• 제목/요약/키워드: Cure behavior

검색결과 171건 처리시간 0.025초

열기계적 분석법으로 측정된 레진 포뮬레이션의 경화 수축 특성 (Cure Shrinkage Characteristics of Resin Formulations by Thermomechanical Analysis)

  • 서안나;이종현
    • 대한금속재료학회지
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    • 제50권9호
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    • pp.629-636
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    • 2012
  • Volume shrinkage behavior accompanying the cure of resin formulations might be a critical factor when assembly processes using polymer materials are considered. In this study, cure shrinkage behavior with respect to resin formulation type and heating method was measured on sandwich structure samples by a thermomechanical analyzer (TMA). Quartz, used as a cover material for the sandwich structure, indicated the coefficient of thermal expansion close to $0ppm/^{\circ}C$. When a dynamic heating mode was conducted, a squeeze-out region and a cross-linking region for each resin formulation could be separated clearly with overlapping differential scanning calorimeter results on the TMA results. In addition, a cure shrinkage dominant region and a thermal expansion dominant region in the cross-linking region were distinguished. Consequently, the degree of cure at the initiation of the thermal expansion dominant region was successfully measured. Measurement of all resin formulations indicated the thermal expansion behavior exceeded cure shrinkage before full cure.

저온 경화형 에폭시 매트릭스 수지의 경화거동 및 화학유변학에 대한 연구 (Cure Behavior and Chemorheology of Low Temperature Cure Epoxy Matrix Resin)

  • 나효열;염효열;윤병철;이성재
    • 폴리머
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    • 제38권2호
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    • pp.171-179
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    • 2014
  • 우수한 성능을 지닌 대형 구조의 섬유강화 고분자(FRP) 복합재료 제품을 제조하기 위해 저온 경화형 프리프레그 개발이 활발히 진행되고 있다. 본 연구에서는 저온 경화형 프리프레그 제조에 적합한 매트릭스 수지를 확보하기 위하여 에폭시 수지, 경화제, 경화 촉진제로 구성된 저온 경화형 에폭시 수지 조성물의 경화거동 및 화학유변학을 고찰하였다. 경화반응 특성은 시차주사열량분석법과 유변물성측정법을 활용하여 승온 및 등온 조건에서 분석하였다. 연구 결과 매트릭스 수지로 제안된 저온 경화형 에폭시 수지 조성물은 $80^{\circ}C$에서 3시간에 경화시킬 수 있었고, 80과 $90^{\circ}C$에서의 젤화 시간은 각각 120분과 20분인 것으로 나타났다. 저온 경화형 수지를 경화시킨 수지 경화물의 열적, 기계적 물성은 고온 경화형 수지 경화물의 물성과 거의 동등하였다.

In Situ Detection of the Onset of Phase Separation and Gelation in Epoxy/Anhydride/Thermoplastic Blends

  • Choe, Young-Son;Kim, Min-Young;Kim, Won-Ho
    • Macromolecular Research
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    • 제11권4호
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    • pp.267-272
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    • 2003
  • The isothermal cure reactions of blends of epoxy (DGEBA, diglycidyl ether of bisphenol A)/anhydride resin with polyamide copolymer (poly(dimmer acid-co-alkyl polyamine)) or PEI were studied using differential scanning calorimetry (DSC). Rheological measurements have been made to investigate the viscosity and mechanical relaxation behavior of the blends. The reaction rate and the final cure conversion were decreased with increasing the amount of thermoplastics in the blends. Lower values of final cure conversions in the epoxy/thermoplastic blends indicate that thermoplastics hinder the cure reaction between the epoxy and the curing agent. Complete miscibility was observed in the uncured blends of epoxy/thermoplastics up to $120^{\circ}C$ but phase separations occurred in the early stages of the curing process at higher temperatures than $120^{\circ}C$. According to the rheological measurement results, a rise of G' and G" at the onset of phase separation is seen. A rise of G' and G" is not observed for neat epoxy system since no phase separation is seen during cure reaction. At the onset of phase separation the rheological behavior was influenced by the amount of thermoplastics in the epoxy/thermoplastic blends, and the onset of phase separation can be detected by rheological measurements.

고출력 LED 인캡슐런트용 실리콘 레진의 경화공정중 잔류응력 발달에 대한 유한요소해석 (Finite Element Analysis of Residual Stress Evolution during Cure Process of Silicone Resin for High-power LED Encapsulant)

  • 송민재;김흥규;강정진;김권희
    • 한국정밀공학회지
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    • 제28권2호
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    • pp.219-225
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    • 2011
  • Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.

Effects of Carbon Black Content and Vulcanization Type on Cure Characteristics and Dynamic Mechanical Property of Styrene-Butadiene Rubber Compound

  • Changwoon Nah;Kim, Wan-Doo;Lee, Seag
    • Macromolecular Research
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    • 제9권3호
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    • pp.157-163
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    • 2001
  • The influences of carbon black loading and cure type on the cure characteristics including kinetics and dynamic mechanical properties were investigated for a styrene-butadiene rubber (SBR). The rate constants of accelerated sulfur vulcanization reaction at three different temperatures were determined using a cure rheometer, and they were compared with those from the direct measurement of sulfur concentration. The strain softening behavior under dynamic deformation, known as the Payne effect was also discussed depending on the carbon black loading and cure type.

