• Journal of the Korean Institute of Gas
• /
• v.15 no.6
• /
• pp.28-33
• /
• 2011

The purpose of this paper analyzes and studies to improve the failure cases on the computer that one of electronic control elements for engine in liquified petroleum gas vehicle. The first case, it certified the non-starting phenomenon of engine that it's electronic control unit didn't control the fuel for idle speed actuator because of no given action signal in slow-cut solenoid valve. The second case, it knew the bad condition phenomenon of engine and back-fire by the wire melting of ignition coil and firing of transistor being inside ECU. The third case, it certified the action stoping phenomenon of engine and malfunctioning signal for engine ECU because of leakage of current and an excess current by moisture inflowing inside ECU curcuit plate. Therefore, it is thought that will elevate the durability and reliability of engine computer throughout procure of quality.

• International Journal of Highway Engineering
• /
• v.11 no.2
• /
• pp.121-132
• /
• 2009

Thin bonded continuously reinforced concrete overlay(CRCO) was constructed on He existing jointed plain concrete pavement(HCP) surface at Seo-Hae-Ahn express highway in South Korea in order to evaluate its applicability and performance. Two sections of road were considered for this evaluation. In the first section, the concrete overlayer was placed and cut down to the existing layer to form transverse joints while CRCO was constructed on top of the existing layer in the second section. Early strength concrete(Type III) was utilized for both overlay sections. The depth of milling and the thickness of overlaid layer were 5 cm and 10 cm, respectively. Several vibrating wire gauges(VWG) were installed to evaluate the performance of CRCO with respect to curling, delamination, and crack propagation. As a result of the strength test, it was found that strength of the material reaches the design criteria within 1-3 days. Analysis with vibrating wire gauge(VWG) showed CRCO effectively restricts joint movement. High adhesive strength also was observed from the material regardless of length of aging. Meanwhile, transverse cracks were observed on the middle of the section where JPCP overlay was applied whereas arbitrarily cracks in transverse direction were observed on the section where CRCP was applied.

• Korean Journal of Materials Research
• /
• v.15 no.4
• /
• pp.240-245
• /
• 2005

An oxygen free copper was severely deformed by accumulative roll-bonding (ARB) process for improvement of its mechanical properties. Two copper sheets 1 m thick, 30 mm wide and 300 m long are first degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and roll-bonded by about $50\%$ reduction rolling without lubrication at ambient temperature. The bonded sheet is then cut to the two pieces of same dimensions and the same procedure was repeated to the sheets up to eight cycles $(\varepsilon-6.4)$. TEM observation revealed that ultrafine grains were developed after the third cycle, and their size was slightly increased at higher cycles. Tensile strength of the copper increased with the strain at low strain levels, but it hardly increased from 3 cycles $(\varepsilon>2.4)$ due to occurrence of dynamic recovery, even if the imposed strain increased.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2016.11a
• /
• pp.148-148
• /
• 2016

디스플레이 시장이 rigid에서 flexible로 변화하기 시작하면서 유연 투명전극 소재에 대한 수요가 증가하고 있다. 투명전극으로 대표되는 Indium Tin Oxide(ITO)는 고투과 저저항의 장점을 가지지만 유연성이 떨어져 이를 대체 할 투명전극 소재로 Metal mesh, Ag nano-wire, CNT, Graphene, Conductive polymer 등에 대한 응용 연구가 활발히 진행되고 있다. 본 연구에서는 Metal mesh 용 Cu thin film 형성을 위해 플라즈마 표면처리 기술로 플라스틱 기판과 Cu 박막 사이의 밀착력을 향상시키고자 공정 연구를 수행하였다. 고품질의 Cu thin film 제작을 위해 양산용 roll to roll 장비를 이용하였고, 선형이온소스를 적용하여 플라즈마 표면처리를 수행하였다. 이후 마그네트론 스퍼터링을 통해 Ni buffer layer 및 Cu 박막 증착 공정을 in-situ로 진행하였다. 이러한 공정을 통해 제작한 Cu thin film의 밀착력을 평가하기 위해 cross cut test(ASTM D3359)를 수행하였다. 그 결과 플라스틱 기판과 Cu 금속 박막 사이의 밀착력이 0B에서 5B까지 향상된 것을 확인하였고, 플라즈마 표면처리 공정을 통해서 저항 또한 감소되는 결과를 얻을 수 있었다. 본 연구를 통해 polyethylene terephthalate(PET)뿐만 아니라 polyimide(PI) 기판 상에서도 플라즈마 표면처리를 통해 금속 박막의 밀착력이 향상되는 결과를 확인하였으며, flexible copper clad laminate (FCCL) 같은 유연 정보 소자 분야에 응용 가능할 것으로 기대된다.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.05a
• /
• pp.1017-1020
• /
• 2002

