• Title/Summary/Keyword: Cure Process

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Experiment and Numerical Study on Thermal Characteristics of UV-NIL Process Considering the Cure Kinetics of Photo-polymer (레진의 경화 반응을 고려한 UV-NIL공정의 열특성에 관한 실험 및 수치해석 연구)

  • Kim, Woo-Song;Park, Gyeong-Seo;Nam, Jin-Hyun;Yim, Hong-Jae;Jang, Si-Yeol;Lee, Kee-Sung;Jeong, Jay;Lim, Si-Hyeong;Shin, Dong-Hoon
    • Proceedings of the KSME Conference
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    • 2008.11a
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    • pp.1847-1850
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    • 2008
  • The process conditions during ultraviolet nanoimprint lithography (UV-NIL) process such as temperature, stamping pressure, UV irradiation, etc. are effective factors for successful imprinting of complex and fine patterns. In this study, the effects of aluminum mold on the thermal characteristics of UV-NIL process were investigated through imprinting experiments and numerical simulations. The temperature of polymer resin on mold was measured to study thermal characteristics during UV curing. From the experimental and numerical results, the importance of curing reaction control for UV-NIL process was discussed for deformation characteristics.

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Ceramic Stereolithography: Additive Manufacturing for 3D Complex Ceramic Structures

  • Bae, Chang-Jun;Ramachandran, Arathi;Chung, Kyeongwoon;Park, Sujin
    • Journal of the Korean Ceramic Society
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    • v.54 no.6
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    • pp.470-477
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    • 2017
  • Ceramic processing to fabricate 3D complex ceramic structures is crucial for structural, energy, environmental, and biomedical applications. A unique process is ceramic stereolithography, which builds ceramic green objects from CAD files from many thin liquid layers of powder in monomer, which are solidified by polymerization with a UV laser, thereby "writing" the design for each slice. This approach directly writes layers in liquid ceramic suspension and allows one to fabricate ceramic parts and products having more accurate, complex geometries and smooth surfaces. In this paper, both UV curable materials and processes are presented. We focus on the basic material principles associated with free radical polymerization and rheological behavior, cure depth and broadening of cured lines, scattering at ceramic interface and their corresponding simulation. The immediate potentials for ceramic AM to change industry fabrication are also highlighted.

A Study on Effects of the Cure Pressure for the Improvement of the Electrical Performance of the Sandwich Type Radome (샌드위치형 레이돔의 전기적 성능개선 위한 성형압력 영향성 연구)

  • Lee, Sang-Min;Seo, Hyun-Soo;Hong, Jun-Pyo
    • Journal of Korean Society for Quality Management
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    • v.43 no.3
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    • pp.299-312
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    • 2015
  • Purpose: This paper analyzes the phenomenon on the degradation of the electrical performance by the pressure in the manufacturing process of sandwich type radomes. Methods: This paper consists of two steps to analyze the relation between the electrical performance and the pressure. First, the thickness of the core of the flat panels which were fabricated with different pressure was measured with the microscope, and then the electrical performance of the flat panels was analyzed with simulation and experiment. Based on the results of the electrical performance and the measured thickness with respect to the flat panels, the relation between the electrical performance and the applied pressure in the manufacturing process was analyzed. Results: The simulated and measured results with respect to the flat panel shows that the high pressure results in the nonuniform thickness of the core, which is applied to the radome fabrication. As a result, the degradation of the electrical performance occurs because the unintended scattered field is generated as the electromagnetic wave transmits (or impinges upon) the radome. Furthermore, we observed that the electrical performance of both the flat panel and the radome got worse as the high pressure was applied. Conclusion: Through simulation and experiment, therefore, it is demonstrated that for the high pressure in the manufacturing process the nonuniform thickness of the core increases and results in the degradation of the electrical performance of the radome.

