• 제목/요약/키워드: DC bias voltage

검색결과 275건 처리시간 0.028초

The Mechanical and Optical Properties of Diamond-like Carbon Films on Buffer-Layered Zinc Sulfide Substrates

  • Song, Young-Silk;Song, Jerng-Sik;Park, Yoon
    • The Korean Journal of Ceramics
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    • 제4권1호
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    • pp.9-14
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    • 1998
  • Diamond-like carbon(DLC) films were deposited on buffer-layered ZnS substrates by radio frequency plasma enhanced chemical vapor deposition(RF-PECVD) method. Ge and GeC buffer layera were used between DLC and ZnS substrates to promote the adhesion of DLC on ZnS substrates. Ge buffer layers were sputter deposited by RF magnetron sputtering and $GeC^1$ buffer layers were deposited by same method except using acetylene reactive gas. The relatinship between film properties and deposition conditions was investigated using gas pressure, RF power and dc bias voltage as PECVD parameters. The hardness of DLC films were measured by micro Vickers hardness test and the adhesion of DLC films on buffer-layered ZnS substrates were studied by Sebastian V stud pull tester. The optical properties of DLC films on butter-layered ZnS substrates were characterized by ellipsometer and FTIR spectroscopy.

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Characterization of Diamond-like Carbon Films Prepared by Magnetron Plasma Chemical Vapor Deposition

  • Soung Young Kim;Jai Sung Lee;Jin Seok Park
    • The Korean Journal of Ceramics
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    • 제4권1호
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    • pp.20-24
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    • 1998
  • Thin films of diamond-like carbon(DLC) can be successfully deposited by using a magnetron plasma chemical vapor deposition (CVD) method with an rf(13.56 MHz) plasma of $C_dH_8$. Plasma characteristics are analyzed as a function of the magnetic field. As the magnetic field increases, both electron temperature ($T_e$) and density ($n_e$)increase, but the negative dc self-bias voltage (-$V_{ab}$) decreases, irrespective of gas pressures in the range of 1~7 mTorr. High deposition rates have been obtained even at low gas pressures, which may be attributed to the increased mean free path of electrons in the magentron plasma. Effects of rf power and additive gas on the structural properties of DLC films aer also examined by using various technique namely, TED(transmissio electron diffraction) microanalysis, FTIR, and Raman spectroscopies.

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멤브레인 구조를 위한 DLC 박막의 특성에 관한 연구 (A study of properties of DLC films for membrane structure)

  • 이태용;김응권;박용섭;홍병유;송준태;박영
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.2
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    • pp.748-752
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    • 2004
  • The Hydrogenated amorphous carbon (a-C:H) thin films are deposited to fabricate suppored layer on silicon substrate with a closed field unbalanced magnetron(CFUBM) sputtering system. This study focuses on the characteristic of Diamond like carbon (DLC) films and Pb(Zr,Ti)$O_3$ (PZT) films for membrane structure. The deposition rate and the surface roughness of DLC fims decrease with DC bias voltage. hardness is 26 GPa at -200 V. Interface of DLC/Si and Pt/DLC layers was excellent.

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유도 결합 플라즈마를 이용한 $TiO_2$ 박막의 식각 특성 (The Etching Characteristics of $TiO_2$ ThinFilms Using the Inductively Coupled Plasma)

  • 주영희;김창일
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.385-385
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    • 2010
  • In this work, we have investigated the etching characteristics of $TiO_2$ and selectivity of $TiO_2$ over $SiO_2$ thin films as resistance in ReRAM using the inductively coupled plasma. The etch rate and selectivity were measured by varying the $BCl_3$ addition into Ar plasma. The maximum etchrate was obtained at 110.1nm/min at $BCl_3$/Ar=5sccm/10sccm, 500W for RFpower, -100v for DC-bias voltage, and 2Pa for the process pressure. The etched $TiO_2$ surface was investigated with X-ray photo electron spectroscopy. We explained the etching mechanism in two etch mechanisms, physiclas puttering and chemical reaction.

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Microwave properties of pulsed-laser SrTiO$_3$ thin films at low temperatures

  • Lee, G.D.;Kim, C.O.;Hong, J.P.;Kwak, J.S.
    • 한국초전도학회:학술대회논문집
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    • 한국초전도학회 2000년도 High Temperature Superconductivity Vol.X
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    • pp.207-210
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    • 2000
  • Properties of SrTiO$_3$ thin films were characterized under the influence of an applied dc voltage utilizing a gold resonator with a flip-chip capacitor. The measurements were performed at microwave frequency ranges and low temperatures cryogenic temperatures. The dielectric constant of 830 and the low loss tangent of 6X10$^{-3}$ at 3.64 GHz were observed at 90 K and 100 V. The quality in the SrTiO$_3$ film was presented in terms of fractional frequency under the bias voltages and cryogenic temperatures.

