen partial ratio of 60% (Ar: 16sccm, O2: 24sccm). Microstructure of Nb-doped HfO2 films and atomic concentration were investigated by XRD, TEM, and XPS, respectively. The Nb-doped HfO2 films showed set/reset resistance switching behavior at various Nb doping concentrations. The process voltage of forming/set is decreased and whereas the initial current level is increased in doped HfO2 films. However, the switching properties of Nb-doped HfO2 were changed above the specific doping concentration of Nb. The change of resistance switching behavior depending on doping concentration was discussed in terms of concentration of non-lattice oxygen and micro-structure of Nb-doped HfO2.

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Tribological properties of sputtered boron carbide coating and the effect of $CH_4$ reactive component of processing gas

  • Cuong Pham Duc;Ahn Hyo-Sok;Kim Jong-Hee;Shin Kyung-Ho
    • 한국윤활학회:학술대회논문집
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    • 한국윤활학회 2003년도 학술대회지
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    • pp.78-84
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    • 2003
  • Boron carbide thin coatings were deposited on silicon wafers by DC magnetron sputtering using a $B_4C$ target with As as processing gas. Various amounts of methane gas $(CH_4)$ were added in the deposition process to better understand their influence on tribological properties of the coatings. Reciprocating wear tests employing an oscillating friction wear tester were performed to investigate the tribological behaviors of the coatings in ambient environment. The chemical characteristics of the coatings and worn surfaces were studied using X-ray Photoelectron Spectroscopy (XPS) and Auger Electron Spectroscopy (AES). It revealed that $CH_4$ addition to As processing gas strongly affected the tribologcal properties of sputtered boron carbide coating. The coefficient of friction was reduced approximately from 0.4 to 0.1, and wear resistance was improved considerably by increasing the ratio of $CH_4$, gas component from 0 to $1.2\;vol\;\%$. By adding a sufficient amount of $CH_4\;(1.2\%)$ in the deposition process, the boron carbide coating exhibited lowest friction and highest wear resistance.

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N 도핑된 TiO2 광촉매 박막의 제조 및 특성분석 (Manufacturing and Characterization of N-doped TiO2 Photocatalytic Thin Film)

  • 박상원;남수경;허재은
    • 한국환경과학회지
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    • 제16권6호
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    • pp.683-688
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    • 2007
  • In this study, N doped $TiO_2$ (TiO-N) thin film was prepared by DC magnetron sputtering method to show the photocatalytic activity in a visible range. Various gases (Ar, $O_2\;and\;N_2$) were used and Ti target was impressed by 1.2 kW -5.8 kW power range. The hysteresis of TiO-N thin film as a function of discharge voltage wasn't observed in 1.2 and 2.9kW of applied power. Cross sections and surfaces of thin films by FE-SEM were tiny and dense particle sizes of both films with normal cylindrical structures. XRD pattern of $TiO_2$ and TiO-N thin films was appeared by only anatase peak. Red shift in UV-Vis adsorption spectra was investigated TiO-N thin film. Photoactivity was evaluated by removal rate measurement of suncion yellow among reactive dyes. The photodegradation rate of $TiO_2$ thin film on visible radiation was shown little efficiency but TiO-N was about 18%.

스퍼터링법으로 저작한 Al/AlN/GaAs MIS 구조에서 절연박막에 수소가스첨가가 미치는 영향 (Effects of hydrogen gas addition on insulator thin film of Al/AlN/GaAs MIS system fabricated by sputtering method)

  • 권정열;김민석;김지균;이환철;이헌용
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1999년도 하계학술대회 논문집 D
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    • pp.1925-1927
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    • 1999
  • At the study, it has fabricated Al/AlN/GaAs MIS capacitor using DC reactive sputtering method. To applicate GaAs semiconductor in a MIS devices, investigated capability of AIN thin film by the insulator layer. Also it has investigated inversion of C-V characteristics by addition of the hydrogen(hydrogen concentration: 5%) and it has investigated that leakage current has $10^{-8}A/cm^2$ for 1 MV/cm breakdown electric field of I-V characteristics.

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매개층 알루미늄산화막과 백금 발열체의 열처리 효과 (The Effect of Annealing Treament with Aluminum Oxide as Medium Layer and Platinum Heater)

  • 노상수;정귀상
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1997년도 춘계학술대회 논문집
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    • pp.314-317
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    • 1997
  • The electrical and physical characteristics of aluminum oxide and Pt thin films on it, deposited by reactive sputtering and DC magnetron sputtering respectively, were analyzed with increasing annealing temperature(400~80$0^{\circ}C$) by four point probe, SEM and XRD. Under $600^{\circ}C$ of annealing temperature, aluminum oxide had the properties of improving Pt adhesion to SiO$_2$and insulation without chemical reaction to Pt thin films and the resistivity of Pt thin films was improved. But these properties of aluminum oxide and Pt thin films on it were degraded over $700^{\circ}C$ of annealing temperature because aluminum oxide was changed into metal aluminum and then reacted to Pt thin films deposited on it. In the analysis of the thermal charateristics of Pt micro-heater fabricated on Si07/si substrate, the temperature of Pt micro-heater is up to 41$0^{\circ}C$ with the power dissipation 1.8 watts.

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