Thermal Deformation Analysis of L-shaped Composite During Cure Process by Viscoelastic Model (점탄성을 고려한 L-형상 복합재료 성형시 열변형 해석)

  • Seong, Dong-Yun;Kim, Wie-Dae
    • Composites Research
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    • v.33 no.4
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    • pp.220-227
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    • 2020
  • When curing the composite, the fibers have little thermal deformation, but the resin changes its properties with time and temperature, which leads to residual stress in the product. Residual stress is caused by the difference in the coefficient of thermal expansion of the fibers and resin during the curing process and the chemical shrinkage of the resin. This difference causes thermal deformation such as spring-in and warpage. Thermal deformation of composite structure is important issue on quality of product, and it should be considered in manufacturing process. In this study, a subroutine was developed to predict thermal deformation by applying 3-D viscoelastic model. The finite element analysis was verified by comparing the results of the plate analysis of the 2-D viscoelastic model. Spring-in of L-shaped structure was predicted and analyzed by applying the 3-D viscoelastic model.

Improving the Color Fastness of the Madder Extract on Tencel Nonwoven (인도 꼭두서니로 염색한 텐셀 부직포의 염색 견뢰도 향상에 관한 연구)

  • Lee, Bum Hoon
    • Textile Coloration and Finishing
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    • v.31 no.4
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    • pp.241-248
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    • 2019
  • In this study, improving the wash and rubbing fastness of a natural coloring matter from Madder extract dyed on Tencel nonwoven. The cationic finishing agent(RBP), nonionic finishing agent(HPX) and mordant(PAW) were used to improving the color fastness. The two types(exhaustion and pad-dry-cure) finishing process were investigated with various finishing agent concentration. The color strength, wash and rubbing fastness of Tencel nonwoven dyed with Madder extract have been evaluated by various dye concentration and finishing agent. The exhaustion process treated with the cationic finishing agent(RBP) was effective to improving washing and rubbing fastness.

A Study on the Pultrusion Process of Thermosetting Composites Considering Thermally induced Deformation (열변형을 고려한 열경화성수지 복합재료의 펄트루젼 공정에 관한연구)

  • 김대환;이우일
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 1999.04a
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    • pp.103-108
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    • 1999
  • A synthesized model of pultrusion process considering thermally induced deformatiion was established. The model was composed of liquid resin flow model thermo-chemical analysis and linear elastic analysis. in order to verify the above-mentioned models several experiments were performed. A laboratory scale pultrusion line was established and glass/polyester composites were fabricated. the experimental results were compared with the calculated ones. The model successfully could estimate degree of cure pulling force and amount of process-induced deformation.

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A study on the drawing device and curing mold in CFRP rectangular pipe pultrusion process using a closed impregnation method (밀폐형 함침법을 이용한 CFRP 사각 파이프 인발성형에서 인발장치 및 경화금형에 관한 연구)

  • Kang, Byung-Soo;Yoo, Hyeong-Min
    • Design & Manufacturing
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    • v.16 no.2
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    • pp.60-65
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    • 2022
  • In the pultrusion process for the CFRP (Carbon fiber reinforced plastic) rectangular pipe, the drawing device is eseential which can continuously produces products and draws the carbon fiber tow. In addition, since the degree of cure changes depending on the temperature and the temperature ditribution of the curing mold changes depending on the pultrusion speed, the temperature distribution of the curing mold under certain conditions must be studied before processing. In this study, in the pultrusion process using a closed impregnation method, which has several advantages compared to the general pultrusion process using a open bath impregnation method, the drawing force required to pull the carbon fiber tows and the temperature distribution of the curing mold was analyzed to design the drawing device and the curing mold efficiently.

Thermal Curing Behavior and Tensile Properties of Resole Phenol-Formaldehyde Resin/Clay/Cellulose Nanocomposite