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EHD 원리를 이용한 정전기장 유도 잉크젯 프린터 헤드의 마이크로 Drop-on-Demand 제팅 성능 연구

  • 최재용;김용재;손상욱;안기철;이석한;고한서;;변도영
    • 대한기계학회:학술대회논문집
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    • 대한기계학회 2008년도 추계학술대회A
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    • pp.1947-1950
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    • 2008
  • Printing technology is a very useful method in the several process of industrial fabrication due to noncontact and fast pattern generation. To make micro pattern, we investigate the electrostatic induced inkjet printer head for micro droplet generation and drop-on-demand jetting. In order to achieve the drop-on-demand micro droplet ejection by the electrostatic induced inkjet printer head, the pulsed DC voltage is supplied. In order to find optimal pulse conditions, we tested jetting performance for various bias and pulse voltages for drop-on-demand ejection. In this result, we have successful drop-on-demand operation and micro patterning. Therefore, our novel electrostatic induced inkjet head printing system will be applied industrial area comparing conventional printing technology.

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$BCl_3/Ar$ 고밀도 플라즈마를 이용한 ZnS:Mn 박막의 식각 특성 (Etching characteristics of ZnS:Mn thin films using $BCl_3/Ar$ high density plasma)

  • 김관하;김창일;이철인;김태형
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2005년도 추계학술대회 논문집 Vol.18
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    • pp.124-125
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    • 2005
  • ZnS:Mn thin films have attracted great interest as electroluminescence devices. In this study, inductively coupled BCl$_3$/Ar plasma was used to etch ZnS:Mn thin films. We obtained the maximum etch rate of ZnS:Mn thin films was 2209 ${\AA}$/min at a BCl$_3$(20%)/Ar(80%) gas mixing ratio, an RF power of 700 W, a DC bias voltage of-250 V, a total gas flow of 20 sccm, and a chamber pressure of 1 Pa. It was proposed that sputter etching is dominant etching mechanism while the contribution of chemical reaction is relatively low due to low volatility of etching products.

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마이크로파대에서의 강유전 박막 유전 특성 평가 (Characterization of Ferroelectric Thin Film in Microwave Region)

  • 박정흠
    • 한국전기전자재료학회논문지
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    • 제17권10호
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    • pp.1061-1067
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    • 2004
  • In this study, ferroelectric (Ba,Sr)TiO$_3$ and high temperature superconductor YBCO thin films were fabricated by PLD (Pulsed Laser Deposition) method and tuneable bandstop filters were implemented with two different IDC(Interdigital Capacitance) gap patterns, 20${\mu}{\textrm}{m}$ and 30${\mu}{\textrm}{m}$ using these two thin film layers. The resonant frequency was changed by DC bias voltage. By comparing measured results with simulation, the dielectric properties of ferroelectric thin film have been extracted. The permittivity was 820 ~ 900 at 30 K and had an acceptable error range but the loss tangent had a great difference, 0.018 in 30${\mu}{\textrm}{m}$ IDC gap pattern and 0.037 in 20 ${\mu}{\textrm}{m}$.

$Cl_2/Ar$ 유도결합 플라즈마를 이용한 SBT 박막의 건식 식각 특성 (Dry etching properties of SBT thin films using $Cl_2/Ar$ inductively coupled plasma)

  • 여지원;김경태;김동표;김창일
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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    • pp.404-407
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    • 2003
  • Among the ferroeletric thin films that have been widely investigated for ferroelectric random access memory (FRAM) applications, the $SrBi_2Ta_2O_9$ (SBT) thin film is appropriate as a memory capacitor material due to its excellent fatigue endurance. SBT thin films were etched in high-density $Cl_2/Ar$ in inductively coupled plasma. The maximum etch rate of SBT film is $1834\;{\AA}/min$ under $Cl_2/(Cl_2+Ar)$ of 30 %, rf power of 700 W, dc-bias voltage of -250 V, chamber pressure of 11 mTorr and gas flow rate of 20 sccm.

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Decontamination of Metal Surface by Reactive Cold Plasma

  • YUN Sang-pil;JEON Sang-hwan;KIM Yang-saa
    • 한국방사성폐기물학회:학술대회논문집
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    • 한국방사성폐기물학회 2005년도 Proceedings of The 6th korea-china joint workshop on nuclear waste management
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    • pp.300-315
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    • 2005
  • Recently plasma surface-cleaning or surface-etching techniques have been focused in the respect of decontamination of spent or used nuclear parts and equipment. In this study decontamination rate of metallic cobalt surface was experimentally investigated via its surface etching rate with a $CF_4-O_2$ mixed gas plasma and metallic surface wastes of cobalt oxides were simulated and decontaminated with $NF_3$ - Ar mixed gas plasma. Experimental results revealed that a mixed etchant gas with about $80{\%}\;CF_4-20{\%}\;O_2$ gives the highest reaction rate of cobalt disk and the rate reaches with a negative 300 DC bias voltage up to $0.43\;{\mu}m$/min at $380^{\circ}C$ and $20{\%}\;NF_3-80\%$ Ar mixed gas gives $0.2\;{\mu}m$/min of reaction rate of cobalt oxide film.

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