• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.195.1-195.1
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• 2013

Cu는 금속 박막재료로서 높은 전기전도성을 지니고 있을 뿐만 아니라 Ag, Al, Pt 등 보다 비용이 저렴하여, 높은 전기전도성을 필요로 하는 박막 재료로써 폭넓게 사용되고 있다. 그러나, 낮은 기계적 특성을 지니고 있어서 interconnect와 같은 작은 단면적의 배선재료로 사용될 경우, 높은 전류밀도에 따른 electromigration 현상에 의하여 hillock 또는 void의 형성 등 박막재료의 변형이 생기게 되어서 전자소자의 수명이 단축된다는 단점이 있다. TiN은 금속재료 못지않은 높은 전기 전도성을 지니고 있을 뿐만 아니라, 금속재료에 비하여 높은 기계적 특성과 녹는점을 지니고 있어 다양한 분야로 사용되고 있다. 본 연구에서는 Cu와 TiN composite 박막을 soda-lime glass위에 증착하여 낮은 비저항 뿐만 아니라 Cu와 비교하여 기계적 특성이 향상된 박막을 제작하고자 하였다. Cu와 TiN composite 박막 증착을 위하여 DC reactive magnetron co-sputtering 장비를 사용하였으며, Cu와 Ti 타겟 power, Ar:N2 유량비(Flow rate)을 변화시켜 Cu와 Ti의 조성비 및 TiN의 결정성을 조절하였고, 이를 통하여 박막의 TiN 조성에 따른 낮은 비저항 값과 순수한 Cu 박막과 비교하여 높은 기계적 특성을 지닌 Cu-TiN 박막을 증착하였다. Cu-TiN composite 박막의 구조 및 조성은 SEM (Scanning Electron Microscope), EDS (Energy Dispersive Spectrometer), XPS (X-ray Photoelectron Spectroscopy)장비를 사용하여 분석하였으며, 전기전도도는 4-point probe를 사용하여 측정하였고, Knoop hardness 측정방법을 사용하여 박막의 기계적 특성을 측정하였다.

• 한국표면공학회지
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• 제45권5호
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• pp.206-211
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• 2012

Process analysis was carried out during deposition of MgO by inductively coupled plasma assisted reactive magnetron sputtering in Ar and $O_2$ ambient. At the initiation of Mg sputtering with bipolar pulsed dc power in Ar ambient, total pressure showed sharp increase and then slow fall. To analyse partial pressure change, QMS was used in downstream region, where the total pressure was maintained as low as $10^{-5}$ Torr during plasma processing, good for ion source and quadrupole operation. At base pressure, the major impurity was $H_2O$ and the second major impurity was $CO/N_2$ about 10%. During sputtering of Mg in Ar, $H_2$ soared up to 10.7% of Ar and remained as the major impurity during all the later process time. When $O_2$ was mixed with Ar, the partial pressure of Ar decreased in proportion to $O_2$ flow rate and that of $H_2$ dropped down to 2%. It was understood as Mg target surface was oxidized to stop $H_2$ emission by Ar ion sputtering. With ICP turned on, the major impurity $H_2$ was converted into $H_2O$ consuming $O_2$ and C was also oxidized to evolve CO and $CO_2$.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2012년도 추계총회 및 학술대회 논문집
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• pp.179-180
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• 2012

Aluminum alloys are widely known as non-ferrous metal with light weight and high strength. Consequently, these materials take center stage in the aircraft and automobile industry. The Al7075 aluminum alloy is based on the Al-Zn-Mg-Cu and one of the strongest wrought aluminum alloys. Aluminum nitride has ten times higher thermal conductivity($319W/m{\cdot}K$) than Al2O3 and also has outstanding electric insulation($1{\times}1014{\Omega}{\cdot}cm$). Furthermore, it has high mechanical property (430 MPa) even though its co-efficient of thermal expansion is less than alumina For these reasons, it has great possibilities to be used for not only the field which needs high strength lightweight but also electronic material field because of its suitability to be applied to the insulator film of PCB or wafer of ceramic with high heat conduction. This paper investigates the mechanical properties and corrosion behavior of aluminum alloy Al7075 deposited with aluminum nitride thin films To improve the surface properties of Al7075 with respect to hardness, and resistance to corrosion, aluminum nitride thin films have been deposited by pulsed DC reactive magnetron sputtering. The pulsed DC power provides arc-free deposition of insulating films.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.378.1-378.1
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• 2014

