• The Journal of Korean Academy of Prosthodontics
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• v.38 no.2
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• pp.226-241
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• 2000

Recently a new generation of crown and bridge veneering resins containing submicron glass fillers was introduced. These ultrasmall particle hybrid composite materials distinguish themselves, compared with conventional microfill crown and bridge resins, through improved mechanical properties. It is claimed that these composites are suitable for metal free crowns and even bridges using fiber reinforcement. The purpose of this study was to evaluate the effect of thermal cycling on the tensile strength of the following veneering composites: Artglass(Heraeus Kulzer Co., Wehrheim, Germany), Estonia(Kuraray Co.. Japan), Sculpture(Jeneric Pentron Co., Wallingford, U.S.A.), and Targis(Ivoclar Co., Schaan Liechenstein). According to manufacturer's instructions, rectangular tensile test specimens measuring $1.5{\times}2.0{\times}4.5mm$ were made using a teflon mold. Whole specimens were divided into two groups. One group was dried in a desiccator at $25^{\circ}C$ for 10 days, and another group was subjected to thermal cycling($10,000{\times}$) in water($5/55^{\circ}C$). All test specimens were placed in a universal testing machine and loaded until fracture with a crosshead speed of 0.5mm/min. Weibull analysis and Tukey's test were used to analyze the data. The fracture surfaces of specimens were observed in SEM and the aliphatic C=C absorbance peak of Estenia and Targis resin was analyzed using Fourier transform infrared(FTIR) spectroscopy. Within the limitations imposed in this study, the following conclusions can be drawn: 1. Both in drying condition and thermal cycling condition, the highest tensile strength was observed in Estenia testing group(p<0.05). 2. The strength data were at to single-mode Weibull distribution, and the Weibull modulus of all veneering composite resin specimens increased after thermal cycling treatment. 3. After thermal cycling test, the highest tensile strength was observed in the Estenia group, and the lowest value was observed in the Targis group. The tensile strength values showed the significant differences between each group(p<0.05) 4. The aliphatic C=C absorbance peak of Estonia and Targis resin was decreased after light curing, and there was no distinct change after thermal cycling.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.3
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• pp.43-49
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• 2016

Reliability characteristics of thin package-on-packages were evaluated using T/H (temperature/humidity) test at $85^{\circ}C/85%$ for 500 hours, TC (temperature cycling) test at $-40{\sim}100^{\circ}C$ for 1,000 cycles, and HTS (high temperature storage) test at $155^{\circ}C$ for 1,000 hours. The average resistance of the solder-bump circuitry between the top and bottom packages of 24 package-on-package (PoP) samples, which were processed using polyimide thermal tape, was $0.56{\pm}0.05{\Omega}$ and quite similar for all 24 samples. Open failure of solder joints did not occur after T/H test for 500 hours, TC test for 1,000 cycles, and HTS test for 1,000 hours, respectively.

• International Journal of Reliability and Applications
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• v.15 no.2
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• pp.125-150
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• 2014

Accelerated life tests (ALTs) are extensively used to determine the reliability of a product in a short period of time. Test units are subject to elevated stresses which yield quick failures. ALT can be carried out using constant-stress, step-stress, progressive-stress, cyclic-stress or random-stress loading and their various combinations. An ALT with linearly increasing stress is ramp-stress test. Much of the previous work on planning ALTs has focused on constant-stress, step-stress, ramp-stress schemes and their various combinations where the stress is generally increased. This paper presents an optimal design of ramp soak-stress ALT model which is based on the principle of Thermal cycling. Thermal cycling involves applying high and low temperatures repeatedly over time. The optimal plan consists in finding out relevant experimental variables, namely, stress rates and stress rate change points, by minimizing variance of reliability function with pre-specified mission time under normal operating conditions. The Burr type XII life distribution and time-censored data have been used for the purpose. Burr type XII life distribution has been found appropriate for accelerated life testing experiments. The method developed has been explained using a numerical example and sensitivity analysis carried out.

• Journal of the Korean Institute of Gas
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• v.16 no.1
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• pp.46-50
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• 2012

The performance of the Type3 hydrogen composite cylinder whose pressure is 70 MPa using hydrostatic cycling test equipment was evaluted in this study. It also includes the finite element method analysis on the performance of the cylinder when the pressure is applied. As a result, cylinder body parts of the Type3 hydrogen composite cylinder, which draws attention with its safe status and the lightness, was ruptured first and the same result has been found out through the finite element method. The dome knuckle and the cylinder body were proved as the weakest parts since the cylinder body parts was expanded under the pressure.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.351-354
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• 2000

