Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications |
Eom, Yong-Sung
(ICT Material & Components Research Laboratory, ETRI)
Son, Ji-Hye (ICT Material & Components Research Laboratory, ETRI) Bae, Hyun-Cheol (ICT Material & Components Research Laboratory, ETRI) Choi, Kwang-Seong (ICT Material & Components Research Laboratory, ETRI) Lee, Jin-Ho (ICT Material & Components Research Laboratory, ETRI) |
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