• Composites Research
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• v.29 no.6
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• pp.395-400
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• 2016

Recently, many research groups have studied on the epoxy-based multifunctional electrolyte to develop the structural composite bearing high mechanical properties without sacrificing the ionic conductivity at the same time. The studies on the optimal content and material selection for structural electrolyte have been published, while its curing behavior has not much analyzed yet. In this study, epoxy-based structural electrolyte containing solid electrolyte was prepared by varying the curing temperature and time. In addition, the ionic conductivities and mechanical properties of specimens were measured. We also find out the optimal hardening condition where the epoxy domain enables to be hardened within the range of temperature at which the thermal decomposition of electrolyte does not occur. Finally, we propose the multifunctional structural electrolyte showing achievable electrical and mechanical properties (282 MPa and $9{\times}10^{-6}S/cm@25^{\circ}C$).

• Polymer(Korea)
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• v.25 no.1
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• pp.15-24
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• 2001

In this study, the effects of different glycol molar ratios of unsaturated polyester(UPE) resins on the curing behaviors were investigated. The cross linking process was checked or monitored by differential scanning calorimetry(DSC) and by viscoelastic properties of rigid-body pendulum model. The knife-edge from which the pendulum is suspended, is immersed in a reaction mixture, and the change of the viscoelastic behavior brings on those of the period(T) and logarithmic decrement(${\Delta}$) of the damped free oscillations of the pendulum. The values of T and ${\Delta}$ obtained are related to the dynamic modulus(E') and modulus loss(E'). The information on the viscoelastic behavior of unsaturated polyester(UPE) resins during the curing process are shown to illustrate the usefulness of the techniques. As the content of NPG in a propylene glycol(PG)/NPG glycol mixture increased, both the cycle time during cure and the change of damping during cure of UPE resin decreased.

• Korean Journal of Materials Research
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• v.20 no.12
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• ETRI Journal
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• v.38 no.6
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• pp.1179-1189
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• 2016

A chemorheological analysis of a no-flow underfill was conducted using curing kinetics through isothermal and dynamic differential scanning calorimetry, viscosity measurement, and solder (Sn/27In/54Bi, melting temperature of $86^{\circ}C$) wetting observations. The analysis used an epoxy system with an anhydride curing agent and carboxyl fluxing capability to remove oxide on the surface of a metal filler. A curing kinetic of the no-flow underfill with a processing temperature of $130^{\circ}C$ was successfully completed using phenomenological models such as autocatalytic and nth-order models. Temperature-dependent kinetic parameters were identified within a temperature range of $125^{\circ}C$ to $135^{\circ}C$. The phenomenon of solder wetting was visually observed using an optical microscope, and the conversion and viscosity at the moment of solder wetting were quantitatively investigated. It is expected that the curing kinetics and rheological property of a no-flow underfill can be adopted in arbitrary processing applications.

• Journal of the Korean Applied Science and Technology
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• v.18 no.1
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• pp.29-39
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• 2001

An acrylic resin was synthesized with several monomers, styrene(St), 2-hydroxyethyl methacrylate(2-HEMA), n-butyl acrylate, methyl methacrylate, and acetoacetoxyethl methacrylate(AAEM) to prepare a high-solid coatings. Then, a high-solid acryl/melamine coatings was prepared by curing the acrylic resin with a curing agent, hexamethoxymethylmelamine(HMMM). The curing behavior of the acrylic resin with HMMM was investigated by the Ozawa method using DSC. For AAEM/HMMM and 2-HEMA/HMMM curing reactions, activation energies were 33.01 and 27.12 kcal/mol and frequency factors were $9.54{\times}10^{15}}$ and 1.53{\times}10^{13} $min^{-1}$, respectively. From the results, it was found out that 2-HEMA showed higher reactivity with the curing agent than AAEM.