AC impedance of LiM $n_2$ $O_4$ and LiM $g_{0.1}$M $n_{1.9}$ $O_4$ samples have been studied at various temperature with charge-discharge test. AC impedance of LiM $n_2$ $O_4$ measured at -2$0^{\circ}C$, room temperature and 5$0^{\circ}C$ revealed that initial impedance before charge-discharge test was gradually decreased and become small by becoming law temperature. It indicates that the Li ion diffusion and the transfer resistance of the cathode are related to the temperature of cycling. Impedance at high temperature was suddenly increased because Mn dissolution and decomposition of electrolyte had been increased during cycling, compared to impedance at low temperature. Therefore, charge-discharge capacity was suddenly decreased at high but was slowly at low. In LiM $g_{0.1}$M $n_{1.9}$ $O_4$, impedance and capacity were stability at room temperature than there at 5$0^{\circ}C$, too. Initial impedance at 5$0^{\circ}C$ before charge-discharge test was small and impedance was suddenly increased during cycling than that at room temperature.ure.ure.

• Korean Journal of Metals and Materials
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• v.49 no.12
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• pp.945-949
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• 2011

The cycling characteristics of $MgH_2$ made by hydriding chemical vapor deposition method have been investigated. The particle size of $MgH_2$ made by HCVD was about $1{\mu}m$. The cycling experiment was performed by measuring hydrogen quantity absorbed at 673 K and under 35 atm of hydrogen pressure for 30 min. Up to 3 cycles the hydrogen storage capacity increased, but from 4 to 6 cycles the hydrogen storage capacity decreased rapidly. During this cycling test the particle size increased gradually from $1{\mu}m$ to $6{\mu}m$. This increase was due to sintering by the high reaction temperature and the heat of reaction during hydrogen absorption. From 7 to 30 cycles, the hydrogen storage capacity was maintained at 5.8 wt%. Even after 30 cycles, the plateau pressure was constant.

• Composites Research
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• v.19 no.1
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• pp.22-28
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• 2006

In manufacturing process of composite cylinders with metal liner, the autofrettage process which induces compressive residual stress on the liner to improve cycling life can be applied. In this study, a finite element analysis technique is presented, which can predict accurately the compressive residual stress on the liner induced by autofrettage and stress behavior after. Material and geometrical non-linearity is considered in the finite element analysis, and the Von-Mises stress of a liner is introduced as a key parameter that determines pressure cycling life of composite cylinders. Presented methodology is verified through fatigue test of liner material and pressure cycling test of composite cylinders.

• Proceedings of the KIEE Conference
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• 2011.07a
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• pp.1318-1319
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• 2011

In this paper, we analyzed of growth and electrical characteristics of micro-cracks with thermal effect in PV module. The micro-cracks are increasing the breakage risk over the whole value chine from the wafer to the finished module, because the wafer or cell is exposed to mechanical stress. we experimentally analyze the direct impact of micro-cracks on the module power and the consequences after artificial aging. The first step, we made micro-cracks in PV module by mechanical load test according to IEC 61215. Next, PV modules applied the thermal cycling test, because microcracks accelerated aging by thermal cycling test. according to IEC61215. Before every test, we checked output and EL image of PV module.

• Journal of Fashion Business
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• v.26 no.6
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• pp.105-115
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• 2022

Wearing a mask is still advised since COVID-19 continues to spread. However, masks may also irritate the skin and cause mask acne, often known as "maskne", which is a type of acne mechanica caused by friction between the skin and clothing. Therefore, there is a need to develop an effective maskne cosmetic. In this study, we made the maskne cosmetics containing humulus lupulus extract and copper tripeptide-1 and investigated its stability and safety. To measure stability, a centrifugation test and heat-cool cycling were done, and changes in viscosity and pH were measured for 8 weeks. The Cumulative Irritation Test (CIT, WKIRB-202111-HR-096) was performed and positive reactions were determined by the ICDRG criteria. The results indicated that the samples were stable after centrifugation, temperature cycling, viscosity, and pH tests. In addition, cosmetic safety test results revealed that maskne cosmetics containing humulus lupulus extract and copper tripeptide-1 did not cause any skin responses. These findings indicate that prepared maskne cosmetics' stability and safety were comparable to those of currently available commercial cosmetics.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.40 no.3
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• pp.259-265
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• 2016

Recently, life prediction models for Pb-based and Pb-free solders used in chip resistor assemblies under thermal cycling have been introduced. The models suggest that the field lifetimes of Pb-free solders would be better than those of Pb-based solders when used for chip resistors under thermal cycling conditions, while the lifetime of the chip assemblies under accelerated test conditions show a reverse relationship. In this study, the prediction models were verified by applying the model to another research case. Finite element models were built, thermal cycling conditions were applied, and the energy densities were calculated. Finally, life prediction analysis was conducted for the cases where Pb-based and Pb-free solders were used. The prediction results were then compared with the test data of the case. It was verified that the predictions of the developed life cycle models are on the practical scale.