In this study, we investigated that the resistance switching characteristics of Nb-doped HfO2 films with increasing Nb doping concentration. The Nb-doped HfO2 based ReRAM devices with a TiN/Nb-doped HfO2/Pt/Ti/SiO2 were fabricated on Si substrates. The Nb-doped HfO2 films were deposited by reactive dc magnetron co-sputtering at $300^{\circ}C$ and oxygen partial ratio of 60% (Ar: 16sccm, O2: 24sccm). Microstructure of Nb-doped HfO2 films and atomic concentration were investigated by XRD, TEM, and XPS, respectively. The Nb-doped HfO2 films showed set/reset resistance switching behavior at various Nb doping concentrations. The process voltage of forming/set is decreased and whereas the initial current level is increased in doped HfO2 films. However, the switching properties of Nb-doped HfO2 were changed above the specific doping concentration of Nb. The change of resistance switching behavior depending on doping concentration was discussed in terms of concentration of non-lattice oxygen and micro-structure of Nb-doped HfO2.

• 한국재료학회지
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• 제11권5호
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• pp.339-344
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• 2001

코발트 산화물 박막을 전극으로 하여 Pt/Ti/Si 기판위에 Co$_3$O$_4$/LiPON/Co$_3$O$_4$로 구성된 전고상의 박막형 슈퍼캐패시터를 제작하였다. 각각의 Co$_3$O$_4$박막은 반응성 dc 마그네트론 스퍼터를 이용하여 $O_2$/[Ar+O$_2$] 비를 증가 시키며 성장시켰고, 비정질 LiPON 고체전해질 박막은 순수한 질소분위기 하에서 rf 스퍼터링으로 성장시켰다. 비록 벌크 타입의 슈퍼캐패시터에 비해 낮은 전기용량 (5-25mF/$\textrm{cm}^2$-$\mu\textrm{m}$)을 가졌지만, Co$_3$O$_4$/LiPON/Co$_3$O$_4$ 구조로 제작된 전고상 박막형 슈퍼캐패시터는 벌크 타입과 비슷한 거동을 나타내었다 0-2V의 전압구간, 50$\mu\textrm{A}/\textrm{cm}^2$의 전류밀도에서 약 400사이클 까지 안정한 방전용량을 유지함을 관찰할 수 있었다 이러한 전고상 박막형 슈퍼캐패시터의 전기화학적 특성은 $O_2$/[Ar+O$_2$] 비에 의존하는데, 이러한 의존성을 구조적, 전기적 특성 및 표면특성을 분석하여 설명하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 추계학술대회 논문집
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• pp.231-232
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• 2007

Nickel oxide thin films were deposited by the DC magnetron reactive sputtering process under the conditions such as various oxygen flow rates(0, 3, 6, 8, 10 sccm) with constant 33 sccm argon flow rate for the sputtering time of 40 second with the power of 0.3 kW. Sheet resistances were measured by the four point probes. In order to observe discharge voltage characteristics according to the oxygen flow rates, the sputtering processes were performed under the powers of 0.2kW and 0.3kW. The feasibility of the coating system for high quality ferromagnetic thin films was tested through the electromagnetic simulation and the thin film thickness measurement from the experiment. It was shown that a discharge voltage was decreased under the low power and low oxygen flow rate, since the oxygen was quickly saturated on nickel target surface. The sheet resistance was increased as oxygen flow rate increased. The film thickness deposited by the coating system for ferromagnetic target was improved approximately 10% in comparison with previous coating systems.