The pure Ti is taken annealing process for one hour at 90$0^{\circ}C$. The pure Ti is sufficient for ASTM B348 Grade2. The rolling mill roll the Ti-8Ta-3Nb(wt%) which became vacuum melting in arc furnace until the length is about 45mm and the thickness is about 6.05mm. Then it is made 6mm$\times$6mm$\times$44mm by wire cutting with EDM and it is made ∮ 6mm by rough cutting with the general purpose lathe. The machining accuracy of implant parts in the dental and medical science are decided by dimension, shpe, straightness, surface roughness. It is difficult to cut for the Ti alloy. It is caused problems of straight degree and surface roughness to the Ti alloy have many cases which length is smaller than diameter in cutting. Total 24 specimens different kind of 4 alloies are used in experiment to gain a cutting property. According to the cutting velocity, cutting depth, cutting temperature, feed and clearance angle experiments are performed. Conclusively it is expected that cutting depth of 0.5mm, feed velocity of 0.07mm/rev and cutting velocity of 80m/min could make a suitable result.

• Food Science and Biotechnology
• /
• v.18 no.4
• /
• pp.948-953
• /
• 2009

Apple and apricot powders (APL-P and APR-P) were produced from apple and apricot fruits and they were used in cookie formulation at the levels of 10-40% (in flour bases). The APL-P and APR-P were rich in terms of total dietary fiber (TDF) and antioxidant power. The APR-P supplemented cookies had higher spread ratio and lower hardness values than the APL-P supplemented ones at all addition levels. The color values of the APR-P supplemented cookies were all acceptable. Overall sensory scores of the cookies supplemented with APL-P and APR-P were not significantly different from the control up to 20% addition. TDF contents of the supplemented cookies increased significantly with increasing addition level (p<0.01). The replacement of flour by APL-P and APR-P in wire-cut cookies showed that the physical characteristics and textural properties of the cookies were significantly affected (p<0.01) and APR-P appeared to be a more suitable replacer of flour than APL-P. Addition of both fruit powders upto 20% into the cookie formulation were evaluated as acceptable in terms of the sensory properties.

• Journal of the Korea Academia-Industrial cooperation Society
• /
• v.7 no.4
• /
• pp.545-549
• /
• 2006

W-EDM is generally used to manufacture punches and die plates from among press mold parts. Before W-EDM was used, however, punches and die plates manufactured via mechanical processing were used to manufacture products, with the die life of the mold expiring after 2,000,000~2,300,000 products have been manufactured. When the mold manufactured through W-EDM was used, however, its service life expired only after 700,000~800,000 products have been manufactured. Since this was attributed to the deformed layer formed after using W-EDM, the surfaces before and after W-EDM was used were scanned using SEM to verify the occurrence of such layer. This study sought to come up with a method of eliminating such phenomenon.

• Korean Journal of Materials Research
• /
• v.16 no.9
• /
• pp.592-597
• /
• 2006

A deoxidized low-phosphorous (DLP) copper was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two copper sheets 1 mm thick, 30 mm wide and 300 mm long are first degreased and wire-brushed for sound bonding. The sheets are then stacked to each other, and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet is then cut to the two pieces of same dimensions and the same procedure was repeated to the sheets up to eight cycles (${\varepsilon}{\sim}6.3$). TEM observation revealed that ultrafine grains were developed after the 4th cycle, and their size decreased at higher cycles. Tensile strength of the copper increased with the equivalent strain, and it reached 547 MPa which was 3 times higher than that of the initial material. It is concluded that the ARB process is an effective method for high strengthening of the DLP copper.

• The Transactions of The Korean Institute of Electrical Engineers
• /
• v.64 no.1
• /
• pp.182-187
• /
• 2015

In the three-phase power system, when any one-phase or two-phases is open-phase, the unbalanced current flows and the single-phase power supplies to three-phase loads. Specially, motor coil and transformer coil receive over-current. As a result, great damage as well as electrical fire can occur to the power system. In order to improve these problems, this paper proposes that an open-phase detection device is designed by a new algorithm using electric potential difference between the resultant voltage of neutral point and ground, and a control circuit topology of open-phase protector is composed of highly efficient semiconductor devices. It improves response speed and reliability. The control algorithm circuit also operates the cut-off of a conventional residual current protective device (RCD) which flows an enforced leakage current to ground wire at open-phase accident. Furthermore, time delay circuit is added to prevent the incapable operation of open-phase protector about instantaneous open-phase not open-phase fault. The time delay circuit improves more reliability.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.26 no.1
• /
• pp.1-15
• /
• 2015

In this invited paper, the authors give an overview of the new design technology for a metallic backplane-less metamaterial(MM) absorber and discuss a selection of examples. In contrast to a common MM absorber structure, the metallic pattern layer of the presented structure is placed facing toward the incident wave propagation direction to reduce the radar cross section(RCS) due to the metallic pattern itself at frequencies other than the targeted absorption frequency bands. The ability of the MM backplane-less absorber to exhibit broadband absorption performance and irregular surface applications will be discussed.