• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.11a
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• pp.319-320
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• 2007

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.1
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• pp.26-33
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• 2016

In this study, a new method to develop a fixed diamond wire for silicon wafer machining by the multi-wire cutting method was developed. The new twist diamond wire has improved performance with high breaking strength and chip flutes structure. According to these characteristics, the new twist diamond wire can be used in the higher speed multi-wire cutting process with a long lifetime. Except the design of the new structure, the twist diamond wire is coating by electroless-electroplating process. It is good for reducing breakage and the falling-off of diamond grains. Based on the silicon material removal mechanism and performance of the wire-cutting machine, the optimal processing condition of the new twist diamond wire has been derived via mathematical analysis. At last, through the tensile testing and the machining experiments, the performance of the twist diamond wire has been obtained to achieve the development goals and exceed the single diamond wire.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.535-540
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• 2011

It is well known that abrasive waterjet (AWJ) was developed as a kind of high-density energy processing technologies. AWJ is used to obtain cutting quality of various materials such as metal, ceramics, glass and composite materials within a short manufacturing time because of the characteristics of heatless and noncontact processing. However, surface roughness and dimension error like round, burr, taper vary severely according to the processing conditions such as pressure, cutting speed, orifice diameter, stand off distance and abrasive flow rate. In this paper, the effect of the shape of mixing chamber on surface quality is studied. Three types of mixing chamber - round, parabolic, elliptical - are suggested and each performance is compared to that of cylindrical mixing chamber experimentally. From the result, is proved to be the optimal mixing chamber in the aspect of surface quality the parabolic one.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.12
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• pp.5393-5397
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• 2011

The compressing-cutting device is used for manufacturing nano tube. the purpose of this study is to design and manufacture the compressing-cutting device witch has safety and stable performance. The most important core technology, in nano tube manufacturing, is to seam the each end of tube with appropriate pressure and to cut it off into the two part safely not to leak injected medium. Since the compressing pressure and the cutoff speed make the quality of nano tube, they are very important. This study will show the processes of design and manufacturing of compressing-cutting device.

• Journal of Korean Ophthalmic Optics Society
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• v.7 no.1
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• pp.35-38
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• 2002

Ferrite thin film with glass substrate was prepared by ferrite plating method in order to make sunglass which cut off ultraviolet and electromagnetic field. It has single phase of polycrystalline spinel structure and has gloss like as mirror and has hardness without scratch by scraping with nail. The transmittance of ferrite thin film is lowered near 400nm manifestly, which shows that the ferrite thin film was cut off ultraviolet successfully. Therefore, the sunglass with ferrite plating is use of cut of ultraviolet and electromagnetic field.

• Journal of the Korean Society for Precision Engineering
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• v.5 no.1
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• pp.71-77
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• 1988

This study applies dynamic deformation analysis to the rake face stress distribution of cemented carbide cut-off tools by turning, using a finite element method. The results are following: 1. The dynamic loaded state of a cut-off tool was very changeable for the first 0.6 seconds. Reaching the normal state, it became in active. 2. Chipping was influnced not only by the magnitude of stress but also by the abrupt change of tensile and compressive stresses. 3. The distribution chat of principal stress by dynamic load and the direction of resultant vector were almost constant regardless of load time.

• Journal of the Korea Concrete Institute
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• v.16 no.4 s.82
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• pp.493-500
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• 2004

FREP(Fiber Reinforced Epoxy Panel) are used for strengthening the damaged RC beams due to its good tensile strength, low weight, resistance to corrosion, and easy applicability. This study sets up structure equation for FREP bending reinforcement before and during the usage of RC beam. It finds the difference and finds the mechanical characteristics of rip-off failure that is caused by stress concentration in reinforcement material cutting part to estimate the performance of bending reinforcement. The result of this research can be summarized as two main consequences. The main failure of FREP reinforced concrete beam is rip-off failure and it evaluated rip-off failure of RC reinforcing bean based on the test and analytical conditions of this study. It found that stress was concentrated due to rapid change of bending rigidity in reinforced cutting part as a result of excessive reinforcement thickness of FREP. It resulted in rip-off failure. It means that it should evaluate the rip-off failure when designing reinforcement. It analyzed the reinforcement effect according to reinforced period for FREP. It found that reinforcement effect of P-Type that was reinforced during the usage decreased compared to I-Type that was reinforced before the usage. So when reinforcing a existing structure that is being used, it should consider the stress that is produced due to the fixed load.

• Journal of the Korean Institute of Gas
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• v.10 no.3 s.32
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• pp.54-59
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• 2006

A safety device with shut-off function was developed for preventing intentional accidents that might happen by separating of cutting hoses connected to pressure regulators used in residential LP gas facility. For the verification of function and field adaptability, the safety device with shut-off function was tested in the state of joining the device to the regulator and a field test was carried out at home. This study shows that, at the inlet pressure of 0.07-1.56 MPa, the device shuts off the gas within the 5m length of hose regardless of the installation condition of the regulator. The shut-off flow rate increases in the order of perpendicular upward, horizontal and perpendicular downward. From the results of the field tests carried out at home for 5 months, there appears no problem using a gas range or a boiler. If the developed shut-off device is commercialized and distributed in the market the intentional accidents occurred by cutting or separating hoses can be prevented remarkably.

• Transactions of Materials Processing
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• v.14 no.1 s.73
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• pp.37-42
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• 2005

In order to invstigate the influence of die design variables on the quality of the sheared surface in cutting of sandwich sheet metals, the cut-off operation is carried out, which is the typical shearing process in sheet metal forming technology. For experiments we made the cut-off die which can be easily adjusted for die design variables such as blankholding force, pad force and clearance. The sandwich sheet metals considered are clad304(STS304-Al1050-STS304) and anti-vibration sheet metal. The shearing process is visualized by the computer vision system installed in front of the cut-off die and the sheared surface is measured and quantitatively compared with the help of the optical microscope after cut-off operation. From test results it is shown that the shearing mechanisms are different according the material of which sandwitch sheet metal is composed. The influence of die design variable is explored and we found optimal conditions for both sandwich sheet metals. It is expected that this investigation can be utilized to get the better sheared surface.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.7
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• pp.76-81
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• 2011

A new via cutting structure in 2-layer DRAM package substrate has been fabricated to lower its power distribution network(PDN) impedance. In new structure, part of the via is cut off vertically and its remaining part is designed to connect directly with the bonding pad on the package substrate. These via structure and substrate design not only provide high routing density but also improve the PDN impedance by shortening effectively the path from bonding pad to VSSQ plane. An additional process is not necessary to fabricate the via cutting structure because its structure is completed at the same time during a process of window area formation. Also, burr occurrence is minimized by filling the via-hole inside with a solder resist. 3-dimensional electromagnetic field simulation and S-parameter measurement are carried out in order to validate the effects of via cutting structure and VDDQ/VSSQ placement on the PDN impedance. New DRAM package substrate has a superior PDN impedance with a wide frequency range. This result shows that via cutting structure and power/ground placement are effective in reducing the PDN impedance.