• Title/Summary/Keyword: D-glass

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Effect of Particle Size Distribution of Glass Frit on the Transparency of Transparent Dielectric Layer for Plasma Display Panel

  • Park, Ji-Su;Han, Sun-Mi;Hwang, Jong-Hee;Lim, Tae-Young;Kim, Kwang-Jin;Masaki, Takaki
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.555-557
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    • 2004
  • We report the effect of the particle size (D50) and PSD (Particle Size Distribution) of glass frit on the transparency of transparent dielectric layer of PDP. The milling efficiency of wet milling with water was the best among the dry milling, wet milling with IPA and wet milling with water. The transparency increased with the reduction of particle size of glass frit as the milling time increased. Also the transparency changed by the PSD of glass frit. Glass frits of broad PSD showed high transparency compared with the glass frits of sharp PSD.

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Transcription Characteristics in the Molding of Aspheric Glass Lenses for Camera Phone Module (휴대폰 카메라용 비구면 Glass 렌즈 전사특성 분석)

  • Cha, D.H.;Lee, J.K.;Kim, M.J.;Lee, D.K.;Kim, H.J.;Kim, J.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2008.10a
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    • pp.363-366
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    • 2008
  • The transcription characteristics in the molding of aspheric glass lenses for camera phone modules have been investigated experimentally. The surface topographies of both the form and the roughness were compared between the mold and the molded lens. The molded lens showed a transcription ratio of 93.4%, which is obtained by comparing the form accuracy (PV) values of the mold and the molded lens. The transcription of the roughness topography was ascertained by bearing ratio analysis.

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Effect of Thermal Aging Temperature on Weight Loss and Glass Transition Temperature of Epoxy Adhesives (열화 온도가 에폭시 접착제의 질량변화 및 유리전이온도에 미치는 영향)

  • Park, Soo-Jin;Kim, Jong-Hak;Joo, Hyeok-Jong;Kim, Joon-Hyung;Jin, Fan-Long
    • Elastomers and Composites
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    • v.41 no.1
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    • pp.19-26
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    • 2006
  • In this study, the effect of thermal aging temperature on the weight loss, glass transition temperature, and morphology of epoxy adhesives cured with amine (D-230), amide (G-5022), and anhydride (HN-2200) was investigated. As a result, the weight loss of three specimens was increased with increasing the thermal aging temperature. The result was attributed to the thermal aging which was occurred at the surface of adhesive specimens at high aging temperature, resulting in increasing the weight loss of the specimens. According to the DSC result, the glass transition temperature of DGEBA/D-230 and DGEBA/G-5022 samples war increased as the aging temperature increased, whereas the glass transition temperature of DGEBA/HN-2200 samples was constant above aging temperature of $150^{\circ}C$ and aging tine of 7 days. The SEM result indicated that the surface of DGEBA/G-5022 specimen showed more rough topography than that of DGEBA/D-230 or DGEBA/HN-2200 specimen after thermal aging. This could be correlated with the result of weight loss.

Electromagnetic Interference Shielding Effect of Fiber Reinforced Composites with Stainless Fiber Conductive Filler (스테인레스 섬유를 충전제로 사용한 섬유강화 복합재료의 전자파 차폐 효과)

  • Han, Gil-Young;Song, Dong-Han;Ahn, Dong-Gyu
    • Journal of the Korean Society for Precision Engineering
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    • v.27 no.7
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    • pp.71-78
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    • 2010
  • The objective of this research is to investigate the influence of material characteristic and design on to the electromagnetic interference (EMI) shielding characteristics. Basalt glass fiber reinforced composite specimens with stainless fiber conductive filler were manufactured to perform the electromagnetic interference shielding effectiveness(SE) experiments. In order to reflection and absorb the specimen in electromagnetic fields, flanged coaxial transmission line sample holder was fabricated according to ASTM D 4935-89. Electromagnetic shielding effectiveness(EMSE) was measured quantitatively to examine the electromagnetic shielding characteristics of designed specimens. The result of EMI shielding experiments showed that maximum EMSE value of sandwich type specimens with GSG(basalt glass fiber/stainless fiber/basalt glass fiber) and SGS(stainless fiber/basalt glass fiber/stainless fiber) were 65dB and 80dB at a frequency of 1,500MHz, respectively.

