• Title/Summary/Keyword: CuO particles

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Effect of Brownian Motion in Heat Transfer of H2O-Cu Nanofluid using LBM

  • Li, Kui-Ming;Lee, Yeon-Won
    • Journal of Advanced Marine Engineering and Technology
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    • v.34 no.7
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    • pp.981-990
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    • 2010
  • The main objective of this study is to investigate the fluid flow and the heat transfer characteristics of nanofluids using multi-phase thermal LBM and to realize theenhancement of heat transfer characteristics considered in the Brownian motion. In multi-phase, fluid component($H_2O$) is driven by Boussinesq approximation, and nanoparticles component by the external force gravity and buoyancy. The effect of Brownian motion as a random movement is modified to the internal velocity of nanoparticles(Cu). Simultaneously, the particles of both the phases assume the local equilibrium temperature after each collision. It has been observed that when simulating $H_2O$-Cu nanoparticles, the heat transfer is the highest, at the particle volume fraction 0.5% of the particle diameter 10 nm. The average Nusselt number is increased approximately by 33% at the particle volume fraction 0.5% of the particle diameter 10 nm when compared with pure water.

Preparation of High Tc YBa2Cu3O7-x Powders by Citrate and Nitrate Processes (Citrate, Nitrate Process에 의한 YBa2Cu3O7-x초전도 분말합성)

  • 박수련;김윤호
    • Journal of the Korean Ceramic Society
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    • v.26 no.2
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    • pp.221-227
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    • 1989
  • To investigate the development and densification YBa2Cu3O7-x(1-2-3) superconducting phase, the 1-2-3 phase powders have been prepared by citrate and nitrate processes with changing calcination temperature. Nearly pure 1-2-3 phase peaks have been obtained by calcining the precursor in air at 90$0^{\circ}C$ for 2.5h in citrate process but at 95$0^{\circ}C$ for 2.5h in nitrate process. The sintering density of citrate derived sample calcined at 80$0^{\circ}C$ has been about 4% higher than that calcined at 90$0^{\circ}C$, although the compacting density has been lower at 80$0^{\circ}C$ calcination. This can be explained that the 1-2-3 phase particles formed at 80$0^{\circ}C$ have reactive sub-micron size which has good sinterbililty.

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Gas Sensing Behaviors of SnO2:Cu Nanostructures for CH4, CH3CH2CH3 Gas (SnO2:Cu 나노 구조물의 CH4, CH3CH2CH3 가스 감응 특성)

  • Lee, Ji-Young;Yu, Yoon-Sic;Yu, Il
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.25 no.12
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    • pp.974-978
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    • 2012
  • The effect of Cu coating on the sensing properties of nano $SnO_2:Cu$ based sensors for the $CH_4$, $CH_3CH_2CH_3$ gas was studied. This work was focussed on investigating the change of sensitivity of nano $SnO_2:Cu$ based sensors for $CH_4$, $CH_3CH_2CH_3$ gas by Cu coating. Nano sized $SnO_2$ powders were prepared by solution reduction method using stannous chloride($SnCl_2{\cdot}2H_2O$), hydrazine($N_2H_2$) and NaOH and subsequent heat treatment. XRD patterns showed that nano $SnO_2$ powders with rutile structure were grown with (110), (101), (211) dominant peak. The particle size of nano $SnO_2:Cu$ powders at 8 wt% Cu was about 50 nm. $SnO_2$ particles were found to contain many pores, according to SEM analysis. The sensitivity of nano $SnO_2:Cu$ based sensors was measured for 5 ppm $CH_4$ gas and $CH_3CH_2CH_3$ gas at room temperature by comparing the resistance in air with that in target gases. The sensitivity for both $CH_4$ and $CH_3CH_2CH_3$ gases was improved by Cu coating on the nano $SnO_2$ surface. The response time and recovery time of the $SnO_2:Cu$ gas sensors for the $CH_4$ and $CH_3CH_2CH_3$ gases were 18~20 seconds, and 13~15 seconds, respectively.