• 전기화학회지
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• 제3권4호
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• pp.219-223
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• 2000

구리-바나듐 산화물 양극을 이용하여 $(Cu_{0.5}V_2O_5)$으로 구성된 전 고상의 리튬이차박막전지를 제작하였다. 구리-바나듐 산화물 박막은 reactive DC magnetron sputtering을 이용하여 co-sputtering에 의해 제조하였고 Lipon고체전해질은 순수한 질소 분위기 하에서 RF 스퍼터링으로 제조하였다. XRD분석을 통해 구리-바나듐 산화물 박막이 비정질임을 확인하였고, EC:DMC(1:1 in IM $LiPF_5$)액체전해질을 사용한 반전지 구조에서 그 전기화학적 특성을 고찰하였다. Lipon고체전해질의 이온전도도는 $25^{\circ}C$에서 $1.02\times10^{-6}S/cm$를 나타내었고 전고상 박막전지는 $1.5V\~3.6V$의 전압구간, $50{\mu}A/cm^2$의 전류밀도에서 500싸이클까지 약 $50{\mu}Ah/cm^2{\mu}m$의 방전용량을 유지하였다

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2002년도 춘계학술발표회 초록집
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• pp.49-49
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• 2002

독립된 티타늄(Ti)과 실리콘(Si) 타켓을 사용하여 DC reactive magnetron co-sputtering 공 정으로 Ti-Si-N 코탱막을 SKD 11 합금강위에 합성하였다. 고분해능 TEM 및 XPS 분석들로부터 Ti-Si-N 코탱막은 나노미터 크기의 TiN결정체들이 비정질 Si3N4 기지에 분산된 나노복합체의 마세구조를 냐타내었다. 코탱막의 경도는 11 at.%의 Si 함량에서 39 GPa의 최 고 경도값을 나타내었고 이 경우 미셰조직은 5nm 크기의 미세한 TiN 결정이 비정절상의 기지에 균일하게 분포된 특성을 보였다 .. Ti-Si-N 박막내에 Si 함량이 증가할수록 TiN 결정 상들은 다배향성을 나타내었고 크기가 감소하였으며 비정질상에 의해 완전히 둘려싸언 형상 으로 변화하였다. 높은 Si 함량에서는 질소 소스의 부족현상에 의하여 코팅막내에서 free Si 가 나타났다. 상대습도가 증가함에 따라 Ti-Si-N 코탱막의 마찰계수와 마모량이 현저하게 감소하였다. 강재에 대한 Ti-Si-N 코팅막의 마모거동에 있어서 Si02 냐 Si(OH)2 같은 얇은 윤활막의 형성이 중요한 역할을 하는 것으로 판단되어졌다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.288-288
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• 2012

In this study, we investigated that the resistance switching characteristics of W-doped NbOx films with increasing W doping concentration. The W-doped NbOx based ReRAM devices with a TiN/W-doped NbOx/Pt/Ti/SiO2 were fabricated on Si substrates. The 50 nm thick W-doped NbOx films were deposited by reactive dc magnetron co-sputtering at $400^{\circ}C$ and oxygen partial pressure of 35%. Micro-structure of W-doped NbOx films and atomic concentration were investigated by XRD, TEM and XPS, respectively. The W-doped NbOx films showed set/reset resistance switching behavior at various W doping concentrations. The process voltage of set/reset is decreased and whereas the initial current level is increased with increasing W doping concentration in NbOx films. The change of resistance switching behavior depending on doping concentration was discussed in terms of concentration of metallic tungsten of oxygen of W-doped NbOx.

• 센서학회지
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• 제14권1호
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• pp.56-61
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• 2005

This paper present characteristics of chromium oxide thin-film as piezoresistive sensors, which were deposited on Si substrates by DC reactive magnetron sputtering in an argon-Oxide atmosphere for high temperature applications. The chemical composition, physical and electrical properties and thermal stability ranges of the $CrO_{x}$ sensing elements have studied. $CrO_{x}$ thin films with a linear gauge factor(GF${\fallingdotseq}$15), high electrical resistivity (${\rho}$ = $340{\mu}{\Omega}cm$) and TCR<-55 ppm/$^{\circ}C$ have been obtained. These $CrO_{x}$ thin films may allow high temperature pressure sensor miniaturization to be achieved.