Browse > Article

Effect of Thermal Aging Temperature on Weight Loss and Glass Transition Temperature of Epoxy Adhesives  

Park, Soo-Jin (Korea Research institute of Chemical Technology)
Kim, Jong-Hak (Korea Research institute of Chemical Technology)
Joo, Hyeok-Jong (Department of Polymer Science and Engineering, Chungnam National University)
Kim, Joon-Hyung (HS R & A Co. Ltd.)
Jin, Fan-Long (Korea Research institute of Chemical Technology)
Publication Information
Elastomers and Composites / v.41, no.1, 2006 , pp. 19-26 More about this Journal
Abstract
In this study, the effect of thermal aging temperature on the weight loss, glass transition temperature, and morphology of epoxy adhesives cured with amine (D-230), amide (G-5022), and anhydride (HN-2200) was investigated. As a result, the weight loss of three specimens was increased with increasing the thermal aging temperature. The result was attributed to the thermal aging which was occurred at the surface of adhesive specimens at high aging temperature, resulting in increasing the weight loss of the specimens. According to the DSC result, the glass transition temperature of DGEBA/D-230 and DGEBA/G-5022 samples war increased as the aging temperature increased, whereas the glass transition temperature of DGEBA/HN-2200 samples was constant above aging temperature of $150^{\circ}C$ and aging tine of 7 days. The SEM result indicated that the surface of DGEBA/G-5022 specimen showed more rough topography than that of DGEBA/D-230 or DGEBA/HN-2200 specimen after thermal aging. This could be correlated with the result of weight loss.
Keywords
epoxy resins; adhesive; thermal aging; weight loss; glass transition temperature;
Citations & Related Records
연도 인용수 순위
  • Reference
1 L. Barral, J. Cano, A. J. Lopez, J. L. Lopez, P. Nogueira, and C. Ramirez, 'Thermal Degradation of a Diglycidylether of Bisphenol A/1,3-bisarninomethylcyclohexane (DGEBA/1,3-BAC) Epoxy Resin System', Therrnochim Acta, 269/270, 253 (1995)   DOI   ScienceOn
2 S. J. Park and F. L. Jin, 'Thermal Stabilities and Dynamic Mechanical Properties of Sulfone-containing Epoxy Resin Cured with Anhydride', Polym. Degrad. Stab., 86, 515 (2004)   DOI   ScienceOn
3 C. Bockenheimer, D. Fata, and W. Possart, 'New Aspects of Aging in Epoxy Networkd. I. Thermal Aging', J. Appl. Polym. Sci., 91, 361 (2004)   DOI   ScienceOn
4 A. M. Matawie and E. M. Sadek, 'Adhesives and Coatings Based on Phenolic/epoxy Resins', Polym. Adv. Technol., 10, 223 (1999)   DOI   ScienceOn
5 J. H. Kim, K. Y. Choi, H. J. Joo, F. L. Jin, and S. J. Park, 'A Study on the Water Resistance and Thermo-mechanical Behaviors of Epoxy Adhesives', Elastomer, 40, 166 (2005)
6 R. S. Bauer, 'Epoxy Resin Chemistry', Advanced in Chemistry Series, No. 114, p. 1, American Chemical Society, Washington DC, 1979
7 C. A. May, 'Epoxy Resins, Chemistry and Technology', p. 1, Marcel Dekker, New York, 1988
8 S. J. Park, F. L. Jin, and J. S. Shin, 'Physicochemical and Mechanical Interfacial Properties of Trifluoromethyl Groups Containing Epoxy Resin Cured with Amine', Mater. Sci. Eng. A, 390, 240 (2005)   DOI
9 S. Kumagai, X. Wang, and N. Yoshimura, 'Thermal Aging, Water Absorption, and Their Multiple Effects on Tracking Resistance of Epoxy for Outdoor Use', Electr. Eng. JPN, 118-A, 1255 (2000)
10 J. Lukaszczyk and K. Jaszcz, 'Synthesis and Characteristics of Biodegradable Epoxy-Polyester Resins Cured with Glutaric Anhydride', Macromol. Chem. Phys., 230, 301 (2002)