Theoretical Analysis of Heat Pipe Thermal Performance According to Nanofluid Properties (나노유체 특성에 따른 히트파이프 성능해석)

  • Lim, Seung Min
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.39 no.7
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    • pp.599-607
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    • 2015
  • In this study, we theoretically investigate the thermal performances of heat pipes that have different nano-fluid properties. Two different types of nano-particles have been used: $Al_2O_3$ and CuO. The thermal performances of the heat pipes are observed for varying nano-particle aggregations and volume fractions. Both the viscosity and the conductivity increase as the volume fraction and the aggregation increase, respectively. Increasing the volume fraction helps increase the capillary limit in the well-dispersed condition. Whereas, the capillary limit is decreased under the aggregate condition, when the volume fraction increases. The dependence of the heat pipe thermal resistance on the volume fraction, aggregation, and conductivity of the nano-particles is analyzed. The maximum thermal transfer of the heat pipe is highly dependent on the volume fraction because of the high permeability of the heat pipe. For the proposed heat pipe, the optimum volume fraction of the nano-particle can be seen through 3D graphics.

Effect of Ball-milling Time on Reduction Behavior in Mechanochemical Process for Preparation of W-Cu Composite Powders (W-Cu 복합분말의 제조를 위한 기계화학적 공정에서 볼 밀링 시간에 따른 환원거동)

  • Kim, Dae-Gun;Lee, Kang-Won;Suk, Myung-Jin;Kim, Young-Do
    • Korean Journal of Materials Research
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    • v.13 no.3
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    • pp.169-173
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    • 2003
  • W-Cu composite powders can be prepared by mechanochemical process, where the $WO_3$-CuO composite powders were mechanically synthesized from the elemental oxide powders and subsequently reduced to W-Cu composite powders. In the present work, reduction behavior of$ WO_3$-CuO composite powders that were synthesized at different milling time was examined in terms of hygrometric analysis. In case of $WO_3$-CuO ball-milled for 20 h, the reaction temperature of CuO\longrightarrowCu became lower than in case of 1 h. Also, the reaction of $WO_3$\longrightarrow$WO_{2.9-2.72}$ and $WO_{2.9-2.72}$ \longrightarrow$WO_2$were shifted to lower temperatures and the peaks were changed to much sharper shape. While the reaction of $WO_2$\longrightarrowW in case of ball-milling for 20 h started at lower temperature, the peak temperature was the same as in 1 h ball-milling. The reduced W particle size was somewhat finer fer 20 h ball-milling. It was considered that the refinement of oxide particles caused by ball-milling process leads to such a change in the reduction behavior.

Effect of Plasma Etching and $PdCl_2/SnCl_2$ Catalyzation on the Performance of Electroless Plated Copper Layer (플라즈마 에칭 및 $PdCl_2/SnCl_2$ 촉매조건이 무전해 동도금 피막의 성능에 미치는 영향)

  • 오경화;김동준;김성훈
    • Journal of the Korean Society of Clothing and Textiles
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    • v.27 no.7
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    • pp.843-850
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    • 2003
  • Cu/PET film composites were prepared by electroless copper plating method. In order to improve adhesion between electroless plated Cu layer and polyester (PET) film, the effect of pretreatment conditions such as etching method, mixed catalyst composition were investigated. Chemical etching and plasma treatment increased surface roughness in decreasing order of Ar>HCl>O$_2$>NH$_3$. However, adhesion of Cu layer on PET film increased in the following order: $O_2$<Ar<HCl<NH$_3$. It indicated that appropriate surface roughness and introduction of affinitive functional group with Pd were key factors of improving adhesion of Cu layer. PET film was more finely etched by HCI tolution, resulting in an improvement in adhesion between Cu layer and PET film. Plasma treatment with NH$_3$produced nitrogen atoms on PET film, which enhances chemisorption of Pd$^{2+}$ on PET film, resulting in improved adhesion and shielding effectiveness of Cu layer deposited on the Pd catalyzed surface. Surface morphology of Cu plated PET film revealed that Pd/Sn colloidal particles became more evenly distributed in the smaller size by increasing the molar ratio of PdCl$_2$; SnCl$_2$from 1 : 4 to 1 : 16. With increasing the molar ratio of mixed catalyst, adhesion and shielding effectiveness of Cu plated PET film were increased.d.

A Study on the Seed Step-coverage Enhancement Process (SSEP) of High Aspect Ratio Through Silicon Via (TSV) Using Pd/Cu/PVP Colloids (Pd/Cu/PVP 콜로이드를 이용한 고종횡비 실리콘 관통전극 내 구리씨앗층의 단차피복도 개선에 관한 연구)