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에폭시/PMR-15 폴리이미드 블렌드계의 경화동력학 및 열안정성에 관한 연구 (Studies on Cure Behavior and Thermal Stability of Epoxy/PMR-15 Polyimide Blend System)

  • Lee, Jae-Rock;Lee, Hwa-Young;Park, Soo-Jin
    • 한국복합재료학회:학술대회논문집
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    • 한국복합재료학회 2002년도 추계학술발표대회 논문집
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    • pp.265-268
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    • 2002
  • In this work, the blend system of epoxy and PMR-15 polyimide is investigated in terms of the cure behaviors and thermal stabilities. The cure behaviors are studied in DSC measurements and thermal stabilities are also carried out by TGA analysis. DDM (4, 4'-diamino diphenyl methane) is used as curing agent for EP and the content of PMR-15 is varied within 0, 5, 10, 35, and 20 phr to neat EP. As a result, the cure activation energy ($E_a$) is increased at 10 phr of PMR-15, compared with that of neat EP. From the TGA results of EP/PMR-15 blend system, the thermal stabilities based in the initial decomposed temperature (IDT) and integral procedural decomposition temperature (IPDT) are increased with increasing the PMR-15 content. The fracture toughness, measured in the context of critical stress intensity factor ($K_{IC}$) and critical strain energy release rate ($G_{IC}$), shows a similar behavior with $E_a$. This result is probably due to the crosslinking developed by the interactions between intermolecules in the polymer chains.

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폐 EPDM 고무의 재활용을 위한 기초적 연구 (A Study on Recycling of EPDM Reclaimed Rubber)

  • 장두희;김지훈;김영주
    • 한국환경과학회지
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    • 제19권3호
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    • pp.365-370
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    • 2010
  • In this study, we carried out the evaluation of EPDM(Ethylene Propylene Diene Monomer) reclaimed rubber mixing with natural rubber at various mixing ratio to reuse as rubber filler. The scorch time and moony viscosity was analyzed to evaluate the effect of cure behavior. And also, we analyzed the tensile strength, the elongation at break and cure time to evaluate the variation of cure behavior. As the results, the scorch time and optimal cure time was decreased according to the increasing of EPDM reclaimed rubber. However, the moony viscosity was increased at each mixing ratio. In case of the added EPDM reclaimed rubber was 20 phr(parts by weight per 100 parts by weight of rubber), the hardness and specific gravity was increased a little. The hardness and specific gravity was increased in rapidly under 40 phr of the added EPEM reclaimed rubber. The tensile strength and elongation at break of the compound of natural and EPDM reclaimed rubber was rapidly decreased compared with its natural rubber when the ratio of adding EPDM reclaimed rubber was over 40 phr.

이중사출 성형을 위한 저온 경화 액상실리콘고무 (LSR)의 경화 거동 분석 (Analysis of cure behavior of low temperature curing liquid silicone rubber (LSR) for multi-material injection molding)

  • 유형민
    • Design & Manufacturing
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    • 제17권1호
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    • pp.1-5
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    • 2023
  • In multi-material injection molding, since two or more materials with different process conditions are used, it is essential to maximize process efficiency by operating the cooling or heating system to a minimum. In this study, Liquid silicone rubber (LSR) that can be cured at a low temperature suitable for the multi-material injection molding was selected and the cure behavior according to the process conditions was analyzed through differential scanning calorimetry (DSC). Dynamic measurement results of DSC with different heating rate were obtained, and through this, the total heat of reaction when the LSR was completely cured was calculated. Isothermal measurement results of DSC were derived for 60 minutes at each temperature from 80 ℃ to 110 ℃ at 10 ℃ intervals, and the final degree of cure at each temperature was calculated based on the total heat of reaction identified from the Dynamic DSC measurement results. As the result, it was found that when the temperature is lowered, the curing start time and the time required for the curing reaction increase, but at a temperature of 90 ℃ or higher, LSR can secure a degree of cure of 80% or more. However, at 80 ℃., it was found that not only had a relatively low degree of curing of about 60%, but also significantly increased the curing start time. In addition, in the case of 110 ℃, the parameters were derived from experimental result using the Kamal kinetic model.

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형광분석기를 이용한 에폭시-산무수물계의 경화 모니터링 (Cure Monitoring of Am Epoxy-Anhydride System by Means of Fluorescence Spectroscopy)

  • 조동환;김득수;이종근
    • 폴리머
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    • 제25권2호
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    • pp.199-207
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    • 2001
  • 본 연구에서는 경화촉진제로서 N,N-dimethyl benzyl amine (BDMA) 또는 1-cyanoethyl-2-ethyl-4-methyl imidazole (2E4MZ-CN)을 포함하고 있는 산무수물계 경화제에 의한 diglycidyl ether of bisphenol-A (DGEBA)의 경화거동을 형광분석기를 사용하여 광물리적 특성 변화의 관점에서 해석하였다. 이를 위해 1,3-bis-(1-pyrene)propane (BPP) probe를 에폭시수지 내에 균일하게 도입시켰다. 주위 환경 겔화에 의한 분자의 공간구조 변화에 민감한 BPP probe는 분자내 여기체 형광을 잘 형성하였으며 에폭시수지의 경화반응에 따른 미세점도 변화 또는 분자의 움직임에 민감하였다. 에폭시수지의 경화거동은 경화시간, 경화온도 및 경화촉진제의 종류에 따른 단량체 형광세기 ($I_{M}$ ), 여기체 형광세기 ($I_{E}$ ) 그리고 $I_{M}$ /$I_{E}$ 값의 변화로부터 설명되었다. 그 결과는 이전의 DSC 또는 torsion pendulum을 이용하여 에폭시-산무수물계에 대하여 얻어진 경화거동 결과와 일치하였다. 또한, 형광분석 방법은 다른 분석 방법에서 해석이 어려운 저온영역에서의 열경화성 수지의 경화거동에 대한 정보를 제시하였다.

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