• Journal of the Korean Recycled Construction Resources Institute
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• 제5권1호
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• pp.21-28
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• 2017

The steel-plate concrete(SC) is used in a form of module assembly construction in the outer wall of nuclear-power plant and LNG containment. Since the steel-plate concrete modules are generally manufactured from the plant, the weight of SC has significantly effect on the total construction cost in the aspect of shipment. Therefore, the use of lightweight aggregates concrete(LWAC), which fill the inside of SC module can be a solution. However, the amount of used lightweight aggregates(LWA) is limited in the use of current concrete mixing process due to the concrete quality problems and it also determines the allowable minimum density of LWAC. In this research, the preplaced casting method is applied because of increasing the volume fraction of LWA significantly, which results from the producing process of pre-packing the LWA in the formwork and filling the interstitial voids between LWA using cement paste grout. The density and compressive strength of selected preplaced LWAC were $1,600kg/m^3$ and 30MPa and it was applied for the mock-up specimens of SC panel. It was used for the 3-point bending test for evaluating its structural performance. The results show that the preplaced LWAC can reduce the density of concrete with the adequate mechanical and structural performance.

• Journal of Korea Society of Industrial Information Systems
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• 제23권3호
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• pp.25-34
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• 2018

This paper presents a heating source of carbon nanofibers for the efficiency and the drying performance of laundry dryer, and focuses on the applicability-evaluation of its source. To design the proposed heating module, experiments were conducted in terms of surface temperature and surface temperature distribution characteristics of carbon nanofiber lamps. The surface temperature of the lamps increased linearly with increment of a current to flow a lamp and revealing the increasing pattern as the length of the ramps is shorter. The proposed heating source was evaluated based on drying efficiency, moisture evaporation rate at laundry, and internal temperature of a drum during drying process. The drying efficiency satisfied a 45% which is specified in KS C 9319. The moisture evaporation rate and the internal temperature of the drum were respectively 98.88% and $61.1^{\circ}C$, which are similar to that of S's company dryer. From the evaluation and actual drying test results, the proposed carbon nanofiber lamp heating module is considered to be applicable as a heat source for laundry dryer in terms of drying efficiency and drying performance. it is possible to obtain a heat source at a high temperature, an excellent calorific value, an improvement in drying performance, and an effect of sterilizing laundry due to the emission of far-infrared rays. In addition to the applicability, the difference of the drying efficiency between the dryers was analyzed in detail based on the power consumption of the heat sources.

• Journal of Astronomy and Space Sciences
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• 제17권1호
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• pp.53-66
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• 2000

We developed low light CCD imaging system using thermoelectric cooling method collaboration with a company to design a commercial model. It consists of Kodak KAF-0401E(768$\times$512 pixels) CCD chip, thermoelectric module manufactured by Thermotek. This TEC system can reach an operative temperature of $-25^{\circ}C$. We employed an Uniblitz VS25s shutter and it has capability a minimum exposure time 80ms. The system components are an interface card using a Korea Astronomy Observatory (hereafter KAO) ISA bus controller, image acquisition with AD9816 chip, that is 12bit video processor. The performance test with this imaging system showed good operation within the initial specification of our design. It shows a dark current less than 0.4e-/pixel/sec at a temperature of $-10^{\circ}C$, a linearity 99.9$\pm$0.1%, gain 4.24e-/adu, and system noise is 25.3e-(rms). For low temperature CCD operation, we designed a TEC, which uses a one-stage peltier module and forced air heat exchanger. This TEC imaging system enables accurate photometry($\pm$0.01mag) even though the CCD is not at 'conventional' cryogenic temperatures(140k). The system can be a useful instrument for any other imaging applications. Finally, with this system, we obtained several images of astronomical objects for system performance tests.

• Journal of the Microelectronics and Packaging Society
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• 제21권4호
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• The Journal of Korean Institute of Communications and Information Sciences
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• 제31권8A호
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• pp.820-829
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• 2006

IP-based design methodology has been popularly employed for SoC design to reduce design complexity and to cope with time-to-market pressure. Due to the request for high performance of current mobile systems, embedded SoC design needs a multi-processor to manage problems of high complexity and the data processing such as multimedia, DMB and image processing in real time. Interface module for communication between system buses and processors are required, since many IPs employ different protocols. High performance processors require interface module to minimize the latency of data transmission during read-write operation and to enhance the performance of a top level system. This paper proposes an automatic interface generation system based on FSM generated from the common protocol description sequence of a bus and an IP. The proposed interface does not use a buffer which stores data temporally causing the data transmission latency. Experimental results show that the area of the interface circuits generated by the proposed system is reduced by 48.5% on the average, when comparing to buffer-based interface circuits. Data transmission latency is reduced by 59.1% for single data transfer and by 13.3% for burst mode data transfer. By using the proposed system, it becomes possible to generate a high performance interface circuit automatically.