  • Park, Byung-Dae;Kadla, John F.
    • Journal of the Korean Wood Science and Technology
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    • v.40 no.2
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    • pp.110-122
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    • 2012
  • This study investigated the effects of layered clay on the thermal curing behavior and tensile properties of resole phenol-formaldehyde (PF) resin/clay/cellulose nanocomposites. The thermal curing behavior of the nanocomposite was characterized using conventional differential scanning calorimetry (DSC) and temperature modulated (TMDSC). The addition of clay was found to accelerate resin curing, as measured by peak temperature ($T_p$) and heat of reaction (${\Delta}H$) of the nanocomposite’ curing reaction increasing clay addition decreased $T_p$ with a minimum at 3~5% clay. However, the reversing heat flow and heat capacity showed that the clay addition up to 3% delayed the vitrification process of the resole PF resin in the nanocomposite, indicating an inhibition effect of the clay on curing in the later stages of the reaction. Three different methods were employed to determineactivation energies for the curing reaction of the nanocomposite. Both the Ozawa and Kissinger methods showed the lowest activation energy (E) at 3% clay content. Using the isoconversional method, the activation energy ($E_{\alpha}$) as a function of the degree of conversion was measured and showed that as the degree of cure increased, the $E_{\alpha}$ showed a gradual decrease, and gave the lowest value at 3% nanoclay. The addition of clay improved the tensile strengths of the nanocomposites, although a slight decrease in the elongation at break was observed as the clay content increased. These results demonstrated that the addition of clay to resole PF resins accelerate the curing behavior of the nanocomposites with an optimum level of 3% clay based on the balance between the cure kinetics and tensile properties.

Papers : Simultaneous Monitoring of Strain and Temperature During and After Cure of Unsymmetric Cross - ply Composite Laminate Using Fiber Optic Sensors (논문 : 비대칭 직교적층 복합재료 적층판의 성형시 및 성형후 광섬유 센서를 이용한 변형률 및 온도의 동시 모니터링)

  • Gang,Hyeon-Gyu;Gang,Dong-Hun;Hong,Chang-Seon;Kim,Cheon-Gon
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.30 no.1
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    • pp.49-55
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    • 2002
  • In this paper, we present the simulation monitoring of strain and temperature during and after the cure of unsymmetric composite laminate using fiber optic sensors. Fiber Bragg grating/extrinsic Fabry-Perot interferometric (FBG/EFPI) hybrid sensors are used to measure those measurands. The characteristic matrix of the sensor is analytically derived and measurements can be done without sensor calibration. A wavelength-swept fiber laser is utilised as a lighr source. Two FBG/EFPI sensors are embedded in a graphite/epoxy unsymmetric cross-ply composite laminate in different directions and different locations. We perform a real time monitoring of fabrication strains and temperatures at two points of the composite laminate during cure process in an autoclave. Also, the thermal strains and temperatures of the fabricated laminate are measured in a thermal chamber. Through these experiments, we can provide a basis for the efficient smart processing of composite and know the thermal behavior of unsymmetric cross-ply composite laminate.

Fracture Toughness Measurement of the Semiconductor Encapsulant EMC and It's Application to Package (반도체 봉지수지의 파괴 인성치 측정 및 패키지 적용)

  • 김경섭;신영의;장의구
    • Electrical & Electronic Materials
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    • v.10 no.6
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    • pp.519-527
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    • 1997
  • The micro crack was occurred where the stress concentrated by the thermal stress which was induced during the cooling period after molding process or by the various reliability tests. In order to estimate the possibility of development from inside micro crack to outside fracture, the fracture toughness of EMC should be measured under the various applicable condition. But study was conducted very rarely for the above area. In order to provide a was to decide the fracture resistance of EMC (Epoxy Molding Compound) of plastic package which is produced by using transfer molding method, measuring fracture is studied. The specimens were made with various EMC material. The diverse combination of test conditions, such as different temperature, temperature /humidity conditions, different filler shapes, and post cure treatment, were tried to examine the effects of environmental condition on the fracture toughness. This study proposed a way which could improve the reliability of LOC(Lead On Chip) type package by comparing the measured $J_{IC}$ of EMC and the calculated J-integral value from FEM(Finite Element Method). The measured $K_{IC}$ value of EMC above glass transition temperature dropped sharply as the temperature increased. The $K_{IC}$ was observed to be higher before the post cure treatment than after the post cure treatment. The change of $J_{IC}$ was significant by time change. J-integral was calculated to have maximum value the angle of the direction of fracture at the lead tip was 0 degree in SOJ package and -30 degree in TSOP package. The results FEM simulation were well agreed with the results of measurement within 5% tolerance. The package crack was proved to be affected more by the structure than by the composing material of package. The structure and the composing material are the variables to reduce the package crack.ack.

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