Effects of Cu Concentration on the Intermetallic Formation between Sn-Cu Solder and Ni Foil during Aging (시효시 Cu 함량이 Sn-Cu 솔더와 Ni Foil사이의 금속간화합물 형성에 미치는 영향)
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- Proceedings of the Materials Research Society of Korea Conference
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- 2002.11a
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- pp.102-102
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- 2002