• Journal of The Korean Association For Science Education
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• 제19권2호
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• pp.340-352
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• 1999

Constructivist theory and teaching science in the social context are a main stream in science education. This study was purposed to introduce the STS in-service program implementing in Chonnam National University. and to analyze the results of the program in terms of changes of teachers' and students' perceptions and attitudes. The major features of the STS in-service program were as follows: teacher-centered. teaching in the social context. emphasis on constructivist approach. development of STS module and implementations. A total of 20 secondary science teachers participated in the in-service program. and filled out two questionnaires. Science Education Reform Inventory and Constructivist Teachings Survey. Three of the 20 teachers were selected to gain information from their implementations of a STS module into their respective classrooms. The students completed two instruments. Constructivist Learning Environment Survey. and Scientific Attitude Survey. The responses from teachers and students are as follows: 1. The participating teachers were very aware of the necessity of reform in science education. and the degree of the perception of the necessity increased after the STS in-service program. 2. The STS program significantly improved constructivist teaching techniques. 3. The perceptions of the students about constructivist learning environments improved significantly after the STS in-service program. 4. Students' scientific attitudes improved significantly through STS approach. The STS in-service program with the above mentioned features was found to be effective in our current school system. and could be implemented successfully if teachers were willing to learn and participate in the reforms of science education.

• Journal of the Microelectronics and Packaging Society
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• 제24권1호
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• pp.103-111
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• 2017

In this study, the thermomechanical stress and fatigue analysis of a high voltage and high current (3,300 V/1200 A) insulated gate bipolar transistor (IGBT) module used for electric locomotive applications were performed under thermal cycling condition. Especially, the reliability of the copper wire and the ribbon wire were compared with that of the conventional aluminum wire. The copper wire showed three times higher stress than the aluminum wire. The ribbon type wire showed a higher stress than the circular type wire, and the copper ribbon wire showed the highest stress. The fatigue analysis results of the chip solder connecting the chip and the direct bond copper (DBC) indicated that the crack of the solder mainly occurred at the outer edge of the solder. In case of the circular wire, cracking of the solder occurred at 35,000 thermal cycles, and the crack area in the copper wire was larger than that of the aluminum wire. On the other hand, when the ribbon wire was used, the crack area was smaller than that of the circular wire. In case of the solder existing between DBC and base plate, the crack growth rate was similar regardless of the material and shape of the wire. However, cracking occurred earlier than chip solder, and more than half of the solder was failed at 40,000 cycles. Therefore, it is expected that the reliability of the solder between DBC and base plate would be worse than the chip solder.

• Journal of IKEEE
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• 제21권4호
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• pp.368-374
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• 2017

In this Paper, we developed a low power type LED security light using LED lighting that substitutes a 220[V] commercial power source for a solar cell module instead of a halogen or a sodium lamp. in addition, a PWM type drive control circuit is designed to minimize the heat generation problem and the drive current of the LED drive controller. in developed system, The light efficiency measurement value is 93.6[lm/W], and a high precision temperature sensor is used inside the controller to control the heat generation of the LED lamp. In order to eliminate the high heat generated from the LED lamp, it is designed to disperse quickly into the atmosphere through the metal insertion type heat sink. The heat control range of LED lighting was $50-55[^{\circ}C]$. The luminous flux and the lighting speed of the LED security lamp were 0.5[s], and the beam diffusion angle of the LED lamp was about $110[^{\circ}C]$ by the light distribution curve based on the height of 6[m].

• Journal of rehabilitation welfare engineering & assistive technology
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• 제10권3호
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• pp.237-242
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• 2016

The major advantage of slip-ring technology in Spiral CT is that it facilitates continuous rotation of the x-ray tube, so that volume data can be acquired from a patient quickly. Not only for such a fast scan, but also for the dose reduction purpose, high signal-to-noise ratio and fast data acquisition system is required. In this study, we have built a multi-channel photodetector and multi-channel data acquisition system for CT application. The detector module consisted of CdWO4 crystal and Si photodiode in 16 channels. For the performance test of the preamplifier stage, both the transimpedance and switched integrator types are optimized for the photodetector modules. Switched integrator showed better noise performance in the limited bandwidth which is suitable for the current CT application. The control sequence for data acquisition and 20 bit ADC is designed with VHDL(Very High Speed Integrated Circuit Hardware Description Language) and implemented on FPGA(Field Programmable Gate Array) chip. Our Si photodiode detector module coupled to CdWO4 crystal showed comparable signal with other commercially available photodiode for CT. Switched integrator type showed higher SNR but narrower bandwidth compared to transimpedance preamplifier. Digital hardware is designed by FPGA, so that the control signal could be redesigned without hardware alteration.

• The Journal of Korean Institute of Communications and Information Sciences
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• 제22권12호
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• pp.2674-2685
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• 1997

In this paper, the design and imprlementation of dual-band power amplifier which is used as a critical part for mobile phone to be simultaneously working at a dual band, 800MHz CDAM and PCS frequency band is described. DC operating point of power FET is limited to Class-B to enable long talk time considering that the tyupical power range of CDMA phones in working is around 10 to Class-B to enable long talk time considering that the typical power range of CDMA phones in working is around 10 to 15dBm, i.e., liner range. The power amplifier which employs two GaAs FETs with good linerity at a low operating point has duplexer cuplexer circuit to separate two frequency bands at input and output stage. Electromagnetic analysis for via holes and coupling between narrow transmission lines is included to design a circuit. Moduld size of 0.96CC($22{\times}14.5{\times}3mm^3$) and maximum module current of 130mA at output power range, 10 to 15dBm are attained. The power amplifer module has achieved ACPR performance with 2 to 3dB marging from IS-95 requirement at output powers, 23.5dBm for PCS and 28dBm for 800MHz CDMA respectively.