  • Lee, Dongryul;Lee, Yugin;Kim, Hyung-Jong;Lee, Min Hyung
    • Journal of the Korean institute of surface engineering
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    • v.47 no.2
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    • pp.68-74
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    • 2014
  • The seed step-coverage enhancement process (SSEP) using Pd/Cu/PVP colloids was investigated for the filling of through silicon via (TSV) without void. TEM analysis showed that the Pd/Cu nano-particles were well dispersed in aqueous solution with the average diameter of 6.18 nm. This Pd/Cu nano-particles were uniformly deposited on the substrate of Si/$SiO_2$/Ti wafer using electrophoresis with the high frequency Alternating Current (AC). After electroless Cu deposition on the substrate treated with Pd/Cu/PVP colloids, the adhesive property between deposited Cu layer and substrate was evaluated. The Cu deposit obtained by SSEP with Pd/Cu/PVP colloids showed superior adhesion property to that on Pd ion catalyst-treated substrate. Finally, by implementing the SSEP using Pd/Cu/PVP colloids, we achieved 700% improvement of step coverage of Cu seed layer compared to PVD process, resulting in void-free filling in high aspect ratio TSV.

Controlling the secondary phase of BSCCO 2223 tapes by thermal slide heat treatment(TSHT)

  • Park, Sung-Chang;Yoo, Jai-Moo;Ko, Jae-Woong;Kim, Young-Kuk;Kim, Cheol-Jin
    • Progress in Superconductivity and Cryogenics
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    • v.5 no.1
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    • pp.40-43
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    • 2003
  • The phase transformation, variation of secondary phase, and critical current density $(J_c) for (Bi,Pb)_2Sr_2Ca_2Cu_3O_10 (2223)$ tapes have been studied through the thermal slide heat treatment (TSHT) process. This process consists of a multiple variations of oxygen partial pressures and temperatures at the initial heat treatment During the initial heat treatment some secondary phase such as $(Ca,Sr)_2CuO_3(2/1 AEC), (Ca,Sr)_{14}Cu_{24}O_{41} (14/24 AEC), and (Bi,Pb)_2Sr_2CuO_y$(2201, amorphous phase) farm in Bi-2223 tapes, especially at the 2223 grain boundaries. These secondary phases are detrimental to the phase transformation and final properties. In order to control the secondary phase in Bi-2223 tapes the amount and size of secondary phases among the TSHT process were observed. The results indicate that the amount and particle size of AEC particles were smaller when the TSHT process was used than when the normal process at the initial heat treatment was used which results in the improved $J_c$ properties after the final process.

Growth of Copper Oxide Thin Films Deposited by Ultrasonic-Assisted Spray Pyrolysis Deposition Method (초음파 분무 열분해법을 이용한 구리산화물 박막 성장)

  • Han, In Sub;Park, Il-Kyu
    • Korean Journal of Materials Research
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    • v.28 no.9
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    • pp.516-521
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    • 2018
  • Copper oxide thin films are deposited using an ultrasonic-assisted spray pyrolysis deposition (SPD) system. To investigate the effect of substrate temperature and incorporation of a chelating agent on the growth of copper oxide thin films, the structural and optical properites of the copper oxide thin films are analyzed by X-ray diffraction (XRD), field-emssion scanning electron microscopy (FE-SEM), and UV-Vis spectrophotometry. At a temperature of less than $350^{\circ}C$, three-dimensional structures consisting of cube-shaped $Cu_2O$ are formed, while spherical small particles of the CuO phase are formed at a temperature higher than $400^{\circ}C$ due to a Volmer-Weber growth mode on the silicon substrate. As a chelating agent was added to the source solutions, two-dimensional $Cu_2O$ thin films are preferentially deposited at a temperature less than $300^{\circ}C$, and the CuO thin film is formed even at a temperature less than $350^{\circ}C$. Therefore the structure and crystalline phase of the copper oxide is shown to be controllable.

Study on the Properties of Catalase Activity Using Cuprite Nano-Particles Synthesized by Hydrolysis Method (가수분해법에 의해 제조된 아산화구리 나노분말을 이용한 과산화수소 탈수 연구)

  • Uhm, Y.-R.;Kim, W.-W.;Oh, J.-S.;Rhee, C.-K.
    • Journal of Powder Materials
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    • v.12 no.1
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    • pp.51-55
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    • 2005
  • $Cu_2O$ nano cubes with high catalase activity were synthesized by reduction of freshly prepared Cu in distilled water at $40^{\circC}$ and their catalase activities of $H_2O_2$ were studied. Transmission electron microscopy (TEM) observation showed that most of these nanocubes were uniform in size, with the average edge length of 30 nm. Selected area electron diffraction of TEM revealed that the nanocube consisted of single crystalline $Cu_2O$, but it changed to CuO phase. The catalase activity depends on the amount of both cuprite phase and surface area.