Wafer-Level Package of RF MEMS Switch using Au/Sn Eutectic Bonding and Glass Dry Etch (금/주석 공융점 접합과 유리 기판의 건식 식각을 이용한 고주파 MEMS 스위치의 기판 단위 실장)

  • Kang, Sung-Chan;Jang, Yeon-Su;Kim, Hyeon-Cheol;Chun, Kuk-Jin
    • Journal of Sensor Science and Technology
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    • v.20 no.1
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    • pp.58-63
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    • 2011
  • A low loss radio frequency(RF) micro electro mechanical systems(MEMS) switch driven by a low actuation voltage was designed for the development of a new RF MEMS switch. The RF MEMS switch should be encapsulated. The glass cap and fabricated RF MEMS switch were assembled by the Au/Sn eutectic bonding principle for wafer-level packaging. The through-vias on the glass substrate was made by the glass dry etching and Au electroplating process. The packaged RF MEMS switch had an actuation voltage of 12.5 V, an insertion loss below 0.25 dB, a return loss above 16.6 dB, and an isolation value above 41.4 dB at 6 GHz.

A Solid-state 27Al MAS and 3QMAS NMR Study of Basaltic and Phonolitic Silicate Glasses (현무암과 포놀라이트 비정질 규산염의 원자구조 차이에 대한 고상핵자기 공명 분광분석 연구)

  • Park, Sun Young;Lee, Sung Keun
    • Journal of the Mineralogical Society of Korea
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    • v.28 no.1
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    • pp.61-69
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    • 2015
  • While the macroscopic properties and eruption style of basaltic and phonolitic melts are different, the microscopic origins including atomic structures are not well understood. Here we report the atomic structure differences of glass in diopside-anorthite eutectic composition (basaltic glass) and phonolitic glass using high-resolution 1D and 2D solid-state Nuclear Magnetic Resonance (NMR). The $^{27}Al$ MAS NMR spectra for basaltic glass and phonolitic glass show that the full width at half maximum (FWHM) of Al for basaltic glass is about twice than phonolitic glass, suggesting the topological disorder of basaltic magma is larger than that of phonolitic magma. The $^{27}Al$ 3QMAS NMR spectra for basaltic glass and phonolite glass show much improved resolution than the 1D MAS NMR, resolving Al and Al. Approximately 3.3% of Al is observed for basaltic glass, demonstrating the configurational disorder of basaltic magma is larger than phonolitic magma. This result confirms that the topological disorder of Al in basaltic glass is larger than that of phonolitic glass. The observed structural differences between basaltic glass and phonolitic glass can provide an atomistic origin for change of the macroscopic properties with composition including viscosity.

Smart TR Glass and Service Imagenation (스마트 TR글래스와 서비스 상상)

  • D.M., Baek;T.Y., Kim
    • Electronics and Telecommunications Trends
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    • v.37 no.6
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    • pp.54-63
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    • 2022
  • This paper discusses service discoveries for smart trusted reality (TR) glass and networks developed by the Electronics and Telecommunications Research Institute. TR glass provides a differentiated gaze communication service from the well-known AR glass. Services include on-off of products that reach the eye, encryption of courier addresses, and time-based networking services. This paper addresses the technical roots and service scalability of TR glass. Furthermore, the agricultural sector was selected to provide microservices configuration, connectivity with 5G communication, and a full range of applications for extended services.

High Resolution System on Glass Displays

  • Okumura, Fujio
    • 한국정보디스플레이학회:학술대회논문집
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    • 2004.08a
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    • pp.119-123
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    • 2004
  • This paper describes low temperature poly-Si (LTPS) TFT system on glass (SOG) technology developed in NEC. High resolution SOG-LCDs such as a 230 ppi reflective type LCD, a 2.5", 333 ppi 2D/3D autostereoscopic LCD, and a 2.1" single voltage driven full integration LCD for mobile applications and a 0.9", XGA light valve for projectors are reviewed from the perspective of the high resolution technologies

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Micro drilling of glass by ECDM

  • Cao, X.D.;Choi, S.H.;Chung, D.K.;Kim, B.H.;Chu, C.N.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2007.06a
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    • pp.291-292
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    • 2007
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