• Computers and Concrete
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• v.19 no.4
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• pp.429-434
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• 2017

Failure of basic structures material is usually accompanied by expansion of interior cracks due to stress concentration at the cracks tip. This phenomenon shows the importance of examination of the failure behavior of concrete structures. To this end, 4 types of mortar samples with different amounts of nano-silica (0%, 0.5%, 1%, and 1.5%) were made to prepare twelve $50{\times}50{\times}50mm$ cubic samples. The goal of this study was to describe the failure and micro-crack growth behavior of the cement mortars in presence of nano-silica particles and control mortars during different curing days. Failure of mortar samples under compressive strength were sensed with acoustic emission technique (AET) at different curing days. It was concluded that the addition of nano-silica particles could modify failure and micro-crack growth behavior of mortar samples. Also, monitoring of acoustic emission parameters exposed differences in failure behavior due to the addition of the nanoparticles. Mortar samples of nano-silica particles revealed stronger shear mode characteristics than those without nanoparticles, which revealed high acoustic activity due to heterogeneous matrix. It is worth mentioning that the highest compressive strength for 3 and 7 test ages obtained from samples with the addition of 1.5% nano-silica particles. On the other hand maximum compressive strength of 28 curing days obtained from samples with 1% combination of nano-silica particles.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1398-1401
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• 2006

Silver paste curing process is very important in LCoS panel manufacture because incomplete curing process will cause poor bonding strength and increase resistance. The imperfection situation results in poor reliability and the variation of the common voltage, respectively. The change of the common voltage causes image flicker. According to Kinetics, we acquire activation energy by using dynamic DSC and compare two kinds of silver paste. From the result of isothermal DSC, we get optimum curing parameters to solve the flicker problem caused of incomplete curing of the silver paste.

• Proceedings of the KACD Conference
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• 2001.11a
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• pp.579-579
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• 2001

One of the most important factors for the clinical success of adhesive posterior restorations is marginal adaptation. This property is very closely related to mechanical properties and to the shrinkage behavior of composite materials. Most of modem composite materials are light-cured. This is why the first part of this lecture will be confined to our recent research on light curing, such as plasma polymerization, LED polymerization and the power of modem halogen lamps. In the second part of the lecture the shrinkage properties such as dimensional shrinkage and shrinkage forces of different light curing materials and during different curing procedures will be discussed. Finally, in the third part of the lecture, marginal adaptation before and after loading in different cavity classes and by using different restorative techniques and curing procedures will be presented. Data will also be given on wear resistance, abrasiveness against opposing cusps and postcuring of composite materials.(omitted)

• Design & Manufacturing
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• v.17 no.2
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• pp.27-32
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• 2023

Liquid silicon rubber (LSR) has fine thermal compatibility and is widely used in various fields such as medical care and automobiles because it is easy to implement products with good fluidity. With the recent development of flexible sensors, the focus has been on manufacturing conductive elastomers, such as silicone as elastic materials, and carbon black, CNT, and graphene are mainly used as nanomaterials that impart conductive phases. In this study, mechanical behavior and curing behavior were measured and analyzed to manufacture a CB-LSR complex by adding Carbon Black to LSR and to identify properties. As a result of the compression test, the elastic modulus tended to increase as carbon black was added. When the swelling test and the compression set test were conducted, the swelling rate tended to decrease as the content of carbon black increased, and the compression set tended to increase. In addition, DSC measurements showed that the total amount of reaction heat increased slightly as the carbon black content increased. It is considered that carbon black was involved in the crosslinking of LSR to increase the crosslinking density and have a positive effect on oil resistance reinforcement.

• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.44-51
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• 2020

The basic catalyst 1-benzyl-3-methyl-imidazolium hexafluoroantimonate (BMH) was synthesized and analyzed by FT-IR and ¹H-NMR. A crystalized biphenyl-based epoxy was synthesized by using tetramethyl biphenol (TMBP) and epichlorohdrine. In order to consider the curing tendency of the synthesized BMH, the mass ratio was changed to 0.5, 1.0, 2.0 wt.% under heated conditions and the curing tendency was analyzed by differential scanning calorimeter (DSC). As a result, the BMH catalyst showed a fast curing result in the stepwise heating pr℃ess of the biphenol-A epoxy and the cationic polymer. From these results, the BMH catalyst showed excellent thermal stability as a potential heat curing catalyst. In addition, we considered the application possibility of epoxy molding compound (EMC) which required a skeleton structure and a high heat resistance because the synthesized biphenyl epoxy had a characteristic of rapidly lowering viscosity at a constant temperature and a rigid skeleton structure of biphenol. As a result, it was confirmed that the TMBP-based epoxy developed in this study was composed of a crystalline structure, and a curing reaction was observed with a Novolac resin at a high temperature. In the presence of a catalyst, a curing reaction was observed around 150 ℃ and thus TMBP-based epoxy was successfully applied as a raw material of EMC.